SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor device having a structure within a through hole suitable for a power circuit part; and provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device comprises: an interlayer insulation film II2 having via holes VH1, VH2;...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KOSHIMIZU AKIRA, FUKAYA KAZUHIDE, HANAWA TOSHIKAZU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!