VORTICAL ATOMIZATION NOZZLE ASSEMBLY, CARBURETOR, AND RELATED METHOD FOR SUBSTRATE PROCESSING SYSTEM
PROBLEM TO BE SOLVED: To provide a vortical atomization nozzle assembly, a carburetor, and related methods for substrate processing system.SOLUTION: A carburetor introduces atomized or vaporized liquid into a substrate processing system. The carburetor includes a vaporization chamber, a nozzle assem...
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| creator | RODNEY L ROBISON DANNY NEWMAN RONALD NASMAN |
| description | PROBLEM TO BE SOLVED: To provide a vortical atomization nozzle assembly, a carburetor, and related methods for substrate processing system.SOLUTION: A carburetor introduces atomized or vaporized liquid into a substrate processing system. The carburetor includes a vaporization chamber, a nozzle assembly coupled to the inlet of the vaporization chamber, and a carrier gas channel coupled to the nozzle assembly. The nozzle assembly includes a premixing chamber 112, an outflow channel 114, and an expansion nozzle 116. The premixing chamber includes a liquid inflow port 312 for receiving the liquid to be evaporated, and a gas inflow port 314 for receiving the carrier gas. The carrier gas channel is located for the gas inflow port so as to produce a vortex in the premixing chamber, when introducing carrier gas via the carrier gas channel. Premixed liquid from the premixing chamber is received by the outflow channel, before entering into the expansion nozzle.SELECTED DRAWING: Figure 3
【課題】基板処理システムのための渦状微粒化ノズルアセンブリ、気化器、及び関連する方法を提供する。【解決手段】気化器は、微粒化又は気化した液体を基板処理システム内に導入する。気化器は、気化チャンバと、気化チャンバの流入口に結合されるノズルアセンブリと、ノズルアセンブリに結合されるキャリアガス・チャネルとを含む。ノズルアセンブリは、予混合チャンバ１１２と、流出チャネル１１４と、拡張ノズル１１６とを含む。予混合チャンバは、気化すべき液体を受け取るための液体流入口３１２と、キャリアガスを受け取るためのガス流入口３１４とを含む。キャリアガス・チャネルは、キャリアガス・チャネルを介してキャリアガスを導入する際に、予混合チャンバ内に渦流を生じさせるようにガス流入口に対して位置付けされる。予混合チャンバからの予混合液体は、流出チャネルによって受け取られ、流出チャネルを出て拡張ノズル内に入る。【選択図】図３ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2018050040A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2018050040A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2018050040A3</originalsourceid><addsrcrecordid>eNqNyr8KwjAQgPEuDqK-w-FcIf4D1zS92kjSK5er0C6laJxEC_r-6OADOH3w45sm1zOxWKMdaCFvOy2WKqio6xyCDgF95toUjOasYRTiFHSVA6PTgjl4lJJyKIghNFkQ_irUTAZDsNURQhsE_TyZ3Ib7Ky5-nSXLAsWUqzg--_gah0t8xHd_qjdqfVB7pXZKb_-aPgExNWg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>VORTICAL ATOMIZATION NOZZLE ASSEMBLY, CARBURETOR, AND RELATED METHOD FOR SUBSTRATE PROCESSING SYSTEM</title><source>esp@cenet</source><creator>RODNEY L ROBISON ; DANNY NEWMAN ; RONALD NASMAN</creator><creatorcontrib>RODNEY L ROBISON ; DANNY NEWMAN ; RONALD NASMAN</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a vortical atomization nozzle assembly, a carburetor, and related methods for substrate processing system.SOLUTION: A carburetor introduces atomized or vaporized liquid into a substrate processing system. The carburetor includes a vaporization chamber, a nozzle assembly coupled to the inlet of the vaporization chamber, and a carrier gas channel coupled to the nozzle assembly. The nozzle assembly includes a premixing chamber 112, an outflow channel 114, and an expansion nozzle 116. The premixing chamber includes a liquid inflow port 312 for receiving the liquid to be evaporated, and a gas inflow port 314 for receiving the carrier gas. The carrier gas channel is located for the gas inflow port so as to produce a vortex in the premixing chamber, when introducing carrier gas via the carrier gas channel. Premixed liquid from the premixing chamber is received by the outflow channel, before entering into the expansion nozzle.SELECTED DRAWING: Figure 3
【課題】基板処理システムのための渦状微粒化ノズルアセンブリ、気化器、及び関連する方法を提供する。【解決手段】気化器は、微粒化又は気化した液体を基板処理システム内に導入する。気化器は、気化チャンバと、気化チャンバの流入口に結合されるノズルアセンブリと、ノズルアセンブリに結合されるキャリアガス・チャネルとを含む。ノズルアセンブリは、予混合チャンバ１１２と、流出チャネル１１４と、拡張ノズル１１６とを含む。予混合チャンバは、気化すべき液体を受け取るための液体流入口３１２と、キャリアガスを受け取るためのガス流入口３１４とを含む。キャリアガス・チャネルは、キャリアガス・チャネルを介してキャリアガスを導入する際に、予混合チャンバ内に渦流を生じさせるようにガス流入口に対して位置付けされる。予混合チャンバからの予混合液体は、流出チャネルによって受け取られ、流出チャネルを出て拡張ノズル内に入る。【選択図】図３</description><language>eng ; jpn</language><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; ATOMISING APPARATUS ; BASIC ELECTRIC ELEMENTS ; BLASTING ; CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; CYLINDERS ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ENGINEERING ELEMENTS AND UNITS ; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS ; HEATING ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; LIGHTING ; MECHANICAL ENGINEERING ; METALLURGY ; MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING ; NOZZLES ; PERFORMING OPERATIONS ; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL ; PISTONS ; SEALINGS ; SEMICONDUCTOR DEVICES ; SPRAYING APPARATUS ; SPRAYING OR ATOMISING IN GENERAL ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; THEIR RELEVANT APPARATUS ; THERMAL INSULATION IN GENERAL ; TRANSPORTING ; WEAPONS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180329&DB=EPODOC&CC=JP&NR=2018050040A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180329&DB=EPODOC&CC=JP&NR=2018050040A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RODNEY L ROBISON</creatorcontrib><creatorcontrib>DANNY NEWMAN</creatorcontrib><creatorcontrib>RONALD NASMAN</creatorcontrib><title>VORTICAL ATOMIZATION NOZZLE ASSEMBLY, CARBURETOR, AND RELATED METHOD FOR SUBSTRATE PROCESSING SYSTEM</title><description>PROBLEM TO BE SOLVED: To provide a vortical atomization nozzle assembly, a carburetor, and related methods for substrate processing system.SOLUTION: A carburetor introduces atomized or vaporized liquid into a substrate processing system. The carburetor includes a vaporization chamber, a nozzle assembly coupled to the inlet of the vaporization chamber, and a carrier gas channel coupled to the nozzle assembly. The nozzle assembly includes a premixing chamber 112, an outflow channel 114, and an expansion nozzle 116. The premixing chamber includes a liquid inflow port 312 for receiving the liquid to be evaporated, and a gas inflow port 314 for receiving the carrier gas. The carrier gas channel is located for the gas inflow port so as to produce a vortex in the premixing chamber, when introducing carrier gas via the carrier gas channel. Premixed liquid from the premixing chamber is received by the outflow channel, before entering into the expansion nozzle.SELECTED DRAWING: Figure 3
【課題】基板処理システムのための渦状微粒化ノズルアセンブリ、気化器、及び関連する方法を提供する。【解決手段】気化器は、微粒化又は気化した液体を基板処理システム内に導入する。気化器は、気化チャンバと、気化チャンバの流入口に結合されるノズルアセンブリと、ノズルアセンブリに結合されるキャリアガス・チャネルとを含む。ノズルアセンブリは、予混合チャンバ１１２と、流出チャネル１１４と、拡張ノズル１１６とを含む。予混合チャンバは、気化すべき液体を受け取るための液体流入口３１２と、キャリアガスを受け取るためのガス流入口３１４とを含む。キャリアガス・チャネルは、キャリアガス・チャネルを介してキャリアガスを導入する際に、予混合チャンバ内に渦流を生じさせるようにガス流入口に対して位置付けされる。予混合チャンバからの予混合液体は、流出チャネルによって受け取られ、流出チャネルを出て拡張ノズル内に入る。【選択図】図３</description><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>ATOMISING APPARATUS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>CYLINDERS</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ENGINEERING ELEMENTS AND UNITS</subject><subject>GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS</subject><subject>HEATING</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>METALLURGY</subject><subject>MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING</subject><subject>NOZZLES</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</subject><subject>PISTONS</subject><subject>SEALINGS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SPRAYING APPARATUS</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>THEIR RELEVANT APPARATUS</subject><subject>THERMAL INSULATION IN GENERAL</subject><subject>TRANSPORTING</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyr8KwjAQgPEuDqK-w-FcIf4D1zS92kjSK5er0C6laJxEC_r-6OADOH3w45sm1zOxWKMdaCFvOy2WKqio6xyCDgF95toUjOasYRTiFHSVA6PTgjl4lJJyKIghNFkQ_irUTAZDsNURQhsE_TyZ3Ib7Ky5-nSXLAsWUqzg--_gah0t8xHd_qjdqfVB7pXZKb_-aPgExNWg</recordid><startdate>20180329</startdate><enddate>20180329</enddate><creator>RODNEY L ROBISON</creator><creator>DANNY NEWMAN</creator><creator>RONALD NASMAN</creator><scope>EVB</scope></search><sort><creationdate>20180329</creationdate><title>VORTICAL ATOMIZATION NOZZLE ASSEMBLY, CARBURETOR, AND RELATED METHOD FOR SUBSTRATE PROCESSING SYSTEM</title><author>RODNEY L ROBISON ; DANNY NEWMAN ; RONALD NASMAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2018050040A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2018</creationdate><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>ATOMISING APPARATUS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>CYLINDERS</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ENGINEERING ELEMENTS AND UNITS</topic><topic>GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS</topic><topic>HEATING</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>METALLURGY</topic><topic>MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING</topic><topic>NOZZLES</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</topic><topic>PISTONS</topic><topic>SEALINGS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SPRAYING APPARATUS</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>THEIR RELEVANT APPARATUS</topic><topic>THERMAL INSULATION IN GENERAL</topic><topic>TRANSPORTING</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>RODNEY L ROBISON</creatorcontrib><creatorcontrib>DANNY NEWMAN</creatorcontrib><creatorcontrib>RONALD NASMAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>RODNEY L ROBISON</au><au>DANNY NEWMAN</au><au>RONALD NASMAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>VORTICAL ATOMIZATION NOZZLE ASSEMBLY, CARBURETOR, AND RELATED METHOD FOR SUBSTRATE PROCESSING SYSTEM</title><date>2018-03-29</date><risdate>2018</risdate><abstract>PROBLEM TO BE SOLVED: To provide a vortical atomization nozzle assembly, a carburetor, and related methods for substrate processing system.SOLUTION: A carburetor introduces atomized or vaporized liquid into a substrate processing system. The carburetor includes a vaporization chamber, a nozzle assembly coupled to the inlet of the vaporization chamber, and a carrier gas channel coupled to the nozzle assembly. The nozzle assembly includes a premixing chamber 112, an outflow channel 114, and an expansion nozzle 116. The premixing chamber includes a liquid inflow port 312 for receiving the liquid to be evaporated, and a gas inflow port 314 for receiving the carrier gas. The carrier gas channel is located for the gas inflow port so as to produce a vortex in the premixing chamber, when introducing carrier gas via the carrier gas channel. Premixed liquid from the premixing chamber is received by the outflow channel, before entering into the expansion nozzle.SELECTED DRAWING: Figure 3
【課題】基板処理システムのための渦状微粒化ノズルアセンブリ、気化器、及び関連する方法を提供する。【解決手段】気化器は、微粒化又は気化した液体を基板処理システム内に導入する。気化器は、気化チャンバと、気化チャンバの流入口に結合されるノズルアセンブリと、ノズルアセンブリに結合されるキャリアガス・チャネルとを含む。ノズルアセンブリは、予混合チャンバ１１２と、流出チャネル１１４と、拡張ノズル１１６とを含む。予混合チャンバは、気化すべき液体を受け取るための液体流入口３１２と、キャリアガスを受け取るためのガス流入口３１４とを含む。キャリアガス・チャネルは、キャリアガス・チャネルを介してキャリアガスを導入する際に、予混合チャンバ内に渦流を生じさせるようにガス流入口に対して位置付けされる。予混合チャンバからの予混合液体は、流出チャネルによって受け取られ、流出チャネルを出て拡張ノズル内に入る。【選択図】図３</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BASIC ELECTRIC ELEMENTS BLASTING CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CYLINDERS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LIGHTING MECHANICAL ENGINEERING METALLURGY MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING NOZZLES PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PISTONS SEALINGS SEMICONDUCTOR DEVICES SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION THEIR RELEVANT APPARATUS THERMAL INSULATION IN GENERAL TRANSPORTING WEAPONS |
| title | VORTICAL ATOMIZATION NOZZLE ASSEMBLY, CARBURETOR, AND RELATED METHOD FOR SUBSTRATE PROCESSING SYSTEM |
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