PRINTED CIRCUIT BOARD MANUFACTURING METHOD BY SEMI-ADDITIVE PROCESSES
PROBLEM TO BE SOLVED: To provide a printed circuit board manufacturing method by semi-additive processes.SOLUTION: In a printed circuit board manufacturing method, a substrate having, on a surface, a silver material layer of 0.05-1 μm in thickness is provided; and a printed circuit board is manufact...
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| creator | CHEN GUANGHUAN CHEN JINGLUN |
| description | PROBLEM TO BE SOLVED: To provide a printed circuit board manufacturing method by semi-additive processes.SOLUTION: In a printed circuit board manufacturing method, a substrate having, on a surface, a silver material layer of 0.05-1 μm in thickness is provided; and a printed circuit board is manufactured by semi-additive processes, such as perforation, conductivity impartation, lamination, electric plating, film removal, and etching. Because of the silver material layer being thin in thickness, a metal conductive layer is decreased in thickness, and the thickness of the resultant printed circuit board is also decreased. The silver material layer is different from a copper material layer and as such, the width of a metal conducting wire on the printed circuit board is controlled to 3-1000 μm by selecting a solvent used for etching in an etching process, and the metal conducting wire becomes thin.SELECTED DRAWING: Figure 3
【課題】セミアディティブ法によりプリント回路基板を作成する方法を提供する。【解決手段】表面に銀材料層を有する基板が提供され、銀材料層の厚さは０．０５〜１μｍであり、且つ穿孔、導電化、ラミネート加工、電気めっき、膜除去、エッチング等のセミアディティブ法によりプリント回路基板が製造される。また、銀材料層の厚さが薄いため、金属導電層の厚さが薄くなり、プリント回路基板の厚さも減少する。エッチング過程では、銀材料層及び銅材料層は違うため、エッチングに用いられる溶剤の選択により、プリント回路基板上の金属導線の幅が３〜１０００μｍに制御され、金属導線が細くなる。【選択図】図３ |
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【課題】セミアディティブ法によりプリント回路基板を作成する方法を提供する。【解決手段】表面に銀材料層を有する基板が提供され、銀材料層の厚さは０．０５〜１μｍであり、且つ穿孔、導電化、ラミネート加工、電気めっき、膜除去、エッチング等のセミアディティブ法によりプリント回路基板が製造される。また、銀材料層の厚さが薄いため、金属導電層の厚さが薄くなり、プリント回路基板の厚さも減少する。エッチング過程では、銀材料層及び銅材料層は違うため、エッチングに用いられる溶剤の選択により、プリント回路基板上の金属導線の幅が３〜１０００μｍに制御され、金属導線が細くなる。【選択図】図３</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180118&DB=EPODOC&CC=JP&NR=2018011013A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180118&DB=EPODOC&CC=JP&NR=2018011013A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN GUANGHUAN</creatorcontrib><creatorcontrib>CHEN JINGLUN</creatorcontrib><title>PRINTED CIRCUIT BOARD MANUFACTURING METHOD BY SEMI-ADDITIVE PROCESSES</title><description>PROBLEM TO BE SOLVED: To provide a printed circuit board manufacturing method by semi-additive processes.SOLUTION: In a printed circuit board manufacturing method, a substrate having, on a surface, a silver material layer of 0.05-1 μm in thickness is provided; and a printed circuit board is manufactured by semi-additive processes, such as perforation, conductivity impartation, lamination, electric plating, film removal, and etching. Because of the silver material layer being thin in thickness, a metal conductive layer is decreased in thickness, and the thickness of the resultant printed circuit board is also decreased. The silver material layer is different from a copper material layer and as such, the width of a metal conducting wire on the printed circuit board is controlled to 3-1000 μm by selecting a solvent used for etching in an etching process, and the metal conducting wire becomes thin.SELECTED DRAWING: Figure 3
【課題】セミアディティブ法によりプリント回路基板を作成する方法を提供する。【解決手段】表面に銀材料層を有する基板が提供され、銀材料層の厚さは０．０５〜１μｍであり、且つ穿孔、導電化、ラミネート加工、電気めっき、膜除去、エッチング等のセミアディティブ法によりプリント回路基板が製造される。また、銀材料層の厚さが薄いため、金属導電層の厚さが薄くなり、プリント回路基板の厚さも減少する。エッチング過程では、銀材料層及び銅材料層は違うため、エッチングに用いられる溶剤の選択により、プリント回路基板上の金属導線の幅が３〜１０００μｍに制御され、金属導線が細くなる。【選択図】図３</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHANCPL0C3F1UXD2DHIO9QxRcPJ3DHJR8HX0C3VzdA4JBcq6K_i6hnj4uyg4RSoEu_p66jq6uHiGeIa5KgQE-Tu7Bge7BvMwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknivACMDQwsDQ0MDQ2NHY6IUAQDnNix_</recordid><startdate>20180118</startdate><enddate>20180118</enddate><creator>CHEN GUANGHUAN</creator><creator>CHEN JINGLUN</creator><scope>EVB</scope></search><sort><creationdate>20180118</creationdate><title>PRINTED CIRCUIT BOARD MANUFACTURING METHOD BY SEMI-ADDITIVE PROCESSES</title><author>CHEN GUANGHUAN ; CHEN JINGLUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2018011013A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2018</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>CHEN GUANGHUAN</creatorcontrib><creatorcontrib>CHEN JINGLUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHEN GUANGHUAN</au><au>CHEN JINGLUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PRINTED CIRCUIT BOARD MANUFACTURING METHOD BY SEMI-ADDITIVE PROCESSES</title><date>2018-01-18</date><risdate>2018</risdate><abstract>PROBLEM TO BE SOLVED: To provide a printed circuit board manufacturing method by semi-additive processes.SOLUTION: In a printed circuit board manufacturing method, a substrate having, on a surface, a silver material layer of 0.05-1 μm in thickness is provided; and a printed circuit board is manufactured by semi-additive processes, such as perforation, conductivity impartation, lamination, electric plating, film removal, and etching. Because of the silver material layer being thin in thickness, a metal conductive layer is decreased in thickness, and the thickness of the resultant printed circuit board is also decreased. The silver material layer is different from a copper material layer and as such, the width of a metal conducting wire on the printed circuit board is controlled to 3-1000 μm by selecting a solvent used for etching in an etching process, and the metal conducting wire becomes thin.SELECTED DRAWING: Figure 3
【課題】セミアディティブ法によりプリント回路基板を作成する方法を提供する。【解決手段】表面に銀材料層を有する基板が提供され、銀材料層の厚さは０．０５〜１μｍであり、且つ穿孔、導電化、ラミネート加工、電気めっき、膜除去、エッチング等のセミアディティブ法によりプリント回路基板が製造される。また、銀材料層の厚さが薄いため、金属導電層の厚さが薄くなり、プリント回路基板の厚さも減少する。エッチング過程では、銀材料層及び銅材料層は違うため、エッチングに用いられる溶剤の選択により、プリント回路基板上の金属導線の幅が３〜１０００μｍに制御され、金属導線が細くなる。【選択図】図３</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | PRINTED CIRCUIT BOARD MANUFACTURING METHOD BY SEMI-ADDITIVE PROCESSES |
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