SOLDER COMPOSITION FOR JET DISPENSER

PROBLEM TO BE SOLVED: To provide a solder composition for jet dispenser which has sufficient applicability and continuous discharge property when performing application with the jet dispenser and can satisfactorily suppress solder scattering and flux separation.SOLUTION: There is provided a solder c...

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Hauptverfasser:	MIZUNO TAKEMI, SUGIYAMA ISAO, OUCHI KATSUTOSHI, KIYOTA TATSUYA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a solder composition for jet dispenser which has sufficient applicability and continuous discharge property when performing application with the jet dispenser and can satisfactorily suppress solder scattering and flux separation.SOLUTION: There is provided a solder composition for jet dispenser which contains a flux composition containing (A) a rosin-based resin, (B) an activator, (C) a solvent and (D) a thixotropic agent, and (E) solder powder, where a yield value of the solder composition measured by a rheometer is 10 Pa or more and 100 Pa or less.SELECTED DRAWING: None 【課題】ジェットディスペンサーにより塗布する場合に、十分な塗布性および連続吐出性を有し、かつ、はんだ飛び散りおよびフラックス分離を十分に抑制できるジェットディスペンサー用はんだ組成物を提供すること。【解決手段】本発明のジェットディスペンサー用はんだ組成物は、（Ａ）ロジン系樹脂、（Ｂ）活性剤、（Ｃ）溶剤および（Ｄ）チクソ剤を含有するフラックス組成物と、（Ｅ）はんだ粉末とを含有し、当該はんだ組成物のレオメーターにより測定した降伏値が、１０Ｐａ以上１００Ｐａ以下であることを特徴とするものである。【選択図】なし