LASER MACHINING APPARATUS, AND LASER MACHINING METHOD
PROBLEM TO BE SOLVED: To provide a laser machining apparatus that can achieve satisfactory machining performance by irradiating a machining object immediately in front of the machining tool with a small-diameter laser beam even if the shape and surrounding environment of the machining object cannot...
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| creator | KUROSAWA KOICHI HIRANO KATSUHIKO MATSUURA HIROSHI ISHIZUKA IPPEI |
| description | PROBLEM TO BE SOLVED: To provide a laser machining apparatus that can achieve satisfactory machining performance by irradiating a machining object immediately in front of the machining tool with a small-diameter laser beam even if the shape and surrounding environment of the machining object cannot be accurately known.SOLUTION: A laser machining apparatus is equipped with a laser oscillator or oscillators that oscillate laser beams, a machining tool 8 for machining objects to be machined and an optical fiber or fibers 1 for guiding laser beams from the laser oscillator or oscillators. It is further equipped with an optical fiber feed-out/lead-in mechanism 9 that can set as desired the distance from the laser beam 5 emitting end face of the optical fiber or fibers 1 to immediately before the machining point with the machining tool 8 by arranging at least one optical fiber 1 when a machining object 6 is to be removed from the machining tool 8 in a state of being kept at high temperature by irradiating the object 6 with the laser beam 5 without the presence of any lens in-between.SELECTED DRAWING: Figure 2(A)
【課題】被工作物の形状及び周囲環境が正確に把握できなくても、径が小さい光を工具の直前の被工作物に照射することで加工性能を発揮できるレーザー加工装置を提供する。【解決手段】レーザ光を発振するレーザ発振器と、被加工物を加工するための加工工具８と、レーザ発振器からレーザ光を導光する光ファイバ１とを備えたレーザ加工装置であって、光ファイバ８にレーザ光を導光させ、レンズを介することなく、被工作物６にレーザ光５を照射することにより被工作物６を高温にした状態で加工工具８により除去する際に、加工工具８による加工点の直前部に、光ファイバ１を少なくとも１つ配置し、かつ、光ファイバ１からのレーザ光５の出射端面から加工点の直前部までの距離を任意に設定できる光ファイバ送り出し引き込み機構９を備えている。【選択図】図２（Ａ） |
| format | Patent |
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【課題】被工作物の形状及び周囲環境が正確に把握できなくても、径が小さい光を工具の直前の被工作物に照射することで加工性能を発揮できるレーザー加工装置を提供する。【解決手段】レーザ光を発振するレーザ発振器と、被加工物を加工するための加工工具８と、レーザ発振器からレーザ光を導光する光ファイバ１とを備えたレーザ加工装置であって、光ファイバ８にレーザ光を導光させ、レンズを介することなく、被工作物６にレーザ光５を照射することにより被工作物６を高温にした状態で加工工具８により除去する際に、加工工具８による加工点の直前部に、光ファイバ１を少なくとも１つ配置し、かつ、光ファイバ１からのレーザ光５の出射端面から加工点の直前部までの距離を任意に設定できる光ファイバ送り出し引き込み機構９を備えている。【選択図】図２（Ａ）</description><language>eng ; jpn</language><subject>BORING ; DECONTAMINATION ARRANGEMENTS THEREFOR ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINE TOOLS ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; NUCLEAR ENGINEERING ; NUCLEAR PHYSICS ; PERFORMING OPERATIONS ; PHYSICS ; POLISHING ; PROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULARRADIATION OR PARTICLE BOMBARDMENT ; TRANSPORTING ; TREATING RADIOACTIVELY CONTAMINATED MATERIAL ; TURNING</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180412&DB=EPODOC&CC=JP&NR=2018059747A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180412&DB=EPODOC&CC=JP&NR=2018059747A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUROSAWA KOICHI</creatorcontrib><creatorcontrib>HIRANO KATSUHIKO</creatorcontrib><creatorcontrib>MATSUURA HIROSHI</creatorcontrib><creatorcontrib>ISHIZUKA IPPEI</creatorcontrib><title>LASER MACHINING APPARATUS, AND LASER MACHINING METHOD</title><description>PROBLEM TO BE SOLVED: To provide a laser machining apparatus that can achieve satisfactory machining performance by irradiating a machining object immediately in front of the machining tool with a small-diameter laser beam even if the shape and surrounding environment of the machining object cannot be accurately known.SOLUTION: A laser machining apparatus is equipped with a laser oscillator or oscillators that oscillate laser beams, a machining tool 8 for machining objects to be machined and an optical fiber or fibers 1 for guiding laser beams from the laser oscillator or oscillators. It is further equipped with an optical fiber feed-out/lead-in mechanism 9 that can set as desired the distance from the laser beam 5 emitting end face of the optical fiber or fibers 1 to immediately before the machining point with the machining tool 8 by arranging at least one optical fiber 1 when a machining object 6 is to be removed from the machining tool 8 in a state of being kept at high temperature by irradiating the object 6 with the laser beam 5 without the presence of any lens in-between.SELECTED DRAWING: Figure 2(A)
【課題】被工作物の形状及び周囲環境が正確に把握できなくても、径が小さい光を工具の直前の被工作物に照射することで加工性能を発揮できるレーザー加工装置を提供する。【解決手段】レーザ光を発振するレーザ発振器と、被加工物を加工するための加工工具８と、レーザ発振器からレーザ光を導光する光ファイバ１とを備えたレーザ加工装置であって、光ファイバ８にレーザ光を導光させ、レンズを介することなく、被工作物６にレーザ光５を照射することにより被工作物６を高温にした状態で加工工具８により除去する際に、加工工具８による加工点の直前部に、光ファイバ１を少なくとも１つ配置し、かつ、光ファイバ１からのレーザ光５の出射端面から加工点の直前部までの距離を任意に設定できる光ファイバ送り出し引き込み機構９を備えている。【選択図】図２（Ａ）</description><subject>BORING</subject><subject>DECONTAMINATION ARRANGEMENTS THEREFOR</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINE TOOLS</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>NUCLEAR ENGINEERING</subject><subject>NUCLEAR PHYSICS</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>POLISHING</subject><subject>PROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULARRADIATION OR PARTICLE BOMBARDMENT</subject><subject>TRANSPORTING</subject><subject>TREATING RADIOACTIVELY CONTAMINATED MATERIAL</subject><subject>TURNING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD1cQx2DVLwdXT28PTz9HNXcAwIcAxyDAkN1lFw9HNRQJf2dQ3x8HfhYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoYWBqaW5ibmjsZEKQIAGvYn4Q</recordid><startdate>20180412</startdate><enddate>20180412</enddate><creator>KUROSAWA KOICHI</creator><creator>HIRANO KATSUHIKO</creator><creator>MATSUURA HIROSHI</creator><creator>ISHIZUKA IPPEI</creator><scope>EVB</scope></search><sort><creationdate>20180412</creationdate><title>LASER MACHINING APPARATUS, AND LASER MACHINING METHOD</title><author>KUROSAWA KOICHI ; HIRANO KATSUHIKO ; MATSUURA HIROSHI ; ISHIZUKA IPPEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2018059747A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2018</creationdate><topic>BORING</topic><topic>DECONTAMINATION ARRANGEMENTS THEREFOR</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINE TOOLS</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>NUCLEAR ENGINEERING</topic><topic>NUCLEAR PHYSICS</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>POLISHING</topic><topic>PROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULARRADIATION OR PARTICLE BOMBARDMENT</topic><topic>TRANSPORTING</topic><topic>TREATING RADIOACTIVELY CONTAMINATED MATERIAL</topic><topic>TURNING</topic><toplevel>online_resources</toplevel><creatorcontrib>KUROSAWA KOICHI</creatorcontrib><creatorcontrib>HIRANO KATSUHIKO</creatorcontrib><creatorcontrib>MATSUURA HIROSHI</creatorcontrib><creatorcontrib>ISHIZUKA IPPEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KUROSAWA KOICHI</au><au>HIRANO KATSUHIKO</au><au>MATSUURA HIROSHI</au><au>ISHIZUKA IPPEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LASER MACHINING APPARATUS, AND LASER MACHINING METHOD</title><date>2018-04-12</date><risdate>2018</risdate><abstract>PROBLEM TO BE SOLVED: To provide a laser machining apparatus that can achieve satisfactory machining performance by irradiating a machining object immediately in front of the machining tool with a small-diameter laser beam even if the shape and surrounding environment of the machining object cannot be accurately known.SOLUTION: A laser machining apparatus is equipped with a laser oscillator or oscillators that oscillate laser beams, a machining tool 8 for machining objects to be machined and an optical fiber or fibers 1 for guiding laser beams from the laser oscillator or oscillators. It is further equipped with an optical fiber feed-out/lead-in mechanism 9 that can set as desired the distance from the laser beam 5 emitting end face of the optical fiber or fibers 1 to immediately before the machining point with the machining tool 8 by arranging at least one optical fiber 1 when a machining object 6 is to be removed from the machining tool 8 in a state of being kept at high temperature by irradiating the object 6 with the laser beam 5 without the presence of any lens in-between.SELECTED DRAWING: Figure 2(A)
【課題】被工作物の形状及び周囲環境が正確に把握できなくても、径が小さい光を工具の直前の被工作物に照射することで加工性能を発揮できるレーザー加工装置を提供する。【解決手段】レーザ光を発振するレーザ発振器と、被加工物を加工するための加工工具８と、レーザ発振器からレーザ光を導光する光ファイバ１とを備えたレーザ加工装置であって、光ファイバ８にレーザ光を導光させ、レンズを介することなく、被工作物６にレーザ光５を照射することにより被工作物６を高温にした状態で加工工具８により除去する際に、加工工具８による加工点の直前部に、光ファイバ１を少なくとも１つ配置し、かつ、光ファイバ１からのレーザ光５の出射端面から加工点の直前部までの距離を任意に設定できる光ファイバ送り出し引き込み機構９を備えている。【選択図】図２（Ａ）</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BORING DECONTAMINATION ARRANGEMENTS THEREFOR DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINE TOOLS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METAL-WORKING NOT OTHERWISE PROVIDED FOR NUCLEAR ENGINEERING NUCLEAR PHYSICS PERFORMING OPERATIONS PHYSICS POLISHING PROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULARRADIATION OR PARTICLE BOMBARDMENT TRANSPORTING TREATING RADIOACTIVELY CONTAMINATED MATERIAL TURNING |
| title | LASER MACHINING APPARATUS, AND LASER MACHINING METHOD |
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