LASER PROCESSING DEVICE

PROBLEM TO BE SOLVED: To provide a laser processing device capable of detecting any damage of a protective member and quickly and properly coping with the damage.SOLUTION: A laser processing device comprises a laser oscillator 3, a laser emitting head 10 for emitting a laser beam, a motion mechanism...

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Hauptverfasser: TAKASHIMA SHIGEYUKI, OTAWA TAKESHI, NISHI SHUICHI
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Sprache:eng ; jpn
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creator TAKASHIMA SHIGEYUKI
OTAWA TAKESHI
NISHI SHUICHI
description PROBLEM TO BE SOLVED: To provide a laser processing device capable of detecting any damage of a protective member and quickly and properly coping with the damage.SOLUTION: A laser processing device comprises a laser oscillator 3, a laser emitting head 10 for emitting a laser beam, a motion mechanism unit 2 for relatively moving the laser irradiation head 10 and a workpiece, and a control unit 31 for controlling the laser oscillator 3 and the motion mechanism part 2. The laser irradiation head 10 comprises a housing 11 having an optical path 11a penetrating from one side to the other side, a condenser lens 16 for condensing the laser beam and radiating the laser beam from a nozzle port 15b of the housing 11, and a protective member 18 provided between the condenser lens 16 and the nozzle port 15b. Check gas is supplied from a check gas supply unit 20 via a supply passage 21 to an optical path 13a between the condenser lens 16 and the protective member 18, and a flow rate of the check gas circulating in the supply passage 21 is detected by a gas flowmeter 23. Any damage of the protective member 18 is detected by a damage detection unit based on a variation in the detected flow rate.SELECTED DRAWING: Figure 1 【課題】保護部材の破損を検出でき、破損時に迅速,適切な対応が可能なレーザ加工装置を提供する。【解決手段】レーザ発振器3、レーザ光を照射するレーザ照射ヘッド10、レーザ照射ヘッド10と被加工物とを相対移動させる運動機構部2、並びにレーザ発振器3及び運動機構部2を制御する制御部31を備える。レーザ照射ヘッド10は、一方から他方に貫通した光学路11aを有するハウジング11、レーザ光を集光してハウジング11のノズル口15bから照射する集光レンズ16、並びに集光レンズ16とノズル口15bとの間に設けた保護部材18を備える。集光レンズ16、保護部材18間の光学路13aには、供給路21を介してチェックガス供給部20からチェックガスが供給され、供給路21内を流通するチェックガスの流量がガス流量計23により検出され、検出された流量の変動に基づいて、破損検出部により保護部材18の破損が検出される。【選択図】図1
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The laser irradiation head 10 comprises a housing 11 having an optical path 11a penetrating from one side to the other side, a condenser lens 16 for condensing the laser beam and radiating the laser beam from a nozzle port 15b of the housing 11, and a protective member 18 provided between the condenser lens 16 and the nozzle port 15b. Check gas is supplied from a check gas supply unit 20 via a supply passage 21 to an optical path 13a between the condenser lens 16 and the protective member 18, and a flow rate of the check gas circulating in the supply passage 21 is detected by a gas flowmeter 23. Any damage of the protective member 18 is detected by a damage detection unit based on a variation in the detected flow rate.SELECTED DRAWING: Figure 1 【課題】保護部材の破損を検出でき、破損時に迅速,適切な対応が可能なレーザ加工装置を提供する。【解決手段】レーザ発振器3、レーザ光を照射するレーザ照射ヘッド10、レーザ照射ヘッド10と被加工物とを相対移動させる運動機構部2、並びにレーザ発振器3及び運動機構部2を制御する制御部31を備える。レーザ照射ヘッド10は、一方から他方に貫通した光学路11aを有するハウジング11、レーザ光を集光してハウジング11のノズル口15bから照射する集光レンズ16、並びに集光レンズ16とノズル口15bとの間に設けた保護部材18を備える。集光レンズ16、保護部材18間の光学路13aには、供給路21を介してチェックガス供給部20からチェックガスが供給され、供給路21内を流通するチェックガスの流量がガス流量計23により検出され、検出された流量の変動に基づいて、破損検出部により保護部材18の破損が検出される。【選択図】図1</description><language>eng ; jpn</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180607&amp;DB=EPODOC&amp;CC=JP&amp;NR=2018086667A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180607&amp;DB=EPODOC&amp;CC=JP&amp;NR=2018086667A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKASHIMA SHIGEYUKI</creatorcontrib><creatorcontrib>OTAWA TAKESHI</creatorcontrib><creatorcontrib>NISHI SHUICHI</creatorcontrib><title>LASER PROCESSING DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a laser processing device capable of detecting any damage of a protective member and quickly and properly coping with the damage.SOLUTION: A laser processing device comprises a laser oscillator 3, a laser emitting head 10 for emitting a laser beam, a motion mechanism unit 2 for relatively moving the laser irradiation head 10 and a workpiece, and a control unit 31 for controlling the laser oscillator 3 and the motion mechanism part 2. The laser irradiation head 10 comprises a housing 11 having an optical path 11a penetrating from one side to the other side, a condenser lens 16 for condensing the laser beam and radiating the laser beam from a nozzle port 15b of the housing 11, and a protective member 18 provided between the condenser lens 16 and the nozzle port 15b. Check gas is supplied from a check gas supply unit 20 via a supply passage 21 to an optical path 13a between the condenser lens 16 and the protective member 18, and a flow rate of the check gas circulating in the supply passage 21 is detected by a gas flowmeter 23. Any damage of the protective member 18 is detected by a damage detection unit based on a variation in the detected flow rate.SELECTED DRAWING: Figure 1 【課題】保護部材の破損を検出でき、破損時に迅速,適切な対応が可能なレーザ加工装置を提供する。【解決手段】レーザ発振器3、レーザ光を照射するレーザ照射ヘッド10、レーザ照射ヘッド10と被加工物とを相対移動させる運動機構部2、並びにレーザ発振器3及び運動機構部2を制御する制御部31を備える。レーザ照射ヘッド10は、一方から他方に貫通した光学路11aを有するハウジング11、レーザ光を集光してハウジング11のノズル口15bから照射する集光レンズ16、並びに集光レンズ16とノズル口15bとの間に設けた保護部材18を備える。集光レンズ16、保護部材18間の光学路13aには、供給路21を介してチェックガス供給部20からチェックガスが供給され、供給路21内を流通するチェックガスの流量がガス流量計23により検出され、検出された流量の変動に基づいて、破損検出部により保護部材18の破損が検出される。【選択図】図1</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBD3cQx2DVIICPJ3dg0O9vRzV3BxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhhYGFmZmZuaOxkQpAgARrh_u</recordid><startdate>20180607</startdate><enddate>20180607</enddate><creator>TAKASHIMA SHIGEYUKI</creator><creator>OTAWA TAKESHI</creator><creator>NISHI SHUICHI</creator><scope>EVB</scope></search><sort><creationdate>20180607</creationdate><title>LASER PROCESSING DEVICE</title><author>TAKASHIMA SHIGEYUKI ; OTAWA TAKESHI ; NISHI SHUICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2018086667A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2018</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKASHIMA SHIGEYUKI</creatorcontrib><creatorcontrib>OTAWA TAKESHI</creatorcontrib><creatorcontrib>NISHI SHUICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKASHIMA SHIGEYUKI</au><au>OTAWA TAKESHI</au><au>NISHI SHUICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LASER PROCESSING DEVICE</title><date>2018-06-07</date><risdate>2018</risdate><abstract>PROBLEM TO BE SOLVED: To provide a laser processing device capable of detecting any damage of a protective member and quickly and properly coping with the damage.SOLUTION: A laser processing device comprises a laser oscillator 3, a laser emitting head 10 for emitting a laser beam, a motion mechanism unit 2 for relatively moving the laser irradiation head 10 and a workpiece, and a control unit 31 for controlling the laser oscillator 3 and the motion mechanism part 2. The laser irradiation head 10 comprises a housing 11 having an optical path 11a penetrating from one side to the other side, a condenser lens 16 for condensing the laser beam and radiating the laser beam from a nozzle port 15b of the housing 11, and a protective member 18 provided between the condenser lens 16 and the nozzle port 15b. Check gas is supplied from a check gas supply unit 20 via a supply passage 21 to an optical path 13a between the condenser lens 16 and the protective member 18, and a flow rate of the check gas circulating in the supply passage 21 is detected by a gas flowmeter 23. Any damage of the protective member 18 is detected by a damage detection unit based on a variation in the detected flow rate.SELECTED DRAWING: Figure 1 【課題】保護部材の破損を検出でき、破損時に迅速,適切な対応が可能なレーザ加工装置を提供する。【解決手段】レーザ発振器3、レーザ光を照射するレーザ照射ヘッド10、レーザ照射ヘッド10と被加工物とを相対移動させる運動機構部2、並びにレーザ発振器3及び運動機構部2を制御する制御部31を備える。レーザ照射ヘッド10は、一方から他方に貫通した光学路11aを有するハウジング11、レーザ光を集光してハウジング11のノズル口15bから照射する集光レンズ16、並びに集光レンズ16とノズル口15bとの間に設けた保護部材18を備える。集光レンズ16、保護部材18間の光学路13aには、供給路21を介してチェックガス供給部20からチェックガスが供給され、供給路21内を流通するチェックガスの流量がガス流量計23により検出され、検出された流量の変動に基づいて、破損検出部により保護部材18の破損が検出される。【選択図】図1</abstract><oa>free_for_read</oa></addata></record>
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subjects CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title LASER PROCESSING DEVICE
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