JOINING METHOD USING LASER

PROBLEM TO BE SOLVED: To provide a solid-phase joining method applicable without depending on a material, a shape or the like of a material to be joined, especially, which is a simple solid-phase joining method using laser as a heat source.SOLUTION: There is provided a method for joining each of two...

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Hauptverfasser: KONDO KATSUYOSHI, HIMI FUTOSHI, SUGINO TAKESHI, KAWAHITO YOSUKE, OTSUBO MASAYUKI
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Sprache:eng ; jpn
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creator KONDO KATSUYOSHI
HIMI FUTOSHI
SUGINO TAKESHI
KAWAHITO YOSUKE
OTSUBO MASAYUKI
description PROBLEM TO BE SOLVED: To provide a solid-phase joining method applicable without depending on a material, a shape or the like of a material to be joined, especially, which is a simple solid-phase joining method using laser as a heat source.SOLUTION: There is provided a method for joining each of two or more materials to be joined. The joining method includes the first step for applying specular working to a surface to be joined of at least one material to be joined, the second step for forming an interface to be joined by allowing each surface to be joined of the materials to be joined to adhere to each other, and the third step for heating the interface to be joined by irradiation of laser.SELECTED DRAWING: Figure 1 【課題】被接合材の材質及び形状等に依らず適用可能な固相接合方法であって、特に、レーザを熱源とする簡便な固相接合方法を提案する。【解決手段】2以上の被接合材同士を接合する方法であって、少なくとも一つの被接合材の被接合面に鏡面加工を施す第一工程と、被接合材の被接合面同士を密着させて被接合界面を形成させる第二工程と、レーザの照射によって被接合界面を加熱する第三工程と、を含むこと、を特徴とする接合方法。【選択図】図1
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2017104877A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2017104877A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2017104877A3</originalsourceid><addsrcrecordid>eNrjZJDy8vf08_RzV_B1DfHwd1EIDQZxfByDXYN4GFjTEnOKU3mhNDeDkptriLOHbmpBfnxqcUFicmpeakm8V4CRgaG5oYGJhbm5ozFRigBsYiCr</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>JOINING METHOD USING LASER</title><source>esp@cenet</source><creator>KONDO KATSUYOSHI ; HIMI FUTOSHI ; SUGINO TAKESHI ; KAWAHITO YOSUKE ; OTSUBO MASAYUKI</creator><creatorcontrib>KONDO KATSUYOSHI ; HIMI FUTOSHI ; SUGINO TAKESHI ; KAWAHITO YOSUKE ; OTSUBO MASAYUKI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a solid-phase joining method applicable without depending on a material, a shape or the like of a material to be joined, especially, which is a simple solid-phase joining method using laser as a heat source.SOLUTION: There is provided a method for joining each of two or more materials to be joined. The joining method includes the first step for applying specular working to a surface to be joined of at least one material to be joined, the second step for forming an interface to be joined by allowing each surface to be joined of the materials to be joined to adhere to each other, and the third step for heating the interface to be joined by irradiation of laser.SELECTED DRAWING: Figure 1 【課題】被接合材の材質及び形状等に依らず適用可能な固相接合方法であって、特に、レーザを熱源とする簡便な固相接合方法を提案する。【解決手段】2以上の被接合材同士を接合する方法であって、少なくとも一つの被接合材の被接合面に鏡面加工を施す第一工程と、被接合材の被接合面同士を密着させて被接合界面を形成させる第二工程と、レーザの照射によって被接合界面を加熱する第三工程と、を含むこと、を特徴とする接合方法。【選択図】図1</description><language>eng ; jpn</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170615&amp;DB=EPODOC&amp;CC=JP&amp;NR=2017104877A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170615&amp;DB=EPODOC&amp;CC=JP&amp;NR=2017104877A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KONDO KATSUYOSHI</creatorcontrib><creatorcontrib>HIMI FUTOSHI</creatorcontrib><creatorcontrib>SUGINO TAKESHI</creatorcontrib><creatorcontrib>KAWAHITO YOSUKE</creatorcontrib><creatorcontrib>OTSUBO MASAYUKI</creatorcontrib><title>JOINING METHOD USING LASER</title><description>PROBLEM TO BE SOLVED: To provide a solid-phase joining method applicable without depending on a material, a shape or the like of a material to be joined, especially, which is a simple solid-phase joining method using laser as a heat source.SOLUTION: There is provided a method for joining each of two or more materials to be joined. The joining method includes the first step for applying specular working to a surface to be joined of at least one material to be joined, the second step for forming an interface to be joined by allowing each surface to be joined of the materials to be joined to adhere to each other, and the third step for heating the interface to be joined by irradiation of laser.SELECTED DRAWING: Figure 1 【課題】被接合材の材質及び形状等に依らず適用可能な固相接合方法であって、特に、レーザを熱源とする簡便な固相接合方法を提案する。【解決手段】2以上の被接合材同士を接合する方法であって、少なくとも一つの被接合材の被接合面に鏡面加工を施す第一工程と、被接合材の被接合面同士を密着させて被接合界面を形成させる第二工程と、レーザの照射によって被接合界面を加熱する第三工程と、を含むこと、を特徴とする接合方法。【選択図】図1</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJDy8vf08_RzV_B1DfHwd1EIDQZxfByDXYN4GFjTEnOKU3mhNDeDkptriLOHbmpBfnxqcUFicmpeakm8V4CRgaG5oYGJhbm5ozFRigBsYiCr</recordid><startdate>20170615</startdate><enddate>20170615</enddate><creator>KONDO KATSUYOSHI</creator><creator>HIMI FUTOSHI</creator><creator>SUGINO TAKESHI</creator><creator>KAWAHITO YOSUKE</creator><creator>OTSUBO MASAYUKI</creator><scope>EVB</scope></search><sort><creationdate>20170615</creationdate><title>JOINING METHOD USING LASER</title><author>KONDO KATSUYOSHI ; HIMI FUTOSHI ; SUGINO TAKESHI ; KAWAHITO YOSUKE ; OTSUBO MASAYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2017104877A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2017</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>KONDO KATSUYOSHI</creatorcontrib><creatorcontrib>HIMI FUTOSHI</creatorcontrib><creatorcontrib>SUGINO TAKESHI</creatorcontrib><creatorcontrib>KAWAHITO YOSUKE</creatorcontrib><creatorcontrib>OTSUBO MASAYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KONDO KATSUYOSHI</au><au>HIMI FUTOSHI</au><au>SUGINO TAKESHI</au><au>KAWAHITO YOSUKE</au><au>OTSUBO MASAYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>JOINING METHOD USING LASER</title><date>2017-06-15</date><risdate>2017</risdate><abstract>PROBLEM TO BE SOLVED: To provide a solid-phase joining method applicable without depending on a material, a shape or the like of a material to be joined, especially, which is a simple solid-phase joining method using laser as a heat source.SOLUTION: There is provided a method for joining each of two or more materials to be joined. The joining method includes the first step for applying specular working to a surface to be joined of at least one material to be joined, the second step for forming an interface to be joined by allowing each surface to be joined of the materials to be joined to adhere to each other, and the third step for heating the interface to be joined by irradiation of laser.SELECTED DRAWING: Figure 1 【課題】被接合材の材質及び形状等に依らず適用可能な固相接合方法であって、特に、レーザを熱源とする簡便な固相接合方法を提案する。【解決手段】2以上の被接合材同士を接合する方法であって、少なくとも一つの被接合材の被接合面に鏡面加工を施す第一工程と、被接合材の被接合面同士を密着させて被接合界面を形成させる第二工程と、レーザの照射によって被接合界面を加熱する第三工程と、を含むこと、を特徴とする接合方法。【選択図】図1</abstract><oa>free_for_read</oa></addata></record>
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subjects CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title JOINING METHOD USING LASER
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