DEVICE FOR DIVIDING PLANAR ARTICLE

PROBLEM TO BE SOLVED: To preferably divide a planar article into a plurality of chips along a division schedule line.SOLUTION: A division device (10) is constructed by comprising division means (12) of pressing a division schedule line (W2) of a planar article (W) through a protection tape (T), and...

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description PROBLEM TO BE SOLVED: To preferably divide a planar article into a plurality of chips along a division schedule line.SOLUTION: A division device (10) is constructed by comprising division means (12) of pressing a division schedule line (W2) of a planar article (W) through a protection tape (T), and dividing the planar article into a chip (W1) along the division schedule line. The division means comprises: ejecting means (18) of ejecting and dividing the planar article from a back surface side of the planar article through the protection tape; ejecting advancing and retracting means (19) of advancing and retracting the ejecting means to the planar article; pressing means (21) of pressing the planar article opposite to the ejecting means for the planar article from an upper direction; and pressure advancing and retracting means (23) of advancing and retracting the pressure means to the planar article. The planar article is sandwiched by the ejecting means and the pressing means from a vertical direction, and is divided along the division schedule line.SELECTED DRAWING: Figure 8 【課題】分割予定ラインに沿って板状物を複数のチップに良好に分割することができるようにすること。【解決手段】板状物(W)の分割予定ライン(W2)を保護テープ(T)を介して押圧し、板状物を分割予定ラインに沿ってチップ(W1)に分割する分割手段(12)を備えて分割装置(10)が構成される。分割手段は、保護テープを介して板状物の裏面側から板状物を突き上げて分割する突き上げ手段(18)と、突き上げ手段を板状物に対して進退させる突き上げ進退手段(19)と、板状物に対して突き上げ手段と対向して板状物を上方から押圧する押圧手段(21)と、押圧手段を板状物に対して進退させる押圧進退手段(23)とを備えている。突き上げ手段と押圧手段とで板状物を上下方向から挟んで押圧して分割予定ラインに沿って分割する。【選択図】図8
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The division means comprises: ejecting means (18) of ejecting and dividing the planar article from a back surface side of the planar article through the protection tape; ejecting advancing and retracting means (19) of advancing and retracting the ejecting means to the planar article; pressing means (21) of pressing the planar article opposite to the ejecting means for the planar article from an upper direction; and pressure advancing and retracting means (23) of advancing and retracting the pressure means to the planar article. The planar article is sandwiched by the ejecting means and the pressing means from a vertical direction, and is divided along the division schedule line.SELECTED DRAWING: Figure 8 【課題】分割予定ラインに沿って板状物を複数のチップに良好に分割することができるようにすること。【解決手段】板状物(W)の分割予定ライン(W2)を保護テープ(T)を介して押圧し、板状物を分割予定ラインに沿ってチップ(W1)に分割する分割手段(12)を備えて分割装置(10)が構成される。分割手段は、保護テープを介して板状物の裏面側から板状物を突き上げて分割する突き上げ手段(18)と、突き上げ手段を板状物に対して進退させる突き上げ進退手段(19)と、板状物に対して突き上げ手段と対向して板状物を上方から押圧する押圧手段(21)と、押圧手段を板状物に対して進退させる押圧進退手段(23)とを備えている。突き上げ手段と押圧手段とで板状物を上下方向から挟んで押圧して分割予定ラインに沿って分割する。【選択図】図8</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170831&amp;DB=EPODOC&amp;CC=JP&amp;NR=2017152524A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76304</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170831&amp;DB=EPODOC&amp;CC=JP&amp;NR=2017152524A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHRIS MIHAI</creatorcontrib><title>DEVICE FOR DIVIDING PLANAR ARTICLE</title><description>PROBLEM TO BE SOLVED: To preferably divide a planar article into a plurality of chips along a division schedule line.SOLUTION: A division device (10) is constructed by comprising division means (12) of pressing a division schedule line (W2) of a planar article (W) through a protection tape (T), and dividing the planar article into a chip (W1) along the division schedule line. The division means comprises: ejecting means (18) of ejecting and dividing the planar article from a back surface side of the planar article through the protection tape; ejecting advancing and retracting means (19) of advancing and retracting the ejecting means to the planar article; pressing means (21) of pressing the planar article opposite to the ejecting means for the planar article from an upper direction; and pressure advancing and retracting means (23) of advancing and retracting the pressure means to the planar article. The planar article is sandwiched by the ejecting means and the pressing means from a vertical direction, and is divided along the division schedule line.SELECTED DRAWING: Figure 8 【課題】分割予定ラインに沿って板状物を複数のチップに良好に分割することができるようにすること。【解決手段】板状物(W)の分割予定ライン(W2)を保護テープ(T)を介して押圧し、板状物を分割予定ラインに沿ってチップ(W1)に分割する分割手段(12)を備えて分割装置(10)が構成される。分割手段は、保護テープを介して板状物の裏面側から板状物を突き上げて分割する突き上げ手段(18)と、突き上げ手段を板状物に対して進退させる突き上げ進退手段(19)と、板状物に対して突き上げ手段と対向して板状物を上方から押圧する押圧手段(21)と、押圧手段を板状物に対して進退させる押圧進退手段(23)とを備えている。突き上げ手段と押圧手段とで板状物を上下方向から挟んで押圧して分割予定ラインに沿って分割する。【選択図】図8</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFBycQ3zdHZVcPMPUnDxDPN08fRzVwjwcfRzDFJwDArxdPZx5WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgaG5oamRqZGJo7GRCkCAGAnIp4</recordid><startdate>20170831</startdate><enddate>20170831</enddate><creator>CHRIS MIHAI</creator><scope>EVB</scope></search><sort><creationdate>20170831</creationdate><title>DEVICE FOR DIVIDING PLANAR ARTICLE</title><author>CHRIS MIHAI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2017152524A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHRIS MIHAI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHRIS MIHAI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DEVICE FOR DIVIDING PLANAR ARTICLE</title><date>2017-08-31</date><risdate>2017</risdate><abstract>PROBLEM TO BE SOLVED: To preferably divide a planar article into a plurality of chips along a division schedule line.SOLUTION: A division device (10) is constructed by comprising division means (12) of pressing a division schedule line (W2) of a planar article (W) through a protection tape (T), and dividing the planar article into a chip (W1) along the division schedule line. The division means comprises: ejecting means (18) of ejecting and dividing the planar article from a back surface side of the planar article through the protection tape; ejecting advancing and retracting means (19) of advancing and retracting the ejecting means to the planar article; pressing means (21) of pressing the planar article opposite to the ejecting means for the planar article from an upper direction; and pressure advancing and retracting means (23) of advancing and retracting the pressure means to the planar article. The planar article is sandwiched by the ejecting means and the pressing means from a vertical direction, and is divided along the division schedule line.SELECTED DRAWING: Figure 8 【課題】分割予定ラインに沿って板状物を複数のチップに良好に分割することができるようにすること。【解決手段】板状物(W)の分割予定ライン(W2)を保護テープ(T)を介して押圧し、板状物を分割予定ラインに沿ってチップ(W1)に分割する分割手段(12)を備えて分割装置(10)が構成される。分割手段は、保護テープを介して板状物の裏面側から板状物を突き上げて分割する突き上げ手段(18)と、突き上げ手段を板状物に対して進退させる突き上げ進退手段(19)と、板状物に対して突き上げ手段と対向して板状物を上方から押圧する押圧手段(21)と、押圧手段を板状物に対して進退させる押圧進退手段(23)とを備えている。突き上げ手段と押圧手段とで板状物を上下方向から挟んで押圧して分割予定ラインに沿って分割する。【選択図】図8</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title DEVICE FOR DIVIDING PLANAR ARTICLE
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