SUBSTRATE TREATMENT DEVICE

PROBLEM TO BE SOLVED: To provide a technology enabling downsizing of a substrate treatment device and efficiency of dryness.SOLUTION: A conveyance passage includes a curve area where a substrate is curved so as to make a main surface into an inner side. A gas supply unit is configured to supplied to...

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Bibliographische Detailangaben
Hauptverfasser:	ICHIBE NOBUO, RIKUI HIDEAKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING DRYING DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM ELECTRICITY HEATING LIGHTING MECHANICAL ENGINEERING PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY WEAPONS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a technology enabling downsizing of a substrate treatment device and efficiency of dryness.SOLUTION: A conveyance passage includes a curve area where a substrate is curved so as to make a main surface into an inner side. A gas supply unit is configured to supplied to gas to the main surface passing through the curve area. A suction unit is configured to suction atmosphere of an interval held between the main surfaces before and after curve. Consequently, atmosphere is difficult to be accumulated in the interval, thereby easily accelerating dryness of coating liquid.SELECTED DRAWING: Figure 5 【課題】基材処理装置の小型化および乾燥の効率化を図ることが可能な技術を提供する。【解決手段】搬送経路が主面を内側にして基材を湾曲させる湾曲領域を含む。気体供給部が、湾曲領域を通過する前記主面に対して気体を供給する。吸気部が、湾曲前後の前記主面に挟まれた間隙の雰囲気を吸う。このため、当該間隙（基材の主面に挟まれた空間）に雰囲気が滞留し難く、塗布液の乾燥が進み易い。【選択図】図５