POROUS FILM AND METHOD FOR PRODUCING THE SAME

PROBLEM TO BE SOLVED: To provide a porous polyimide film in which the occurrence of cracks is suppressed.SOLUTION: A porous film has at least one layer of a porous polyimide film containing an organic amine compound and a resin other than a polyimide resin and containing no aprotic polar solvent. Th...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MIYAZAKI KANA, KAJIWARA KENJI, NUKADA KATSUMI, SASAKI TOMOYA, WATANABE MASASHIGE
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a porous polyimide film in which the occurrence of cracks is suppressed.SOLUTION: A porous film has at least one layer of a porous polyimide film containing an organic amine compound and a resin other than a polyimide resin and containing no aprotic polar solvent. The content of the organic amine compound is 0.001 mass% or more based on the whole of the porous polyimide film.SELECTED DRAWING: None 【課題】亀裂の発生が抑制される多孔質ポリイミドフィルムの提供。【解決手段】有機アミン化合物と、ポリイミド樹脂以外の樹脂とを含有し、かつ、非プロトン性極性溶剤を含有しない多孔質ポリイミドフィルムを少なくとも１層有し、前記有機アミン化合物の含有量が、前記多孔質ポリイミドフィルムの全体に対し０．００１質量％以上である多孔質フィルム。【選択図】なし