MULTILAYER POLYIMIDE FILM AND METHOD FOR MANUFACTURING MULTILAYER POLYIMIDE FILM
PROBLEM TO BE SOLVED: To provide a polyimide film that can suppress cracks when a metal-clad laminate is formed by providing a metal layer on a polyimide film and further a flexible printed wiring board is manufactured continuously by a roll-to-roll method by using the metal-clad laminate.SOLUTION:...
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| creator | USHIRO HIROYUKI SAITO JUMPEI HOSOGAI SEIJI |
| description | PROBLEM TO BE SOLVED: To provide a polyimide film that can suppress cracks when a metal-clad laminate is formed by providing a metal layer on a polyimide film and further a flexible printed wiring board is manufactured continuously by a roll-to-roll method by using the metal-clad laminate.SOLUTION: A multilayer polyimide film has a thermoplastic polyimide layer on at least one surface of a non-thermoplastic polyimide layer and attains a breaking strength retention of 80% or more when performing a tensile test before and after immersing in water to measure a breaking strength retention. In the multilayer polyimide film, it is preferable that the breaking strength of the multilayer polyimide film before immersing in water is 200 MPa or more. A polyamic acid which is a precursor of a non-plastic polyimide film preferably includes at least 3,3',4,4'-biphenyltetracarboxylic acid dianhydride as an acid dianhydride and includes at least one of m-tolidine and phenylenediamine as a diamine.SELECTED DRAWING: None
【課題】ポリイミドフィルムに金属層を設けて金属張積層板とし、更にロールツーロール式で連続的にフレキシブルプリント配線版を製造する際に、クラックを抑制できるようなポリイミドフィルムの提供。【解決手段】非熱可塑性ポリイミド層の少なくとも片面に熱可塑性ポリイミド層を有する多層ポリイミドフィルムであって、水に浸漬前後の引張試験を行い、破断強度保持率を測定したときに、破断強度保持率が８０％以上となっている金属張積層板。水に浸漬前の多層ポリイミドフィルムの破断強度が２００ＭＰａ以上であることが好ましい多層ポリイミドフィルム。非加塑性ポリイミドフィルムの前駆体であるポリアミド酸が、好ましくは、酸二無水物として３，３'，４，４'−ビフェニルテトラカルボン酸二無水物を少なくとも含み、ジアミンとしてｍ−トリジン又はフェニレンジアミンの少なくとも一方を含む多層ポリイミドフィルム。【選択図】なし |
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【課題】ポリイミドフィルムに金属層を設けて金属張積層板とし、更にロールツーロール式で連続的にフレキシブルプリント配線版を製造する際に、クラックを抑制できるようなポリイミドフィルムの提供。【解決手段】非熱可塑性ポリイミド層の少なくとも片面に熱可塑性ポリイミド層を有する多層ポリイミドフィルムであって、水に浸漬前後の引張試験を行い、破断強度保持率を測定したときに、破断強度保持率が８０％以上となっている金属張積層板。水に浸漬前の多層ポリイミドフィルムの破断強度が２００ＭＰａ以上であることが好ましい多層ポリイミドフィルム。非加塑性ポリイミドフィルムの前駆体であるポリアミド酸が、好ましくは、酸二無水物として３，３'，４，４'−ビフェニルテトラカルボン酸二無水物を少なくとも含み、ジアミンとしてｍ−トリジン又はフェニレンジアミンの少なくとも一方を含む多層ポリイミドフィルム。【選択図】なし</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171005&DB=EPODOC&CC=JP&NR=2017177601A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171005&DB=EPODOC&CC=JP&NR=2017177601A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>USHIRO HIROYUKI</creatorcontrib><creatorcontrib>SAITO JUMPEI</creatorcontrib><creatorcontrib>HOSOGAI SEIJI</creatorcontrib><title>MULTILAYER POLYIMIDE FILM AND METHOD FOR MANUFACTURING MULTILAYER POLYIMIDE FILM</title><description>PROBLEM TO BE SOLVED: To provide a polyimide film that can suppress cracks when a metal-clad laminate is formed by providing a metal layer on a polyimide film and further a flexible printed wiring board is manufactured continuously by a roll-to-roll method by using the metal-clad laminate.SOLUTION: A multilayer polyimide film has a thermoplastic polyimide layer on at least one surface of a non-thermoplastic polyimide layer and attains a breaking strength retention of 80% or more when performing a tensile test before and after immersing in water to measure a breaking strength retention. In the multilayer polyimide film, it is preferable that the breaking strength of the multilayer polyimide film before immersing in water is 200 MPa or more. A polyamic acid which is a precursor of a non-plastic polyimide film preferably includes at least 3,3',4,4'-biphenyltetracarboxylic acid dianhydride as an acid dianhydride and includes at least one of m-tolidine and phenylenediamine as a diamine.SELECTED DRAWING: None
【課題】ポリイミドフィルムに金属層を設けて金属張積層板とし、更にロールツーロール式で連続的にフレキシブルプリント配線版を製造する際に、クラックを抑制できるようなポリイミドフィルムの提供。【解決手段】非熱可塑性ポリイミド層の少なくとも片面に熱可塑性ポリイミド層を有する多層ポリイミドフィルムであって、水に浸漬前後の引張試験を行い、破断強度保持率を測定したときに、破断強度保持率が８０％以上となっている金属張積層板。水に浸漬前の多層ポリイミドフィルムの破断強度が２００ＭＰａ以上であることが好ましい多層ポリイミドフィルム。非加塑性ポリイミドフィルムの前駆体であるポリアミド酸が、好ましくは、酸二無水物として３，３'，４，４'−ビフェニルテトラカルボン酸二無水物を少なくとも含み、ジアミンとしてｍ−トリジン又はフェニレンジアミンの少なくとも一方を含む多層ポリイミドフィルム。【選択図】なし</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAjwDfUJ8fRxjHQNUgjw94n09PV0cVVw8_TxVXD0c1HwdQ3x8HdRcPMPUvB19At1c3QOCQ3y9HNXwKmNh4E1LTGnOJUXSnMzKLm5hjh76KYW5MenFhckJqfmpZbEewUYGRiaG5qbmxkYOhoTpQgA_TEv0g</recordid><startdate>20171005</startdate><enddate>20171005</enddate><creator>USHIRO HIROYUKI</creator><creator>SAITO JUMPEI</creator><creator>HOSOGAI SEIJI</creator><scope>EVB</scope></search><sort><creationdate>20171005</creationdate><title>MULTILAYER POLYIMIDE FILM AND METHOD FOR MANUFACTURING MULTILAYER POLYIMIDE FILM</title><author>USHIRO HIROYUKI ; SAITO JUMPEI ; HOSOGAI SEIJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2017177601A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2017</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>USHIRO HIROYUKI</creatorcontrib><creatorcontrib>SAITO JUMPEI</creatorcontrib><creatorcontrib>HOSOGAI SEIJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>USHIRO HIROYUKI</au><au>SAITO JUMPEI</au><au>HOSOGAI SEIJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MULTILAYER POLYIMIDE FILM AND METHOD FOR MANUFACTURING MULTILAYER POLYIMIDE FILM</title><date>2017-10-05</date><risdate>2017</risdate><abstract>PROBLEM TO BE SOLVED: To provide a polyimide film that can suppress cracks when a metal-clad laminate is formed by providing a metal layer on a polyimide film and further a flexible printed wiring board is manufactured continuously by a roll-to-roll method by using the metal-clad laminate.SOLUTION: A multilayer polyimide film has a thermoplastic polyimide layer on at least one surface of a non-thermoplastic polyimide layer and attains a breaking strength retention of 80% or more when performing a tensile test before and after immersing in water to measure a breaking strength retention. In the multilayer polyimide film, it is preferable that the breaking strength of the multilayer polyimide film before immersing in water is 200 MPa or more. A polyamic acid which is a precursor of a non-plastic polyimide film preferably includes at least 3,3',4,4'-biphenyltetracarboxylic acid dianhydride as an acid dianhydride and includes at least one of m-tolidine and phenylenediamine as a diamine.SELECTED DRAWING: None
【課題】ポリイミドフィルムに金属層を設けて金属張積層板とし、更にロールツーロール式で連続的にフレキシブルプリント配線版を製造する際に、クラックを抑制できるようなポリイミドフィルムの提供。【解決手段】非熱可塑性ポリイミド層の少なくとも片面に熱可塑性ポリイミド層を有する多層ポリイミドフィルムであって、水に浸漬前後の引張試験を行い、破断強度保持率を測定したときに、破断強度保持率が８０％以上となっている金属張積層板。水に浸漬前の多層ポリイミドフィルムの破断強度が２００ＭＰａ以上であることが好ましい多層ポリイミドフィルム。非加塑性ポリイミドフィルムの前駆体であるポリアミド酸が、好ましくは、酸二無水物として３，３'，４，４'−ビフェニルテトラカルボン酸二無水物を少なくとも含み、ジアミンとしてｍ−トリジン又はフェニレンジアミンの少なくとも一方を含む多層ポリイミドフィルム。【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING |
| title | MULTILAYER POLYIMIDE FILM AND METHOD FOR MANUFACTURING MULTILAYER POLYIMIDE FILM |
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