METHOD FOR MANUFACTURING MEASURING APPARATUS AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a measuring apparatus and a method for measuring a semiconductor device which can accurately measure the characteristics of the semiconductor device.SOLUTION: The measuring apparatus includes: a lower housing with a recess; and a pressing part above the lower housing; the pressing part having a body pressing unit above the recess facing the recess, a backward part surrounded by the body pressing part and located more separately from the recess than the body pressing unit is, and a lead pressing part at a side of the body pressing part, the region surrounded by the body pressing part and the backward part being an empty space.SELECTED DRAWING: Figure 1 【課題】本発明は、半導体素子の特性を正確に測定できる測定装置、及び半導体素子の測定方法を提供することを目的とする。【解決手段】凹部が設けられた下部筐体と、該下部筐体の上方に設けられた押さえ部と、を備え、該押さえ部は、該凹部の上方に位置し該凹部に対向する本体押さえと、該本体押さえに囲まれ該本体押さえより該凹部から離れた後退部と、該本体押さえの横に設けられたリード押さえと、を有し、該本体押さえと該後退部に囲まれた領域は空間になっていることを特徴とする。【選択図】図１