WAFER TRAY
PROBLEM TO BE SOLVED: To provide a wafer tray capable of processing a plurality of wafers having different diameters to each other without modifying a semiconductor manufacturing device.SOLUTION: A wafer tray according to the present invention includes: a tray body including a main surface with a fi...
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| creator | SEKIYA KOICHI TOKURA YUJI |
| description | PROBLEM TO BE SOLVED: To provide a wafer tray capable of processing a plurality of wafers having different diameters to each other without modifying a semiconductor manufacturing device.SOLUTION: A wafer tray according to the present invention includes: a tray body including a main surface with a first diameter and having a wafer installation region, where a wafer with a second diameter less than that of the first diameter can be installed, defined on the main surface; and a wafer guide discretely provided to the main surface while being adjacent to the contour of the wafer installation region at the outside of the wafer installation region. The wafer guide includes a rear surface and an apex, the rear surface being in contact with the main surface to be fixed, and the position of the apex being higher than the main surface.SELECTED DRAWING: Figure 1
【課題】半導体製造装置の改造を行うことなく異なる口径を有する複数のウエハを処理できるウエハトレイの提供を目的とする。【解決手段】本発明に係るウエハトレイは、第１の径を有する主面を備え、第１の径よりも小さな第２の径を有するウエハが設置可能なウエハ設置領域が主面上に規定されたトレイ本体と、ウエハ設置領域の外側でかつウエハ設置領域の輪郭に隣接して主面に離散的に設けられたウエハガイドとを備え、ウエハガイドは、裏面と頂部とを含み、裏面が主面に接して固定され、頂部の位置が主面よりも高い。【選択図】図１ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2017212282A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2017212282A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2017212282A3</originalsourceid><addsrcrecordid>eNrjZOAKd3RzDVIICXKM5GFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgaG5kaGRkYWRo7GRCkCAIl5HDA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>WAFER TRAY</title><source>esp@cenet</source><creator>SEKIYA KOICHI ; TOKURA YUJI</creator><creatorcontrib>SEKIYA KOICHI ; TOKURA YUJI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a wafer tray capable of processing a plurality of wafers having different diameters to each other without modifying a semiconductor manufacturing device.SOLUTION: A wafer tray according to the present invention includes: a tray body including a main surface with a first diameter and having a wafer installation region, where a wafer with a second diameter less than that of the first diameter can be installed, defined on the main surface; and a wafer guide discretely provided to the main surface while being adjacent to the contour of the wafer installation region at the outside of the wafer installation region. The wafer guide includes a rear surface and an apex, the rear surface being in contact with the main surface to be fixed, and the position of the apex being higher than the main surface.SELECTED DRAWING: Figure 1
【課題】半導体製造装置の改造を行うことなく異なる口径を有する複数のウエハを処理できるウエハトレイの提供を目的とする。【解決手段】本発明に係るウエハトレイは、第１の径を有する主面を備え、第１の径よりも小さな第２の径を有するウエハが設置可能なウエハ設置領域が主面上に規定されたトレイ本体と、ウエハ設置領域の外側でかつウエハ設置領域の輪郭に隣接して主面に離散的に設けられたウエハガイドとを備え、ウエハガイドは、裏面と頂部とを含み、裏面が主面に接して固定され、頂部の位置が主面よりも高い。【選択図】図１</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171130&DB=EPODOC&CC=JP&NR=2017212282A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171130&DB=EPODOC&CC=JP&NR=2017212282A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SEKIYA KOICHI</creatorcontrib><creatorcontrib>TOKURA YUJI</creatorcontrib><title>WAFER TRAY</title><description>PROBLEM TO BE SOLVED: To provide a wafer tray capable of processing a plurality of wafers having different diameters to each other without modifying a semiconductor manufacturing device.SOLUTION: A wafer tray according to the present invention includes: a tray body including a main surface with a first diameter and having a wafer installation region, where a wafer with a second diameter less than that of the first diameter can be installed, defined on the main surface; and a wafer guide discretely provided to the main surface while being adjacent to the contour of the wafer installation region at the outside of the wafer installation region. The wafer guide includes a rear surface and an apex, the rear surface being in contact with the main surface to be fixed, and the position of the apex being higher than the main surface.SELECTED DRAWING: Figure 1
【課題】半導体製造装置の改造を行うことなく異なる口径を有する複数のウエハを処理できるウエハトレイの提供を目的とする。【解決手段】本発明に係るウエハトレイは、第１の径を有する主面を備え、第１の径よりも小さな第２の径を有するウエハが設置可能なウエハ設置領域が主面上に規定されたトレイ本体と、ウエハ設置領域の外側でかつウエハ設置領域の輪郭に隣接して主面に離散的に設けられたウエハガイドとを備え、ウエハガイドは、裏面と頂部とを含み、裏面が主面に接して固定され、頂部の位置が主面よりも高い。【選択図】図１</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKd3RzDVIICXKM5GFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgaG5kaGRkYWRo7GRCkCAIl5HDA</recordid><startdate>20171130</startdate><enddate>20171130</enddate><creator>SEKIYA KOICHI</creator><creator>TOKURA YUJI</creator><scope>EVB</scope></search><sort><creationdate>20171130</creationdate><title>WAFER TRAY</title><author>SEKIYA KOICHI ; TOKURA YUJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2017212282A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SEKIYA KOICHI</creatorcontrib><creatorcontrib>TOKURA YUJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SEKIYA KOICHI</au><au>TOKURA YUJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WAFER TRAY</title><date>2017-11-30</date><risdate>2017</risdate><abstract>PROBLEM TO BE SOLVED: To provide a wafer tray capable of processing a plurality of wafers having different diameters to each other without modifying a semiconductor manufacturing device.SOLUTION: A wafer tray according to the present invention includes: a tray body including a main surface with a first diameter and having a wafer installation region, where a wafer with a second diameter less than that of the first diameter can be installed, defined on the main surface; and a wafer guide discretely provided to the main surface while being adjacent to the contour of the wafer installation region at the outside of the wafer installation region. The wafer guide includes a rear surface and an apex, the rear surface being in contact with the main surface to be fixed, and the position of the apex being higher than the main surface.SELECTED DRAWING: Figure 1
【課題】半導体製造装置の改造を行うことなく異なる口径を有する複数のウエハを処理できるウエハトレイの提供を目的とする。【解決手段】本発明に係るウエハトレイは、第１の径を有する主面を備え、第１の径よりも小さな第２の径を有するウエハが設置可能なウエハ設置領域が主面上に規定されたトレイ本体と、ウエハ設置領域の外側でかつウエハ設置領域の輪郭に隣接して主面に離散的に設けられたウエハガイドとを備え、ウエハガイドは、裏面と頂部とを含み、裏面が主面に接して固定され、頂部の位置が主面よりも高い。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | WAFER TRAY |
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