COMPONENT MOUNTING BOARD, MANUFACTURING METHOD OF COMPONENT MOUNTING BOARD
PROBLEM TO BE SOLVED: To allow for easy formation of a conductor pattern, different from a conductor to which a component is joined, while joining a component placed on the surface of a circuit board to a conductor of the inner layer of the circuit board.SOLUTION: A component mounting board 10 inclu...
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| description | PROBLEM TO BE SOLVED: To allow for easy formation of a conductor pattern, different from a conductor to which a component is joined, while joining a component placed on the surface of a circuit board to a conductor of the inner layer of the circuit board.SOLUTION: A component mounting board 10 includes a circuit board 20 having the front side and back side, and a surface mounting component 30 having a terminal conductor 32 for mounting. The circuit board 20 is formed by laminating a first resin layer 211 having a conductor placed on one side, and multiple second resin layers 212-216 each having a conductor placed on one side. The side in the first resin layer 211 where a conductor is placed is the front surface of the circuit board 20. The first resin layer 211 includes a through hole 230 for exposing the mounting land, that is joined to the terminal conductor 32 for mounting on the second resin layer 212, to the surface of the circuit board 20. The conductor formed on the first resin layer 211 is a shield conductor 240.SELECTED DRAWING: Figure 1
【課題】回路基板の表面に配置された部品を回路基板の内層の導体に接合しながら、部品が接合される導体とは異なる導体パターンを回路基板の表面に容易に形成できる。【解決手段】部品実装基板１０は、表面と裏面とを有する回路基板２０と、実装用端子導体３２を有する表面実装部品３０と、を備える。回路基板２０は、片面に導体が配置された第１の樹脂層２１１と、片面に導体が配置された複数の第２の樹脂層２１２−２１６とが積層されてなる。第１の樹脂層２１１における導体が配置された面は、回路基板２０の表面である。第１の樹脂層２１１は、第２の樹脂層２１２の導体における実装用端子導体３２に接合される実装用ランド部を回路基板２０の表面に露出する貫通孔２３０を備える。第１の樹脂層２１１に形成された導体は、シールド導体２４０である。【選択図】 図１ |
| format | Patent |
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【課題】回路基板の表面に配置された部品を回路基板の内層の導体に接合しながら、部品が接合される導体とは異なる導体パターンを回路基板の表面に容易に形成できる。【解決手段】部品実装基板１０は、表面と裏面とを有する回路基板２０と、実装用端子導体３２を有する表面実装部品３０と、を備える。回路基板２０は、片面に導体が配置された第１の樹脂層２１１と、片面に導体が配置された複数の第２の樹脂層２１２−２１６とが積層されてなる。第１の樹脂層２１１における導体が配置された面は、回路基板２０の表面である。第１の樹脂層２１１は、第２の樹脂層２１２の導体における実装用端子導体３２に接合される実装用ランド部を回路基板２０の表面に露出する貫通孔２３０を備える。第１の樹脂層２１１に形成された導体は、シールド導体２４０である。【選択図】 図１</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171116&DB=EPODOC&CC=JP&NR=2017204490A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171116&DB=EPODOC&CC=JP&NR=2017204490A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NOMA JUNJI</creatorcontrib><title>COMPONENT MOUNTING BOARD, MANUFACTURING METHOD OF COMPONENT MOUNTING BOARD</title><description>PROBLEM TO BE SOLVED: To allow for easy formation of a conductor pattern, different from a conductor to which a component is joined, while joining a component placed on the surface of a circuit board to a conductor of the inner layer of the circuit board.SOLUTION: A component mounting board 10 includes a circuit board 20 having the front side and back side, and a surface mounting component 30 having a terminal conductor 32 for mounting. The circuit board 20 is formed by laminating a first resin layer 211 having a conductor placed on one side, and multiple second resin layers 212-216 each having a conductor placed on one side. The side in the first resin layer 211 where a conductor is placed is the front surface of the circuit board 20. The first resin layer 211 includes a through hole 230 for exposing the mounting land, that is joined to the terminal conductor 32 for mounting on the second resin layer 212, to the surface of the circuit board 20. The conductor formed on the first resin layer 211 is a shield conductor 240.SELECTED DRAWING: Figure 1
【課題】回路基板の表面に配置された部品を回路基板の内層の導体に接合しながら、部品が接合される導体とは異なる導体パターンを回路基板の表面に容易に形成できる。【解決手段】部品実装基板１０は、表面と裏面とを有する回路基板２０と、実装用端子導体３２を有する表面実装部品３０と、を備える。回路基板２０は、片面に導体が配置された第１の樹脂層２１１と、片面に導体が配置された複数の第２の樹脂層２１２−２１６とが積層されてなる。第１の樹脂層２１１における導体が配置された面は、回路基板２０の表面である。第１の樹脂層２１１は、第２の樹脂層２１２の導体における実装用端子導体３２に接合される実装用ランド部を回路基板２０の表面に露出する貫通孔２３０を備える。第１の樹脂層２１１に形成された導体は、シールド導体２４０である。【選択図】 図１</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPBy9vcN8Pdz9QtR8PUP9Qvx9HNXcPJ3DHLRUfB19At1c3QOCQ0CCfq6hnj4uyj4uyng0sHDwJqWmFOcyguluRmU3FxDnD10Uwvy41OLCxKTU_NSS-K9AowMDM2NDExMLA0cjYlSBADasi4N</recordid><startdate>20171116</startdate><enddate>20171116</enddate><creator>NOMA JUNJI</creator><scope>EVB</scope></search><sort><creationdate>20171116</creationdate><title>COMPONENT MOUNTING BOARD, MANUFACTURING METHOD OF COMPONENT MOUNTING BOARD</title><author>NOMA JUNJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2017204490A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>NOMA JUNJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NOMA JUNJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COMPONENT MOUNTING BOARD, MANUFACTURING METHOD OF COMPONENT MOUNTING BOARD</title><date>2017-11-16</date><risdate>2017</risdate><abstract>PROBLEM TO BE SOLVED: To allow for easy formation of a conductor pattern, different from a conductor to which a component is joined, while joining a component placed on the surface of a circuit board to a conductor of the inner layer of the circuit board.SOLUTION: A component mounting board 10 includes a circuit board 20 having the front side and back side, and a surface mounting component 30 having a terminal conductor 32 for mounting. The circuit board 20 is formed by laminating a first resin layer 211 having a conductor placed on one side, and multiple second resin layers 212-216 each having a conductor placed on one side. The side in the first resin layer 211 where a conductor is placed is the front surface of the circuit board 20. The first resin layer 211 includes a through hole 230 for exposing the mounting land, that is joined to the terminal conductor 32 for mounting on the second resin layer 212, to the surface of the circuit board 20. The conductor formed on the first resin layer 211 is a shield conductor 240.SELECTED DRAWING: Figure 1
【課題】回路基板の表面に配置された部品を回路基板の内層の導体に接合しながら、部品が接合される導体とは異なる導体パターンを回路基板の表面に容易に形成できる。【解決手段】部品実装基板１０は、表面と裏面とを有する回路基板２０と、実装用端子導体３２を有する表面実装部品３０と、を備える。回路基板２０は、片面に導体が配置された第１の樹脂層２１１と、片面に導体が配置された複数の第２の樹脂層２１２−２１６とが積層されてなる。第１の樹脂層２１１における導体が配置された面は、回路基板２０の表面である。第１の樹脂層２１１は、第２の樹脂層２１２の導体における実装用端子導体３２に接合される実装用ランド部を回路基板２０の表面に露出する貫通孔２３０を備える。第１の樹脂層２１１に形成された導体は、シールド導体２４０である。【選択図】 図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | COMPONENT MOUNTING BOARD, MANUFACTURING METHOD OF COMPONENT MOUNTING BOARD |
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