CURABLE COMPOSITION, CURED PRODUCT, CAMERA MODULE, AND METHOD OF MANUFACTURING IMAGING APPARATUS
PROBLEM TO BE SOLVED: To provide a curable composition which has low viscosity and gives a cured product having good heat resistance and releasability.SOLUTION: The curable composition contains a curable component containing: 20-80 mass% of a compound (A) having (meth)acryloyloxy groups at both term...
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| creator | SEKIKAWA KENTA AMINO YOSUKE EHATA KENICHI HOMMA OSAMU KAIDA YURIKO |
| description | PROBLEM TO BE SOLVED: To provide a curable composition which has low viscosity and gives a cured product having good heat resistance and releasability.SOLUTION: The curable composition contains a curable component containing: 20-80 mass% of a compound (A) having (meth)acryloyloxy groups at both terminals of an alkylene group; 5-50 mass% of a compound (B) having three (meth)acryloyloxy groups; 5-50 mass% of a compound (C) having four (meth)acryloyloxy groups; 0.1-20 mass% of a compound (D) having one or more (meth)acryloyloxy groups and containing fluorine atoms; 0-10 mass% of a compound (E) (excluding the compound (D)) having one (meth)acryloyloxy group; and 0-40 mass% of a compound (F) having a fluorene skeleton and two (meth)acryloyloxy groups. The total of the compound (D) and the compound (E) is 0.1-20 mass%.SELECTED DRAWING: None
【課題】低粘度であり、硬化物の耐熱性および離型性が良好である硬化性組成物硬化性組成物を提供する。【解決手段】アルキレン基の両末端に（メタ）アクリロイルオキシ基を有する化合物（Ａ）２０〜８０質量％、（メタ）アクリロイルオキシ基を３個有する化合物（Ｂ）５〜５０質量％、（メタ）アクリロイルオキシ基を４個有する化合物（Ｃ）５〜５０質量％、（メタ）アクリロイルオキシ基を１個以上有し、かつフッ素原子を含む化合物（Ｄ）０．１〜２０質量％、（メタ）アクリロイルオキシ基を１個有する化合物（ただし、化合物（Ｄ）を除く）（Ｅ）０〜１０質量％、フルオレン骨格と、２個の（メタ）アクリロイルオキシ基を有する化合物（Ｆ）０〜４０質量％を含む硬化性成分を含有し、化合物（Ｄ）と化合物（Ｅ）の合計が０．１〜２０質量％である、硬化性組成物。【選択図】なし |
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【課題】低粘度であり、硬化物の耐熱性および離型性が良好である硬化性組成物硬化性組成物を提供する。【解決手段】アルキレン基の両末端に（メタ）アクリロイルオキシ基を有する化合物（Ａ）２０〜８０質量％、（メタ）アクリロイルオキシ基を３個有する化合物（Ｂ）５〜５０質量％、（メタ）アクリロイルオキシ基を４個有する化合物（Ｃ）５〜５０質量％、（メタ）アクリロイルオキシ基を１個以上有し、かつフッ素原子を含む化合物（Ｄ）０．１〜２０質量％、（メタ）アクリロイルオキシ基を１個有する化合物（ただし、化合物（Ｄ）を除く）（Ｅ）０〜１０質量％、フルオレン骨格と、２個の（メタ）アクリロイルオキシ基を有する化合物（Ｆ）０〜４０質量％を含む硬化性成分を含有し、化合物（Ｄ）と化合物（Ｅ）の合計が０．１〜２０質量％である、硬化性組成物。【選択図】なし</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; METALLURGY ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PHYSICS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170119&DB=EPODOC&CC=JP&NR=2017014303A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170119&DB=EPODOC&CC=JP&NR=2017014303A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SEKIKAWA KENTA</creatorcontrib><creatorcontrib>AMINO YOSUKE</creatorcontrib><creatorcontrib>EHATA KENICHI</creatorcontrib><creatorcontrib>HOMMA OSAMU</creatorcontrib><creatorcontrib>KAIDA YURIKO</creatorcontrib><title>CURABLE COMPOSITION, CURED PRODUCT, CAMERA MODULE, AND METHOD OF MANUFACTURING IMAGING APPARATUS</title><description>PROBLEM TO BE SOLVED: To provide a curable composition which has low viscosity and gives a cured product having good heat resistance and releasability.SOLUTION: The curable composition contains a curable component containing: 20-80 mass% of a compound (A) having (meth)acryloyloxy groups at both terminals of an alkylene group; 5-50 mass% of a compound (B) having three (meth)acryloyloxy groups; 5-50 mass% of a compound (C) having four (meth)acryloyloxy groups; 0.1-20 mass% of a compound (D) having one or more (meth)acryloyloxy groups and containing fluorine atoms; 0-10 mass% of a compound (E) (excluding the compound (D)) having one (meth)acryloyloxy group; and 0-40 mass% of a compound (F) having a fluorene skeleton and two (meth)acryloyloxy groups. The total of the compound (D) and the compound (E) is 0.1-20 mass%.SELECTED DRAWING: None
【課題】低粘度であり、硬化物の耐熱性および離型性が良好である硬化性組成物硬化性組成物を提供する。【解決手段】アルキレン基の両末端に（メタ）アクリロイルオキシ基を有する化合物（Ａ）２０〜８０質量％、（メタ）アクリロイルオキシ基を３個有する化合物（Ｂ）５〜５０質量％、（メタ）アクリロイルオキシ基を４個有する化合物（Ｃ）５〜５０質量％、（メタ）アクリロイルオキシ基を１個以上有し、かつフッ素原子を含む化合物（Ｄ）０．１〜２０質量％、（メタ）アクリロイルオキシ基を１個有する化合物（ただし、化合物（Ｄ）を除く）（Ｅ）０〜１０質量％、フルオレン骨格と、２個の（メタ）アクリロイルオキシ基を有する化合物（Ｆ）０〜４０質量％を含む硬化性成分を含有し、化合物（Ｄ）と化合物（Ｅ）の合計が０．１〜２０質量％である、硬化性組成物。【選択図】なし</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>METALLURGY</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNiksKwjAUALNxIeodHq4rpEbo-plPG2k-pMm6Fokr0UK9P0bwAK6GGWZNrjwFPPcSuDPeDTpqZysoUQrwwYnEY1E0MiCYor2sAK0AI2PnBDgFBm1SyGMK2ragDbZfovcYMKZhS1b36bHk3Y8bslcy8u6Q59eYl3m65Wd-jxd_pHVD6xOjDNlf0we9VzOI</recordid><startdate>20170119</startdate><enddate>20170119</enddate><creator>SEKIKAWA KENTA</creator><creator>AMINO YOSUKE</creator><creator>EHATA KENICHI</creator><creator>HOMMA OSAMU</creator><creator>KAIDA YURIKO</creator><scope>EVB</scope></search><sort><creationdate>20170119</creationdate><title>CURABLE COMPOSITION, CURED PRODUCT, CAMERA MODULE, AND METHOD OF MANUFACTURING IMAGING APPARATUS</title><author>SEKIKAWA KENTA ; AMINO YOSUKE ; EHATA KENICHI ; HOMMA OSAMU ; KAIDA YURIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2017014303A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>METALLURGY</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>SEKIKAWA KENTA</creatorcontrib><creatorcontrib>AMINO YOSUKE</creatorcontrib><creatorcontrib>EHATA KENICHI</creatorcontrib><creatorcontrib>HOMMA OSAMU</creatorcontrib><creatorcontrib>KAIDA YURIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SEKIKAWA KENTA</au><au>AMINO YOSUKE</au><au>EHATA KENICHI</au><au>HOMMA OSAMU</au><au>KAIDA YURIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CURABLE COMPOSITION, CURED PRODUCT, CAMERA MODULE, AND METHOD OF MANUFACTURING IMAGING APPARATUS</title><date>2017-01-19</date><risdate>2017</risdate><abstract>PROBLEM TO BE SOLVED: To provide a curable composition which has low viscosity and gives a cured product having good heat resistance and releasability.SOLUTION: The curable composition contains a curable component containing: 20-80 mass% of a compound (A) having (meth)acryloyloxy groups at both terminals of an alkylene group; 5-50 mass% of a compound (B) having three (meth)acryloyloxy groups; 5-50 mass% of a compound (C) having four (meth)acryloyloxy groups; 0.1-20 mass% of a compound (D) having one or more (meth)acryloyloxy groups and containing fluorine atoms; 0-10 mass% of a compound (E) (excluding the compound (D)) having one (meth)acryloyloxy group; and 0-40 mass% of a compound (F) having a fluorene skeleton and two (meth)acryloyloxy groups. The total of the compound (D) and the compound (E) is 0.1-20 mass%.SELECTED DRAWING: None
【課題】低粘度であり、硬化物の耐熱性および離型性が良好である硬化性組成物硬化性組成物を提供する。【解決手段】アルキレン基の両末端に（メタ）アクリロイルオキシ基を有する化合物（Ａ）２０〜８０質量％、（メタ）アクリロイルオキシ基を３個有する化合物（Ｂ）５〜５０質量％、（メタ）アクリロイルオキシ基を４個有する化合物（Ｃ）５〜５０質量％、（メタ）アクリロイルオキシ基を１個以上有し、かつフッ素原子を含む化合物（Ｄ）０．１〜２０質量％、（メタ）アクリロイルオキシ基を１個有する化合物（ただし、化合物（Ｄ）を除く）（Ｅ）０〜１０質量％、フルオレン骨格と、２個の（メタ）アクリロイルオキシ基を有する化合物（Ｆ）０〜４０質量％を含む硬化性成分を含有し、化合物（Ｄ）と化合物（Ｅ）の合計が０．１〜２０質量％である、硬化性組成物。【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS ORGANIC MACROMOLECULAR COMPOUNDS PHYSICS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | CURABLE COMPOSITION, CURED PRODUCT, CAMERA MODULE, AND METHOD OF MANUFACTURING IMAGING APPARATUS |
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