LED LIGHT-EMITTING DEVICE

PROBLEM TO BE SOLVED: To provide a light-emitting device that can be used as a general light source for illumination, which has a small size and higher luminance without decreasing the luminous efficiency.SOLUTION: A light-emitting device includes a substrate, a plurality of LED elements mounted on...

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description PROBLEM TO BE SOLVED: To provide a light-emitting device that can be used as a general light source for illumination, which has a small size and higher luminance without decreasing the luminous efficiency.SOLUTION: A light-emitting device includes a substrate, a plurality of LED elements mounted on an upper surface of the substrate, a frame provided to surround the plurality of LED elements, a wavelength conversion member held by the frame and placed apart from an emission surface of the LED element, and a light-transmitting thermally conductive member that connects between a lower surface of the wavelength conversion member and the upper surface of the substrate. The substrate has a two-layer structure, and is formed of the light-transmitting thermally conductive member that connects through the substrate on the upper layer side between the lower surface of the wavelength conversion member and the upper surface of the substrate. Thus, the excited heat of the fluorescent body in the wavelength conversion member can be dissipated to the substrate efficiently, and therefore, the luminance can be increased without decreasing the luminous efficiency.SELECTED DRAWING: Figure 1 【課題】小型でありながら、発光効率を低下させることなく輝度を高めると共に一般的な照明用光源として使用できる発光装置が望まれていた。【解決手段】基板と、基板の上面に実装された複数のLED素子と、複数のLED素子を取り囲むように設けられた枠体と、枠体に保持されてLED素子の発光面から離間して載置された波長変換部材と、波長変換部材の下面と基板の上面とを接続する透光性の熱伝導部材とで構成した。また、基板を二層構造とし、波長変換部材の下面と下層側の基板の上面とを、上層側の基板を貫通して接続する透光性の熱伝導性部材とで構成した。これにより、波長変換部材内の蛍光体の励起熱を効率的に基板に逃がすことができるので、発光効率を低下させることなく輝度を高めることができる。【選択図】図1
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Thus, the excited heat of the fluorescent body in the wavelength conversion member can be dissipated to the substrate efficiently, and therefore, the luminance can be increased without decreasing the luminous efficiency.SELECTED DRAWING: Figure 1 【課題】小型でありながら、発光効率を低下させることなく輝度を高めると共に一般的な照明用光源として使用できる発光装置が望まれていた。【解決手段】基板と、基板の上面に実装された複数のLED素子と、複数のLED素子を取り囲むように設けられた枠体と、枠体に保持されてLED素子の発光面から離間して載置された波長変換部材と、波長変換部材の下面と基板の上面とを接続する透光性の熱伝導部材とで構成した。また、基板を二層構造とし、波長変換部材の下面と下層側の基板の上面とを、上層側の基板を貫通して接続する透光性の熱伝導性部材とで構成した。これにより、波長変換部材内の蛍光体の励起熱を効率的に基板に逃がすことができるので、発光効率を低下させることなく輝度を高めることができる。【選択図】図1</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20171005&amp;DB=EPODOC&amp;CC=JP&amp;NR=2017183301A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20171005&amp;DB=EPODOC&amp;CC=JP&amp;NR=2017183301A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HIROSE GOICHIRO</creatorcontrib><title>LED LIGHT-EMITTING DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a light-emitting device that can be used as a general light source for illumination, which has a small size and higher luminance without decreasing the luminous efficiency.SOLUTION: A light-emitting device includes a substrate, a plurality of LED elements mounted on an upper surface of the substrate, a frame provided to surround the plurality of LED elements, a wavelength conversion member held by the frame and placed apart from an emission surface of the LED element, and a light-transmitting thermally conductive member that connects between a lower surface of the wavelength conversion member and the upper surface of the substrate. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title LED LIGHT-EMITTING DEVICE
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