RETAINER RING, POLISHING DEVICE USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a retainer ring that enables uniform distribution of a polishing material on a wafer surface.SOLUTION: A retainer ring 11 used for polishing processing of a semiconductor wafer has: a groove 111 formed on a contact surface 115 with a polishing pad, and configured to...
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| creator | TOYOFUKU TAKESHI AKABOSHI FUMIHIKO |
| description | PROBLEM TO BE SOLVED: To provide a retainer ring that enables uniform distribution of a polishing material on a wafer surface.SOLUTION: A retainer ring 11 used for polishing processing of a semiconductor wafer has: a groove 111 formed on a contact surface 115 with a polishing pad, and configured to take a slurry in a ring and exhaust it to an opposite side; and slurry diffusion means 15 provided on a ring outer wall 112. Even in a case where the contact surface is worn as the polishing processing progresses, a flow is facilitated by the diffusion means to prevent a slip, and thereby, the slurry can be uniformly distributed on a wafer surface.SELECTED DRAWING: Figure 5
【課題】ウェーハ表面に研磨材を均一に分布させることができるリテーナリングを提供する。【解決手段】半導体ウェーハの研磨処理に用いられるリテーナリング１１は、研磨パッドとの接触面１１５に形成され、スラリーをリングの内側に取り込み反対側に掃出する溝１１１と、リング外壁１１２に設けられるスラリー拡散手段１５とを有する。研磨処理の進行につれて接触面が摩耗した場合でも拡散手段によって流れを促進することでスリップを防止し、スラリーををウェーハ面に均一に分布させる。【選択図】図５ |
| format | Patent |
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【課題】ウェーハ表面に研磨材を均一に分布させることができるリテーナリングを提供する。【解決手段】半導体ウェーハの研磨処理に用いられるリテーナリング１１は、研磨パッドとの接触面１１５に形成され、スラリーをリングの内側に取り込み反対側に掃出する溝１１１と、リング外壁１１２に設けられるスラリー拡散手段１５とを有する。研磨処理の進行につれて接触面が摩耗した場合でも拡散手段によって流れを促進することでスリップを防止し、スラリーををウェーハ面に均一に分布させる。【選択図】図５</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170831&DB=EPODOC&CC=JP&NR=2017152473A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170831&DB=EPODOC&CC=JP&NR=2017152473A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TOYOFUKU TAKESHI</creatorcontrib><creatorcontrib>AKABOSHI FUMIHIKO</creatorcontrib><title>RETAINER RING, POLISHING DEVICE USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a retainer ring that enables uniform distribution of a polishing material on a wafer surface.SOLUTION: A retainer ring 11 used for polishing processing of a semiconductor wafer has: a groove 111 formed on a contact surface 115 with a polishing pad, and configured to take a slurry in a ring and exhaust it to an opposite side; and slurry diffusion means 15 provided on a ring outer wall 112. Even in a case where the contact surface is worn as the polishing processing progresses, a flow is facilitated by the diffusion means to prevent a slip, and thereby, the slurry can be uniformly distributed on a wafer surface.SELECTED DRAWING: Figure 5
【課題】ウェーハ表面に研磨材を均一に分布させることができるリテーナリングを提供する。【解決手段】半導体ウェーハの研磨処理に用いられるリテーナリング１１は、研磨パッドとの接触面１１５に形成され、スラリーをリングの内側に取り込み反対側に掃出する溝１１１と、リング外壁１１２に設けられるスラリー拡散手段１５とを有する。研磨処理の進行につれて接触面が摩耗した場合でも拡散手段によって流れを促進することでスリップを防止し、スラリーををウェーハ面に均一に分布させる。【選択図】図５</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjMsKwjAURLNxIeo_XFxXsK3S9SW5MRGTlDzc1iJxJVqo_48W-gGuZg7MmSW7eYqoLXnw2p4KaN1FB_WrIOiqOUEKE0RFENBQAWgFGIrKCXASDNokkcc02RDIaO6sSDw6Px-s2eLRP8e8mXPFtpIiV7s8vLs8Dv09v_KnO7fVvmzKY3Voaqz_Gn0BteYzkw</recordid><startdate>20170831</startdate><enddate>20170831</enddate><creator>TOYOFUKU TAKESHI</creator><creator>AKABOSHI FUMIHIKO</creator><scope>EVB</scope></search><sort><creationdate>20170831</creationdate><title>RETAINER RING, POLISHING DEVICE USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE</title><author>TOYOFUKU TAKESHI ; AKABOSHI FUMIHIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2017152473A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>TOYOFUKU TAKESHI</creatorcontrib><creatorcontrib>AKABOSHI FUMIHIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TOYOFUKU TAKESHI</au><au>AKABOSHI FUMIHIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RETAINER RING, POLISHING DEVICE USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE</title><date>2017-08-31</date><risdate>2017</risdate><abstract>PROBLEM TO BE SOLVED: To provide a retainer ring that enables uniform distribution of a polishing material on a wafer surface.SOLUTION: A retainer ring 11 used for polishing processing of a semiconductor wafer has: a groove 111 formed on a contact surface 115 with a polishing pad, and configured to take a slurry in a ring and exhaust it to an opposite side; and slurry diffusion means 15 provided on a ring outer wall 112. Even in a case where the contact surface is worn as the polishing processing progresses, a flow is facilitated by the diffusion means to prevent a slip, and thereby, the slurry can be uniformly distributed on a wafer surface.SELECTED DRAWING: Figure 5
【課題】ウェーハ表面に研磨材を均一に分布させることができるリテーナリングを提供する。【解決手段】半導体ウェーハの研磨処理に用いられるリテーナリング１１は、研磨パッドとの接触面１１５に形成され、スラリーをリングの内側に取り込み反対側に掃出する溝１１１と、リング外壁１１２に設けられるスラリー拡散手段１５とを有する。研磨処理の進行につれて接触面が摩耗した場合でも拡散手段によって流れを促進することでスリップを防止し、スラリーををウェーハ面に均一に分布させる。【選択図】図５</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | RETAINER RING, POLISHING DEVICE USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
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