COOLER
PROBLEM TO BE SOLVED: To provide a cooler in which the temperature of the heat receiving surface of a heat receiving section can be made uniform.SOLUTION: A cooler (100) has a cooling structure (5) and a connection pipe structure (11) for connecting more than one cooling structures (5). The cooling...
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| creator | OTAKA MIKIO |
| description | PROBLEM TO BE SOLVED: To provide a cooler in which the temperature of the heat receiving surface of a heat receiving section can be made uniform.SOLUTION: A cooler (100) has a cooling structure (5) and a connection pipe structure (11) for connecting more than one cooling structures (5). The cooling structures (5) has a first passage (52) and a second passage (53) laminated via a bulkhead (54). The connection pipe structure (11) has a partition part (43)internally, and has a two passage pipe structure (4) having two passages (41, 42). In the cooling structure (5), each bulkhead (54) is connected with the connection hole of the two passage pipe structure (4) in parallel with the partition part (43), so that the fluids in the two passages (41, 42) are not mixed. A baffle plate (3) is connected with respective ends of the two passage pipe structure (4), so that the flow of the first passage (52) becomes opposite direction to that of the second passage (53).SELECTED DRAWING: Figure 2
【課題】受熱部の受熱面の温度を均温化しうる冷却装置を提供する。【解決手段】冷却装置（１００）は、冷却構造体（５）と冷却構造体（５）を２本以上接続するための接続パイプ構造体（１１）とを有している。冷却構造体（５）は隔壁部（５４）を介して積層された第１通路（５２）及び第２通路（５３）を有している。接続パイプ構造体（１１）は、内部に仕切部（４３）を有し、２通路（４１、４２）を有する２通路パイプ構造体（４）を有している。冷却構造体（５）は、２通路パイプ構造体（４）の接続穴に、各々の隔壁部（５４）が仕切部（４３）と平行に、２通路（４１、４２）の流体が混合しないように接続されている。バッフルプレート（３）は、２通路パイプ構造体（４）のそれぞれの端部に、第１通路（５２）の流れが第２通路（５３）と反対方向になるように接続されている。【選択図】図２ |
| format | Patent |
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【課題】受熱部の受熱面の温度を均温化しうる冷却装置を提供する。【解決手段】冷却装置（１００）は、冷却構造体（５）と冷却構造体（５）を２本以上接続するための接続パイプ構造体（１１）とを有している。冷却構造体（５）は隔壁部（５４）を介して積層された第１通路（５２）及び第２通路（５３）を有している。接続パイプ構造体（１１）は、内部に仕切部（４３）を有し、２通路（４１、４２）を有する２通路パイプ構造体（４）を有している。冷却構造体（５）は、２通路パイプ構造体（４）の接続穴に、各々の隔壁部（５４）が仕切部（４３）と平行に、２通路（４１、４２）の流体が混合しないように接続されている。バッフルプレート（３）は、２通路パイプ構造体（４）のそれぞれの端部に、第１通路（５２）の流れが第２通路（５３）と反対方向になるように接続されている。【選択図】図２</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180719&DB=EPODOC&CC=JP&NR=2018113445A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180719&DB=EPODOC&CC=JP&NR=2018113445A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OTAKA MIKIO</creatorcontrib><title>COOLER</title><description>PROBLEM TO BE SOLVED: To provide a cooler in which the temperature of the heat receiving surface of a heat receiving section can be made uniform.SOLUTION: A cooler (100) has a cooling structure (5) and a connection pipe structure (11) for connecting more than one cooling structures (5). The cooling structures (5) has a first passage (52) and a second passage (53) laminated via a bulkhead (54). The connection pipe structure (11) has a partition part (43)internally, and has a two passage pipe structure (4) having two passages (41, 42). In the cooling structure (5), each bulkhead (54) is connected with the connection hole of the two passage pipe structure (4) in parallel with the partition part (43), so that the fluids in the two passages (41, 42) are not mixed. A baffle plate (3) is connected with respective ends of the two passage pipe structure (4), so that the flow of the first passage (52) becomes opposite direction to that of the second passage (53).SELECTED DRAWING: Figure 2
【課題】受熱部の受熱面の温度を均温化しうる冷却装置を提供する。【解決手段】冷却装置（１００）は、冷却構造体（５）と冷却構造体（５）を２本以上接続するための接続パイプ構造体（１１）とを有している。冷却構造体（５）は隔壁部（５４）を介して積層された第１通路（５２）及び第２通路（５３）を有している。接続パイプ構造体（１１）は、内部に仕切部（４３）を有し、２通路（４１、４２）を有する２通路パイプ構造体（４）を有している。冷却構造体（５）は、２通路パイプ構造体（４）の接続穴に、各々の隔壁部（５４）が仕切部（４３）と平行に、２通路（４１、４２）の流体が混合しないように接続されている。バッフルプレート（３）は、２通路パイプ構造体（４）のそれぞれの端部に、第１通路（５２）の流れが第２通路（５３）と反対方向になるように接続されている。【選択図】図２</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZGBz9vf3cQ3iYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoYWhobGJiamjsZEKQIAHrMbHw</recordid><startdate>20180719</startdate><enddate>20180719</enddate><creator>OTAKA MIKIO</creator><scope>EVB</scope></search><sort><creationdate>20180719</creationdate><title>COOLER</title><author>OTAKA MIKIO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2018113445A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>OTAKA MIKIO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OTAKA MIKIO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COOLER</title><date>2018-07-19</date><risdate>2018</risdate><abstract>PROBLEM TO BE SOLVED: To provide a cooler in which the temperature of the heat receiving surface of a heat receiving section can be made uniform.SOLUTION: A cooler (100) has a cooling structure (5) and a connection pipe structure (11) for connecting more than one cooling structures (5). The cooling structures (5) has a first passage (52) and a second passage (53) laminated via a bulkhead (54). The connection pipe structure (11) has a partition part (43)internally, and has a two passage pipe structure (4) having two passages (41, 42). In the cooling structure (5), each bulkhead (54) is connected with the connection hole of the two passage pipe structure (4) in parallel with the partition part (43), so that the fluids in the two passages (41, 42) are not mixed. A baffle plate (3) is connected with respective ends of the two passage pipe structure (4), so that the flow of the first passage (52) becomes opposite direction to that of the second passage (53).SELECTED DRAWING: Figure 2
【課題】受熱部の受熱面の温度を均温化しうる冷却装置を提供する。【解決手段】冷却装置（１００）は、冷却構造体（５）と冷却構造体（５）を２本以上接続するための接続パイプ構造体（１１）とを有している。冷却構造体（５）は隔壁部（５４）を介して積層された第１通路（５２）及び第２通路（５３）を有している。接続パイプ構造体（１１）は、内部に仕切部（４３）を有し、２通路（４１、４２）を有する２通路パイプ構造体（４）を有している。冷却構造体（５）は、２通路パイプ構造体（４）の接続穴に、各々の隔壁部（５４）が仕切部（４３）と平行に、２通路（４１、４２）の流体が混合しないように接続されている。バッフルプレート（３）は、２通路パイプ構造体（４）のそれぞれの端部に、第１通路（５２）の流れが第２通路（５３）と反対方向になるように接続されている。【選択図】図２</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | COOLER |
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