FIBER SUBSTRATE

PROBLEM TO BE SOLVED: To provide a fiber substrate having reduced weight and improved rigidity.SOLUTION: A fiber substrate 10 comprises natural fiber 11 and synthetic resin-containing hollow fiber 13, and these fiber components are combined with a binder 15 made of resin. Preferably the content of t...

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Hauptverfasser: KAWAJIRI HIDEKI, IZAWA YUKI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a fiber substrate having reduced weight and improved rigidity.SOLUTION: A fiber substrate 10 comprises natural fiber 11 and synthetic resin-containing hollow fiber 13, and these fiber components are combined with a binder 15 made of resin. Preferably the content of the natural fiber 11 is 40 to 60 mass%, the content of the resin is 25 to 55 mass%, and the content of the hollow fiber 13 is 5 to 15 mass%, relative to 100 mass% of the fiber substrate 10.SELECTED DRAWING: Figure 1 【課題】軽量化と剛性の向上とが両立された繊維基材を提供する。【解決手段】本発明は、天然繊維11と、合成樹脂を含む中空繊維13とを含有し、これらの繊維成分が、樹脂からなる結合材15により結合された繊維基材10である。繊維基材10を100質量%とした場合に、天然繊維11の含有量が40〜60質量%であり、樹脂の含有量が25〜55質量%であり、中空繊維13の含有量が5〜15質量%であることが好ましい。【選択図】図1