MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a technique for preventing occurrence of crack in the resist, when coating the upper surface of a SiC semiconductor substrate with resist by spin coating, and then the SiC semiconductor substrate is exposed to high temperature.SOLUTION: A manufacturing method of semi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAKEUCHI YUICHI, WAKASUGI YUKIHIRO, SOEJIMA SHIGEMASA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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