RESIN MOLDING AND METHOD FOR PRODUCING THE SAME

PROBLEM TO BE SOLVED: To provide a resin molding formed by sealing a part of the surface of a thermosetting resin member with a thermoplastic resin member, which improves adhesiveness between the thermosetting resin member and the thermoplastic resin member.SOLUTION: A resin molding has a thermosett...

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Bibliographische Detailangaben
Hauptverfasser: YAMAKAWA HIROYUKI, IZUMI RYUSUKE
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a resin molding formed by sealing a part of the surface of a thermosetting resin member with a thermoplastic resin member, which improves adhesiveness between the thermosetting resin member and the thermoplastic resin member.SOLUTION: A resin molding has a thermosetting resin member 10 and a thermoplastic resin member 20 for sealing a sealed surface 11 of the thermosetting resin member 10, and an exposed surface 12 of the thermosetting resin member 10 is exposed from the thermoplastic resin member 20. An additive 20a containing a functional group is added to the thermoplastic resin member 20, the thermosetting resin member 10 has a surface layer 11a formed of a thermosetting resin of which the concentration of a carboxyl group or the concentration of a phenolic group is higher than that of the thermosetting resin in a base portion, on a part of the sealed surface 11, and the carboxyl group or the phenolic group existing in the surface layer 11a is chemically bonded to the functional group existing in the additive 20a.SELECTED DRAWING: Figure 1 【課題】熱硬化性樹脂部材の表面の一部を熱可塑性樹脂部材で封止してなる樹脂成形体において、熱硬化性樹脂部材と熱可塑性樹脂部材との密着性の向上を図る。【解決手段】熱硬化性樹脂部材10と、熱硬化性樹脂部材10の封止面11を封止する熱可塑性樹脂部材20と、を備え、熱硬化性樹脂部材10の露出面12は、熱可塑性樹脂部材20より露出している。熱可塑性樹脂部材20には官能基を含有する添加剤20aが添加されており、熱硬化性樹脂部材10は、封止面11の一部に、下地部分の熱硬化性樹脂よりもカルボキシル基の濃度またはフェノール基の濃度が高い熱硬化性樹脂よりなる表面層11aを有するものであり、表面層11aに存在するカルボキシル基またはフェノール基と添加剤20aに存在する官能基とが化学結合されている。【選択図】図1