HOLLOW PACKAGE AND METHOD OF MANUFACTURING THE SAME
PROBLEM TO BE SOLVED: To provide a hollow package that is high in productivity and that can be manufactured at low cost, in a semiconductor device that has a package structure having a SAW filter element and a MEMS element in a hollow structure, and to provide a method of manufacturing the same.SOLU...
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| creator | TAKASAKI SHINGO TAIRA TOMOAKI OGATA TOSHIHIRO |
| description | PROBLEM TO BE SOLVED: To provide a hollow package that is high in productivity and that can be manufactured at low cost, in a semiconductor device that has a package structure having a SAW filter element and a MEMS element in a hollow structure, and to provide a method of manufacturing the same.SOLUTION: In a hollow package having a hollow structure, a step part 4 is formed on an upper surface of a wall part 3 surrounding a chip mounting part 1. By bonding the step part 4 with a lid 7 under a decompressed atmosphere, and then, bonding as a whole by a pressure difference at the time when returned to a normal pressure, the hollow package is formed collectively.SELECTED DRAWING: Figure 1
【課題】中空構造内にＳＡＷフィルタ素子やＭＥＭＳ素子を有するパッケージ構造を有する半導体装置において、生産性が高く、低コストで製造することができる中空パッケージ及びその製造方法を提供する。【解決手段】中空構造を有する中空パッケージにおいて、チップ搭載部１を取り囲む壁部３の上面に段差部４を形成しておき、減圧雰囲気下でリッド７と貼り合わせてから常圧に戻したときの圧力差により全体を貼り合わせることにより、一括で中空パッケージを形成する。【選択図】図１ |
| format | Patent |
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【課題】中空構造内にＳＡＷフィルタ素子やＭＥＭＳ素子を有するパッケージ構造を有する半導体装置において、生産性が高く、低コストで製造することができる中空パッケージ及びその製造方法を提供する。【解決手段】中空構造を有する中空パッケージにおいて、チップ搭載部１を取り囲む壁部３の上面に段差部４を形成しておき、減圧雰囲気下でリッド７と貼り合わせてから常圧に戻したときの圧力差により全体を貼り合わせることにより、一括で中空パッケージを形成する。【選択図】図１</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180322&DB=EPODOC&CC=JP&NR=2018046046A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180322&DB=EPODOC&CC=JP&NR=2018046046A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKASAKI SHINGO</creatorcontrib><creatorcontrib>TAIRA TOMOAKI</creatorcontrib><creatorcontrib>OGATA TOSHIHIRO</creatorcontrib><title>HOLLOW PACKAGE AND METHOD OF MANUFACTURING THE SAME</title><description>PROBLEM TO BE SOLVED: To provide a hollow package that is high in productivity and that can be manufactured at low cost, in a semiconductor device that has a package structure having a SAW filter element and a MEMS element in a hollow structure, and to provide a method of manufacturing the same.SOLUTION: In a hollow package having a hollow structure, a step part 4 is formed on an upper surface of a wall part 3 surrounding a chip mounting part 1. By bonding the step part 4 with a lid 7 under a decompressed atmosphere, and then, bonding as a whole by a pressure difference at the time when returned to a normal pressure, the hollow package is formed collectively.SELECTED DRAWING: Figure 1
【課題】中空構造内にＳＡＷフィルタ素子やＭＥＭＳ素子を有するパッケージ構造を有する半導体装置において、生産性が高く、低コストで製造することができる中空パッケージ及びその製造方法を提供する。【解決手段】中空構造を有する中空パッケージにおいて、チップ搭載部１を取り囲む壁部３の上面に段差部４を形成しておき、減圧雰囲気下でリッド７と貼り合わせてから常圧に戻したときの圧力差により全体を貼り合わせることにより、一括で中空パッケージを形成する。【選択図】図１</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD28Pfx8Q9XCHB09nZ0d1Vw9HNR8HUN8fB3UfB3U_B19At1c3QOCQ3y9HNXCPFwVQh29HXlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoYWBiZmQORoTJQiAMUeJzE</recordid><startdate>20180322</startdate><enddate>20180322</enddate><creator>TAKASAKI SHINGO</creator><creator>TAIRA TOMOAKI</creator><creator>OGATA TOSHIHIRO</creator><scope>EVB</scope></search><sort><creationdate>20180322</creationdate><title>HOLLOW PACKAGE AND METHOD OF MANUFACTURING THE SAME</title><author>TAKASAKI SHINGO ; TAIRA TOMOAKI ; OGATA TOSHIHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2018046046A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKASAKI SHINGO</creatorcontrib><creatorcontrib>TAIRA TOMOAKI</creatorcontrib><creatorcontrib>OGATA TOSHIHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKASAKI SHINGO</au><au>TAIRA TOMOAKI</au><au>OGATA TOSHIHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HOLLOW PACKAGE AND METHOD OF MANUFACTURING THE SAME</title><date>2018-03-22</date><risdate>2018</risdate><abstract>PROBLEM TO BE SOLVED: To provide a hollow package that is high in productivity and that can be manufactured at low cost, in a semiconductor device that has a package structure having a SAW filter element and a MEMS element in a hollow structure, and to provide a method of manufacturing the same.SOLUTION: In a hollow package having a hollow structure, a step part 4 is formed on an upper surface of a wall part 3 surrounding a chip mounting part 1. By bonding the step part 4 with a lid 7 under a decompressed atmosphere, and then, bonding as a whole by a pressure difference at the time when returned to a normal pressure, the hollow package is formed collectively.SELECTED DRAWING: Figure 1
【課題】中空構造内にＳＡＷフィルタ素子やＭＥＭＳ素子を有するパッケージ構造を有する半導体装置において、生産性が高く、低コストで製造することができる中空パッケージ及びその製造方法を提供する。【解決手段】中空構造を有する中空パッケージにおいて、チップ搭載部１を取り囲む壁部３の上面に段差部４を形成しておき、減圧雰囲気下でリッド７と貼り合わせてから常圧に戻したときの圧力差により全体を貼り合わせることにより、一括で中空パッケージを形成する。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| title | HOLLOW PACKAGE AND METHOD OF MANUFACTURING THE SAME |
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