PROTRUSION INSPECTION DEVICE AND BUMP INSPECTION DEVICE
PROBLEM TO BE SOLVED: To provide a bump inspection device capable of measuring heights of projections and bumps formed on various substrates fast with high precision.SOLUTION: A projection inspection device comprises: a first measurement system which detects a top of a projection formed on a substra...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng ; jpn |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | KUSUSE HARUHIKO |
| description | PROBLEM TO BE SOLVED: To provide a bump inspection device capable of measuring heights of projections and bumps formed on various substrates fast with high precision.SOLUTION: A projection inspection device comprises: a first measurement system which detects a top of a projection formed on a substrate; a second measurement system which detects a top surface of the substrate where the projection is formed; and a signal processing device which outputs height information on the projection using output signals output from the first and second measurement systems. The first measurement system has a lighting optical system including a first lighting light source which emits a first inspection beam and an objective 22 projecting the first inspection beam on a substrate top surface vertically; and a detection 30 receiving reflected light reflected by the top of the projection through the objective. The second measurement system includes: a laser light source 41 which emits a second inspection beam; a coupling optical system 20 which couples the second inspection beam with an optical path of the objective; and optical detection means 47 of receiving reflected light reflected by the top surface of the substrate through the objective.SELECTED DRAWING: Figure 2
【課題】各種基板に形成された突起物やバンプの高さを高精度に高速で計測できる突起検査装置を実現する。【解決手段】突起検査装置は、基板に形成された突起の頂部を検出する第１の測定系と、突起が形成されている基板の表面を検出する第２の測定系と、第１及び第２の測定系から出力される出力信号を用いて突起の高さ情報を出力する信号処理装置とを具える。第１の測定系は、第１の検査ビームを発生する第１の照明光源、及び、第１の検査ビームを基板表面に対して垂直に投射する対物レンズ２２を含む照明光学系と、突起の頂部で反射した反射光を前記対物レンズを介して受光する検出系３０とを有する。第２の測定系は、第２の検査ビームを発生するレーザ光源４１と、第２の検査ビームを前記対物レンズの光路に結合する結合光学系２０と、基板表面で反射した反射光を前記対物レンズを介して受光する光検出手段４７とを含む。【選択図】図２ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2017009514A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2017009514A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2017009514A3</originalsourceid><addsrcrecordid>eNrjZDAPCPIPCQoN9vT3U_D0Cw5wdQ4BMV1cwzydXRUc_VwUnEJ9AzCleBhY0xJzilN5oTQ3g5Kba4izh25qQX58anFBYnJqXmpJvFeAkYGhuYGBpamhiaMxUYoAquwo0A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PROTRUSION INSPECTION DEVICE AND BUMP INSPECTION DEVICE</title><source>esp@cenet</source><creator>KUSUSE HARUHIKO</creator><creatorcontrib>KUSUSE HARUHIKO</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a bump inspection device capable of measuring heights of projections and bumps formed on various substrates fast with high precision.SOLUTION: A projection inspection device comprises: a first measurement system which detects a top of a projection formed on a substrate; a second measurement system which detects a top surface of the substrate where the projection is formed; and a signal processing device which outputs height information on the projection using output signals output from the first and second measurement systems. The first measurement system has a lighting optical system including a first lighting light source which emits a first inspection beam and an objective 22 projecting the first inspection beam on a substrate top surface vertically; and a detection 30 receiving reflected light reflected by the top of the projection through the objective. The second measurement system includes: a laser light source 41 which emits a second inspection beam; a coupling optical system 20 which couples the second inspection beam with an optical path of the objective; and optical detection means 47 of receiving reflected light reflected by the top surface of the substrate through the objective.SELECTED DRAWING: Figure 2
【課題】各種基板に形成された突起物やバンプの高さを高精度に高速で計測できる突起検査装置を実現する。【解決手段】突起検査装置は、基板に形成された突起の頂部を検出する第１の測定系と、突起が形成されている基板の表面を検出する第２の測定系と、第１及び第２の測定系から出力される出力信号を用いて突起の高さ情報を出力する信号処理装置とを具える。第１の測定系は、第１の検査ビームを発生する第１の照明光源、及び、第１の検査ビームを基板表面に対して垂直に投射する対物レンズ２２を含む照明光学系と、突起の頂部で反射した反射光を前記対物レンズを介して受光する検出系３０とを有する。第２の測定系は、第２の検査ビームを発生するレーザ光源４１と、第２の検査ビームを前記対物レンズの光路に結合する結合光学系２０と、基板表面で反射した反射光を前記対物レンズを介して受光する光検出手段４７とを含む。【選択図】図２</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MEASURING ; MEASURING ANGLES ; MEASURING AREAS ; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS ; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170112&DB=EPODOC&CC=JP&NR=2017009514A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170112&DB=EPODOC&CC=JP&NR=2017009514A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUSUSE HARUHIKO</creatorcontrib><title>PROTRUSION INSPECTION DEVICE AND BUMP INSPECTION DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a bump inspection device capable of measuring heights of projections and bumps formed on various substrates fast with high precision.SOLUTION: A projection inspection device comprises: a first measurement system which detects a top of a projection formed on a substrate; a second measurement system which detects a top surface of the substrate where the projection is formed; and a signal processing device which outputs height information on the projection using output signals output from the first and second measurement systems. The first measurement system has a lighting optical system including a first lighting light source which emits a first inspection beam and an objective 22 projecting the first inspection beam on a substrate top surface vertically; and a detection 30 receiving reflected light reflected by the top of the projection through the objective. The second measurement system includes: a laser light source 41 which emits a second inspection beam; a coupling optical system 20 which couples the second inspection beam with an optical path of the objective; and optical detection means 47 of receiving reflected light reflected by the top surface of the substrate through the objective.SELECTED DRAWING: Figure 2
【課題】各種基板に形成された突起物やバンプの高さを高精度に高速で計測できる突起検査装置を実現する。【解決手段】突起検査装置は、基板に形成された突起の頂部を検出する第１の測定系と、突起が形成されている基板の表面を検出する第２の測定系と、第１及び第２の測定系から出力される出力信号を用いて突起の高さ情報を出力する信号処理装置とを具える。第１の測定系は、第１の検査ビームを発生する第１の照明光源、及び、第１の検査ビームを基板表面に対して垂直に投射する対物レンズ２２を含む照明光学系と、突起の頂部で反射した反射光を前記対物レンズを介して受光する検出系３０とを有する。第２の測定系は、第２の検査ビームを発生するレーザ光源４１と、第２の検査ビームを前記対物レンズの光路に結合する結合光学系２０と、基板表面で反射した反射光を前記対物レンズを介して受光する光検出手段４７とを含む。【選択図】図２</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MEASURING</subject><subject>MEASURING ANGLES</subject><subject>MEASURING AREAS</subject><subject>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</subject><subject>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAPCPIPCQoN9vT3U_D0Cw5wdQ4BMV1cwzydXRUc_VwUnEJ9AzCleBhY0xJzilN5oTQ3g5Kba4izh25qQX58anFBYnJqXmpJvFeAkYGhuYGBpamhiaMxUYoAquwo0A</recordid><startdate>20170112</startdate><enddate>20170112</enddate><creator>KUSUSE HARUHIKO</creator><scope>EVB</scope></search><sort><creationdate>20170112</creationdate><title>PROTRUSION INSPECTION DEVICE AND BUMP INSPECTION DEVICE</title><author>KUSUSE HARUHIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2017009514A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MEASURING</topic><topic>MEASURING ANGLES</topic><topic>MEASURING AREAS</topic><topic>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</topic><topic>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KUSUSE HARUHIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KUSUSE HARUHIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PROTRUSION INSPECTION DEVICE AND BUMP INSPECTION DEVICE</title><date>2017-01-12</date><risdate>2017</risdate><abstract>PROBLEM TO BE SOLVED: To provide a bump inspection device capable of measuring heights of projections and bumps formed on various substrates fast with high precision.SOLUTION: A projection inspection device comprises: a first measurement system which detects a top of a projection formed on a substrate; a second measurement system which detects a top surface of the substrate where the projection is formed; and a signal processing device which outputs height information on the projection using output signals output from the first and second measurement systems. The first measurement system has a lighting optical system including a first lighting light source which emits a first inspection beam and an objective 22 projecting the first inspection beam on a substrate top surface vertically; and a detection 30 receiving reflected light reflected by the top of the projection through the objective. The second measurement system includes: a laser light source 41 which emits a second inspection beam; a coupling optical system 20 which couples the second inspection beam with an optical path of the objective; and optical detection means 47 of receiving reflected light reflected by the top surface of the substrate through the objective.SELECTED DRAWING: Figure 2
【課題】各種基板に形成された突起物やバンプの高さを高精度に高速で計測できる突起検査装置を実現する。【解決手段】突起検査装置は、基板に形成された突起の頂部を検出する第１の測定系と、突起が形成されている基板の表面を検出する第２の測定系と、第１及び第２の測定系から出力される出力信号を用いて突起の高さ情報を出力する信号処理装置とを具える。第１の測定系は、第１の検査ビームを発生する第１の照明光源、及び、第１の検査ビームを基板表面に対して垂直に投射する対物レンズ２２を含む照明光学系と、突起の頂部で反射した反射光を前記対物レンズを介して受光する検出系３０とを有する。第２の測定系は、第２の検査ビームを発生するレーザ光源４１と、第２の検査ビームを前記対物レンズの光路に結合する結合光学系２０と、基板表面で反射した反射光を前記対物レンズを介して受光する光検出手段４７とを含む。【選択図】図２</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; jpn |
| recordid | cdi_epo_espacenet_JP2017009514A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | PROTRUSION INSPECTION DEVICE AND BUMP INSPECTION DEVICE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-27T11%3A33%3A41IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KUSUSE%20HARUHIKO&rft.date=2017-01-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2017009514A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |