LASER MACHINING APPARATUS, AND LASER MACHINING METHOD

PROBLEM TO BE SOLVED: To provide a laser machining apparatus that can achieve satisfactory machining performance by irradiating a machining object immediately in front of the machining tool with a small-diameter laser beam even if the shape and surrounding environment of the machining object cannot...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KUROSAWA KOICHI, HIRANO KATSUHIKO, MATSUURA HIROSHI, ISHIZUKA IPPEI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BORING DECONTAMINATION ARRANGEMENTS THEREFOR DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINE TOOLS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METAL-WORKING NOT OTHERWISE PROVIDED FOR NUCLEAR ENGINEERING NUCLEAR PHYSICS PERFORMING OPERATIONS PHYSICS POLISHING PROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULARRADIATION OR PARTICLE BOMBARDMENT TRANSPORTING TREATING RADIOACTIVELY CONTAMINATED MATERIAL TURNING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!