HIGH FREQUENCY PACKAGE

PROBLEM TO BE SOLVED: To provide a high frequency package capable of preventing increase of area of a lamination substrate while ensuring electromagnetic interference characteristics thereof.SOLUTION: A high frequency package 20 includes a monolithic microwave integrated circuit 3 mounted on a first lamination substrate 1, which has a stub via 15 which is branched from a signal pattern 8 for transmitting a bias signal for operating the monolithic microwave integrated circuit 3. The length of the stub via 15 is a quarter of the wavelength of the frequency used by the monolithic microwave integrated circuit 3.SELECTED DRAWING: Figure 1 【課題】電磁妨害特性を確保しつつ積層基板の面積の増大を抑制した高周波パッケージを得ること。【解決手段】第１の積層基板１に実装されたモノリシックマイクロ波集積回路３を有する高周波パッケージ２０であって、モノリシックマイクロ波集積回路３を動作させるバイアス信号を伝える信号用パターン８から分岐するスタブビア１５を有し、スタブビア１５の長さは、モノリシックマイクロ波集積回路３の使用周波数の波長の４分の１である。【選択図】図１