AMPLITUDE DETECTION METHOD FOR CUTTING BLADE, AMPLITUDE DETECTION DEVICE FOR CUTTING BLADE, AND CUTTING DEVICE WITH AMPLITUDE DETECTION DEVICE FOR CUTTING BLADE
PROBLEM TO BE SOLVED: To easily measure the amplitude of a blade while restricting costs in the case of detecting the amplitude of a cutting blade ultrasonically vibrated.SOLUTION: An amplitude detection method for a cutting blade 60, which detects an amplitude of the cutting blade 60 ultrasonically...
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| creator | ITANI HIROYUKI TASHINO FUMITERU NAGAMORI HIROKI |
| description | PROBLEM TO BE SOLVED: To easily measure the amplitude of a blade while restricting costs in the case of detecting the amplitude of a cutting blade ultrasonically vibrated.SOLUTION: An amplitude detection method for a cutting blade 60, which detects an amplitude of the cutting blade 60 ultrasonically vibrated in a radial direction comprises: an ultrasonic vibration application step in which ultrasonic vibration is applied to the cutting blade 60 at a predetermined frequency; an imaging step in which an edge of the cutting blade 60 is imaged; an emission step in which strobe light is emitted to an imaging area in the imaging step; an amplitude calculation step in which the amplitude of the cutting blade 60 is calculated from the image captured in the imaging step. In the emission step, a frequency of the strobe light emitted in the emission step is other than the frequencies that can be divided by positive integers of the frequency of the ultrasonic vibration applied to the cutting blade 60.SELECTED DRAWING: Figure 3
【課題】超音波振動させた切削ブレードの振幅を検出する場合に、費用を抑えつつ、ブレードの振幅を容易に測定する。【解決手段】径方向に超音波振動させた切削ブレード６０の振幅を検出する切削ブレード６０の振幅検出方法であって、切削ブレード６０に所定の周波数で超音波振動を付与する超音波振動付与ステップと、切削ブレード６０の刃先を撮像する撮像ステップと、撮像ステップにおいて撮像領域にストロボ光を照射する照射ステップと、撮像ステップで撮像した画像から切削ブレード６０の振幅を算出する振幅算出ステップと、を備え、照射ステップにおいて照射されるストロボ光の周波数は、切削ブレード６０に付与する超音波振動の周波数の正の整数で割りきれる周波数以外であることを特徴とする切削ブレードの振幅検出方法である。【選択図】図３ |
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【課題】超音波振動させた切削ブレードの振幅を検出する場合に、費用を抑えつつ、ブレードの振幅を容易に測定する。【解決手段】径方向に超音波振動させた切削ブレード６０の振幅を検出する切削ブレード６０の振幅検出方法であって、切削ブレード６０に所定の周波数で超音波振動を付与する超音波振動付与ステップと、切削ブレード６０の刃先を撮像する撮像ステップと、撮像ステップにおいて撮像領域にストロボ光を照射する照射ステップと、撮像ステップで撮像した画像から切削ブレード６０の振幅を算出する振幅算出ステップと、を備え、照射ステップにおいて照射されるストロボ光の周波数は、切削ブレード６０に付与する超音波振動の周波数の正の整数で割りきれる周波数以外であることを特徴とする切削ブレードの振幅検出方法である。【選択図】図３</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180705&DB=EPODOC&CC=JP&NR=2018107311A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180705&DB=EPODOC&CC=JP&NR=2018107311A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ITANI HIROYUKI</creatorcontrib><creatorcontrib>TASHINO FUMITERU</creatorcontrib><creatorcontrib>NAGAMORI HIROKI</creatorcontrib><title>AMPLITUDE DETECTION METHOD FOR CUTTING BLADE, AMPLITUDE DETECTION DEVICE FOR CUTTING BLADE, AND CUTTING DEVICE WITH AMPLITUDE DETECTION DEVICE FOR CUTTING BLADE</title><description>PROBLEM TO BE SOLVED: To easily measure the amplitude of a blade while restricting costs in the case of detecting the amplitude of a cutting blade ultrasonically vibrated.SOLUTION: An amplitude detection method for a cutting blade 60, which detects an amplitude of the cutting blade 60 ultrasonically vibrated in a radial direction comprises: an ultrasonic vibration application step in which ultrasonic vibration is applied to the cutting blade 60 at a predetermined frequency; an imaging step in which an edge of the cutting blade 60 is imaged; an emission step in which strobe light is emitted to an imaging area in the imaging step; an amplitude calculation step in which the amplitude of the cutting blade 60 is calculated from the image captured in the imaging step. In the emission step, a frequency of the strobe light emitted in the emission step is other than the frequencies that can be divided by positive integers of the frequency of the ultrasonic vibration applied to the cutting blade 60.SELECTED DRAWING: Figure 3
【課題】超音波振動させた切削ブレードの振幅を検出する場合に、費用を抑えつつ、ブレードの振幅を容易に測定する。【解決手段】径方向に超音波振動させた切削ブレード６０の振幅を検出する切削ブレード６０の振幅検出方法であって、切削ブレード６０に所定の周波数で超音波振動を付与する超音波振動付与ステップと、切削ブレード６０の刃先を撮像する撮像ステップと、撮像ステップにおいて撮像領域にストロボ光を照射する照射ステップと、撮像ステップで撮像した画像から切削ブレード６０の振幅を算出する振幅算出ステップと、を備え、照射ステップにおいて照射されるストロボ光の周波数は、切削ブレード６０に付与する超音波振動の周波数の正の整数で割りきれる周波数以外であることを特徴とする切削ブレードの振幅検出方法である。【選択図】図３</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFjg6Bvg4xkS6uKq4OIa4uoc4unvp-DrGuLh76Lg5h-k4BwaEuLp567g5OPo4qqjgE21i2uYp7MrVtV-LnAhqKpwzxAPkkzhYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoYWhgbmxoaGjsZEKQIAskBExA</recordid><startdate>20180705</startdate><enddate>20180705</enddate><creator>ITANI HIROYUKI</creator><creator>TASHINO FUMITERU</creator><creator>NAGAMORI HIROKI</creator><scope>EVB</scope></search><sort><creationdate>20180705</creationdate><title>AMPLITUDE DETECTION METHOD FOR CUTTING BLADE, AMPLITUDE DETECTION DEVICE FOR CUTTING BLADE, AND CUTTING DEVICE WITH AMPLITUDE DETECTION DEVICE FOR CUTTING BLADE</title><author>ITANI HIROYUKI ; TASHINO FUMITERU ; NAGAMORI HIROKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2018107311A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>ITANI HIROYUKI</creatorcontrib><creatorcontrib>TASHINO FUMITERU</creatorcontrib><creatorcontrib>NAGAMORI HIROKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ITANI HIROYUKI</au><au>TASHINO FUMITERU</au><au>NAGAMORI HIROKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>AMPLITUDE DETECTION METHOD FOR CUTTING BLADE, AMPLITUDE DETECTION DEVICE FOR CUTTING BLADE, AND CUTTING DEVICE WITH AMPLITUDE DETECTION DEVICE FOR CUTTING BLADE</title><date>2018-07-05</date><risdate>2018</risdate><abstract>PROBLEM TO BE SOLVED: To easily measure the amplitude of a blade while restricting costs in the case of detecting the amplitude of a cutting blade ultrasonically vibrated.SOLUTION: An amplitude detection method for a cutting blade 60, which detects an amplitude of the cutting blade 60 ultrasonically vibrated in a radial direction comprises: an ultrasonic vibration application step in which ultrasonic vibration is applied to the cutting blade 60 at a predetermined frequency; an imaging step in which an edge of the cutting blade 60 is imaged; an emission step in which strobe light is emitted to an imaging area in the imaging step; an amplitude calculation step in which the amplitude of the cutting blade 60 is calculated from the image captured in the imaging step. In the emission step, a frequency of the strobe light emitted in the emission step is other than the frequencies that can be divided by positive integers of the frequency of the ultrasonic vibration applied to the cutting blade 60.SELECTED DRAWING: Figure 3
【課題】超音波振動させた切削ブレードの振幅を検出する場合に、費用を抑えつつ、ブレードの振幅を容易に測定する。【解決手段】径方向に超音波振動させた切削ブレード６０の振幅を検出する切削ブレード６０の振幅検出方法であって、切削ブレード６０に所定の周波数で超音波振動を付与する超音波振動付与ステップと、切削ブレード６０の刃先を撮像する撮像ステップと、撮像ステップにおいて撮像領域にストロボ光を照射する照射ステップと、撮像ステップで撮像した画像から切削ブレード６０の振幅を算出する振幅算出ステップと、を備え、照射ステップにおいて照射されるストロボ光の周波数は、切削ブレード６０に付与する超音波振動の周波数の正の整数で割りきれる周波数以外であることを特徴とする切削ブレードの振幅検出方法である。【選択図】図３</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | AMPLITUDE DETECTION METHOD FOR CUTTING BLADE, AMPLITUDE DETECTION DEVICE FOR CUTTING BLADE, AND CUTTING DEVICE WITH AMPLITUDE DETECTION DEVICE FOR CUTTING BLADE |
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