POWER DISTRIBUTION BOARD

PROBLEM TO BE SOLVED: To provide a power distribution board which achieves excellent adhesive force between a bus bar and a heat radiation member.SOLUTION: A power distribution board includes a bus bar and a heat radiation member which is disposed on one surface of the bus bar through an adhesive la...

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Bibliographische Detailangaben
Hauptverfasser:	O MUNSOKU, HIRATANI SHUNGO, OBARA KAZUHITO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a power distribution board which achieves excellent adhesive force between a bus bar and a heat radiation member.SOLUTION: A power distribution board includes a bus bar and a heat radiation member which is disposed on one surface of the bus bar through an adhesive layer. The bus bar opens at the adhesive layer side and includes recessed parts which are filled with a constituent material of the adhesive layer.SELECTED DRAWING: Figure 1 【課題】バスバーと放熱部材との接着力に優れる配電基板を提供する。【解決手段】バスバーと、前記バスバーの一面に接着層を介して配置される放熱部材とを備え、前記バスバーは、前記接着層側に開口すると共に、前記接着層の構成材料が充填される凹部を備える配電基板。【選択図】図１