COIL ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a coil electronic component having a higher rigidity.SOLUTION: A coil electronic component includes: a body 110 that includes a coil layer, and a reinforcement layer 112 placed on at least one of an upper part and a lower part of the coil layer; and an external elect...

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Bibliographische Detailangaben
Hauptverfasser: KIM TAE HOON, LEE HAN, KANG MYUNG SAM, HWANG MI SUN, JO DAE HUI, AHN SEOK HWAN, CHO JEONG MIN
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a coil electronic component having a higher rigidity.SOLUTION: A coil electronic component includes: a body 110 that includes a coil layer, and a reinforcement layer 112 placed on at least one of an upper part and a lower part of the coil layer; and an external electrode formed outside the body 110. The coil layer includes an insulating layer 111, a coil pattern 121, and a first conductive via 123 penetrating through the insulating layer 111 and coupled with the coil pattern 121. The reinforcement layer 112 has a structure with a higher rigidity than that of the insulating layer 111.SELECTED DRAWING: Figure 2 【課題】より高い剛性を有するコイル電子部品を提供する。【解決手段】コイル電子部品は、コイル層及びコイル層の上部及び下部のうち少なくとも一つに配置された補強層112を含むボディ110と、ボディ110の外部に形成された外部電極と、を含む。コイル層は、絶縁層111、コイルパターン121及び絶縁層111を貫通してコイルパターン121と連結された第1の導電性ビア123を含む。補強層112は、絶縁層111より剛性が高い構造である。【選択図】図2