COOLING DEVICE AND COOLING SYSTEM
PROBLEM TO BE SOLVED: To restrain an increase in an installation space.SOLUTION: A cooling device 120 according to the present invention comprises: an evaporator 127 arranged in a rear door openably/closably provided in a housing 121; a refrigerant relay 112 provided above the housing 121 and connec...
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| creator | FUJII TOSHISUKE NAKAMURA YASUHITO |
| description | PROBLEM TO BE SOLVED: To restrain an increase in an installation space.SOLUTION: A cooling device 120 according to the present invention comprises: an evaporator 127 arranged in a rear door openably/closably provided in a housing 121; a refrigerant relay 112 provided above the housing 121 and connected to a condenser; and a bendable flexible pipe 123 of which one end is connected to the evaporator 127 and of which another end is connected to the refrigerant relay 112 on the side different from the side where the evaporator 127 is arranged. At least a portion of the flexible pipe 123 is arranged below the refrigerant relay 112 so as to pass under the refrigerant relay 112.SELECTED DRAWING: Figure 1
【課題】設置スペースの増大を抑制する。【解決手段】本発明に係る冷却装置１２０は、筐体１２１に開閉可能に設けられる背面扉に配置される蒸発器１２７と、筐体１２１の上方に設けられ、凝縮器と接続される冷媒中継器１１２と、一端が蒸発器１２７に接続され、他端が冷媒中継器１１２における蒸発器１２７の配置される側とは異なる側に接続される屈曲自在なフレキシブル管１２３と、を備え、フレキシブル管１２３の少なくとも一部は、冷媒中継器１１２と立体交差するよう、冷媒中継器１１２の下方に配設される。【選択図】 図１ |
| format | Patent |
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【課題】設置スペースの増大を抑制する。【解決手段】本発明に係る冷却装置１２０は、筐体１２１に開閉可能に設けられる背面扉に配置される蒸発器１２７と、筐体１２１の上方に設けられ、凝縮器と接続される冷媒中継器１１２と、一端が蒸発器１２７に接続され、他端が冷媒中継器１１２における蒸発器１２７の配置される側とは異なる側に接続される屈曲自在なフレキシブル管１２３と、を備え、フレキシブル管１２３の少なくとも一部は、冷媒中継器１１２と立体交差するよう、冷媒中継器１１２の下方に配設される。【選択図】 図１</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT ; HEATING ; LIGHTING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MECHANICAL ENGINEERING ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170420&DB=EPODOC&CC=JP&NR=2017075737A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170420&DB=EPODOC&CC=JP&NR=2017075737A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUJII TOSHISUKE</creatorcontrib><creatorcontrib>NAKAMURA YASUHITO</creatorcontrib><title>COOLING DEVICE AND COOLING SYSTEM</title><description>PROBLEM TO BE SOLVED: To restrain an increase in an installation space.SOLUTION: A cooling device 120 according to the present invention comprises: an evaporator 127 arranged in a rear door openably/closably provided in a housing 121; a refrigerant relay 112 provided above the housing 121 and connected to a condenser; and a bendable flexible pipe 123 of which one end is connected to the evaporator 127 and of which another end is connected to the refrigerant relay 112 on the side different from the side where the evaporator 127 is arranged. At least a portion of the flexible pipe 123 is arranged below the refrigerant relay 112 so as to pass under the refrigerant relay 112.SELECTED DRAWING: Figure 1
【課題】設置スペースの増大を抑制する。【解決手段】本発明に係る冷却装置１２０は、筐体１２１に開閉可能に設けられる背面扉に配置される蒸発器１２７と、筐体１２１の上方に設けられ、凝縮器と接続される冷媒中継器１１２と、一端が蒸発器１２７に接続され、他端が冷媒中継器１１２における蒸発器１２７の配置される側とは異なる側に接続される屈曲自在なフレキシブル管１２３と、を備え、フレキシブル管１２３の少なくとも一部は、冷媒中継器１１２と立体交差するよう、冷媒中継器１１２の下方に配設される。【選択図】 図１</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MECHANICAL ENGINEERING</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB09vf38fRzV3BxDfN0dlVw9HNRgAkFRwaHuPryMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjA0NzA3NTc2NzR2OiFAEASrUiiA</recordid><startdate>20170420</startdate><enddate>20170420</enddate><creator>FUJII TOSHISUKE</creator><creator>NAKAMURA YASUHITO</creator><scope>EVB</scope></search><sort><creationdate>20170420</creationdate><title>COOLING DEVICE AND COOLING SYSTEM</title><author>FUJII TOSHISUKE ; NAKAMURA YASUHITO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2017075737A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MECHANICAL ENGINEERING</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>FUJII TOSHISUKE</creatorcontrib><creatorcontrib>NAKAMURA YASUHITO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUJII TOSHISUKE</au><au>NAKAMURA YASUHITO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COOLING DEVICE AND COOLING SYSTEM</title><date>2017-04-20</date><risdate>2017</risdate><abstract>PROBLEM TO BE SOLVED: To restrain an increase in an installation space.SOLUTION: A cooling device 120 according to the present invention comprises: an evaporator 127 arranged in a rear door openably/closably provided in a housing 121; a refrigerant relay 112 provided above the housing 121 and connected to a condenser; and a bendable flexible pipe 123 of which one end is connected to the evaporator 127 and of which another end is connected to the refrigerant relay 112 on the side different from the side where the evaporator 127 is arranged. At least a portion of the flexible pipe 123 is arranged below the refrigerant relay 112 so as to pass under the refrigerant relay 112.SELECTED DRAWING: Figure 1
【課題】設置スペースの増大を抑制する。【解決手段】本発明に係る冷却装置１２０は、筐体１２１に開閉可能に設けられる背面扉に配置される蒸発器１２７と、筐体１２１の上方に設けられ、凝縮器と接続される冷媒中継器１１２と、一端が蒸発器１２７に接続され、他端が冷媒中継器１１２における蒸発器１２７の配置される側とは異なる側に接続される屈曲自在なフレキシブル管１２３と、を備え、フレキシブル管１２３の少なくとも一部は、冷媒中継器１１２と立体交差するよう、冷媒中継器１１２の下方に配設される。【選択図】 図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS |
| title | COOLING DEVICE AND COOLING SYSTEM |
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