SUBSTRATE PROCESSING METHOD, SOLUTION SENDING METHOD, AND SUBSTRATE PROCESSING APPARATUS

PROBLEM TO BE SOLVED: To provide a substrate processing method, a solution sending method and a substrate processing apparatus, which can inhibit cost increase and inhibit or prevent generation of a precipitate.SOLUTION: A substrate processing method comprises: performing a low-purity rinse solution...

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Hauptverfasser: MIURA ATSUYASU, FUJITA KAZUHIRO, TSUJIKAWA HIROTAKA, DOBASHI YUYA
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creator MIURA ATSUYASU
FUJITA KAZUHIRO
TSUJIKAWA HIROTAKA
DOBASHI YUYA
description PROBLEM TO BE SOLVED: To provide a substrate processing method, a solution sending method and a substrate processing apparatus, which can inhibit cost increase and inhibit or prevent generation of a precipitate.SOLUTION: A substrate processing method comprises: performing a low-purity rinse solution supply process (carbonated water rinse treatment: S7) after performing a medicinal solution supply process (SC2 treatment: S5) of supplying an ion-containing medicinal solution (SC2) to a surface of a substrate; and performing a high-purity rinse solution supply process (DIW rinse treatment: S6) between the medicinal solution supply process and the low-purity rinse solution supply process. In the low-purity rinse solution supply process, the low-purity rinse solution (carbonated water) containing an impurity which forms a precipitate by interaction with ions contained in the medicinal solution is supplied to the surface of the substrate. In the high-purity rinse solution process, a high-purity rinse solution (DIW) containing less impurity than the low-purity rinse solution is supplied to the surface of the substrate.SELECTED DRAWING: Figure 4 【課題】コストの増大を抑制し、かつ、析出物の発生を抑制または防止することができる基板処理方法、送液方法および基板処理装置を提供する。【解決手段】イオンを含有する薬液(SC2)を基板の表面に供給する薬液供給工程(SC2処理:S5)の後に、低純度リンス液供給工程(炭酸水リンス処理:S7)を実行する。さらに、薬液供給工程と低純度リンス液供給工程との間に高純度リンス液供給工程(DIWリンス処理:S6)を実行する。低純度リンス液供給工程では、薬液に含有されるイオンと相互作用することによって析出物を形成する不純物を含有する低純度リンス液(炭酸水)を、基板の表面に供給する。高純度リンス液工程では、含有する不純物の量が低純度リンス液よりも少ない高純度リンス液(DIW)を、基板の表面に供給する。【選択図】図4
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In the low-purity rinse solution supply process, the low-purity rinse solution (carbonated water) containing an impurity which forms a precipitate by interaction with ions contained in the medicinal solution is supplied to the surface of the substrate. In the high-purity rinse solution process, a high-purity rinse solution (DIW) containing less impurity than the low-purity rinse solution is supplied to the surface of the substrate.SELECTED DRAWING: Figure 4 【課題】コストの増大を抑制し、かつ、析出物の発生を抑制または防止することができる基板処理方法、送液方法および基板処理装置を提供する。【解決手段】イオンを含有する薬液(SC2)を基板の表面に供給する薬液供給工程(SC2処理:S5)の後に、低純度リンス液供給工程(炭酸水リンス処理:S7)を実行する。さらに、薬液供給工程と低純度リンス液供給工程との間に高純度リンス液供給工程(DIWリンス処理:S6)を実行する。低純度リンス液供給工程では、薬液に含有されるイオンと相互作用することによって析出物を形成する不純物を含有する低純度リンス液(炭酸水)を、基板の表面に供給する。高純度リンス液工程では、含有する不純物の量が低純度リンス液よりも少ない高純度リンス液(DIW)を、基板の表面に供給する。【選択図】図4</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180628&amp;DB=EPODOC&amp;CC=JP&amp;NR=2018101670A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180628&amp;DB=EPODOC&amp;CC=JP&amp;NR=2018101670A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIURA ATSUYASU</creatorcontrib><creatorcontrib>FUJITA KAZUHIRO</creatorcontrib><creatorcontrib>TSUJIKAWA HIROTAKA</creatorcontrib><creatorcontrib>DOBASHI YUYA</creatorcontrib><title>SUBSTRATE PROCESSING METHOD, SOLUTION SENDING METHOD, AND SUBSTRATE PROCESSING APPARATUS</title><description>PROBLEM TO BE SOLVED: To provide a substrate processing method, a solution sending method and a substrate processing apparatus, which can inhibit cost increase and inhibit or prevent generation of a precipitate.SOLUTION: A substrate processing method comprises: performing a low-purity rinse solution supply process (carbonated water rinse treatment: S7) after performing a medicinal solution supply process (SC2 treatment: S5) of supplying an ion-containing medicinal solution (SC2) to a surface of a substrate; and performing a high-purity rinse solution supply process (DIW rinse treatment: S6) between the medicinal solution supply process and the low-purity rinse solution supply process. 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ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SUBSTRATE PROCESSING METHOD, SOLUTION SENDING METHOD, AND SUBSTRATE PROCESSING APPARATUS
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