COMPOSITION SHEET FOR FORMING SELF TEMPERATURE CONTROL TYPE RESIN RESISTOR AND SELF TEMPERATURE CONTROL TYPE RESIN RESISTOR SHEET

PROBLEM TO BE SOLVED: To provide a composition sheet for forming a self temperature control type resin resistor for forming a thin film having a self temperature control function in a temperature region of 150-300°C by optimizing materials and compositions of three kinds of a resin, conductive powder and an inorganic filler, and to provide a self temperature control type resin resistor sheet using the same.SOLUTION: A composition sheet for forming a self temperature control type resin resistor has a base material and a composition for forming a self temperature control type resin resistor which contains an uncured resin adherend containing an uncured resin, a conductive substance and an inorganic filler on at least one surface of the base material, where the uncured resin adherend is any one of an uncured thermosetting resin, an adherend obtained by dissolving the thermosetting resin in an organic solvent, an adherent obtained by dissolving a thermoplastic resin having a glass transition point of 250°C or higher in an organic solvent and an adherent obtained by dissolving a mixture of the thermosetting resin and the thermoplastic resin in the organic solvent, and the inorganic filler is plate-like powder and has a content of 3-20 vol.% with respect to the volume of the self temperature control type resin resistor.SELECTED DRAWING: Figure 1 【課題】 樹脂、導電性粉末、無機フィラーの３種類の材料、組成を適正化することにより１５０〜３００℃の温度領域で自己温調機能を有する薄膜を形成するための自己温度調整型樹脂抵抗体形成用組成物シートと、それを用いた自己温度調整型樹脂抵抗体シートを提供する。【解決手段】 基材と、その基材の少なくとも一方の表面に、未硬化の樹脂が含まれる未硬化樹脂粘着物と導電性物質と無機フィラーを含む自己温度調整型樹脂抵抗体形成用組成物を備え、未硬化樹脂粘着物が、未硬化の熱硬化型樹脂、その熱硬化型樹脂を有機溶剤に溶かした粘着物、ガラス転移点が２５０℃以上の熱可塑性樹脂を有機溶剤に溶かした粘着物、それら熱硬化型樹脂と熱可塑性樹脂の混合物を有機溶剤に溶解した粘着物のいずれかであり、無機フィラーが板状粉末で、その含有率が、自己温度調整型樹脂抵抗体の体積に対し、３〜２０体積％含まれることを特徴とする自己温度調整型樹脂抵抗体形成用組成物シート。【選択図】 図１