LONG LIFETIME THERMAL SPRAY COATING FOR ETCHING CHAMBER AND DEPOSITION CHAMBER APPLICATION
PROBLEM TO BE SOLVED: To provide plasma processing chamber coatings that have longer lifetimes and better protection against corrosive process chemicals.SOLUTION: Aluminum 101 forming an interior surface of a plasma processing chamber is coated with a multi-layer film comprising a layer 102 of alumi...
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creator | LIU CHIN-YI RUSSELL ORMOND NASH W ANDERSON DAVID M SCAEFER |
description | PROBLEM TO BE SOLVED: To provide plasma processing chamber coatings that have longer lifetimes and better protection against corrosive process chemicals.SOLUTION: Aluminum 101 forming an interior surface of a plasma processing chamber is coated with a multi-layer film comprising a layer 102 of aluminum oxide (AlO), a layer 103 of stabilized zirconia (YSZ) and a layer 104 of yttrium aluminum garnet (YAG).SELECTED DRAWING: Figure 1
【課題】寿命が長く尚且つ腐食性プロセス化学剤に対する保護にいっそう優れたプラズマ処理チャンバのコーティングを提供する。【解決手段】プラズマ処理チャンバの内表面であるアルミニウム101を、酸化アルミニウム(Al2O3)の層102、安定化されたジルコニア(YSZ)の層103、イットリウム・アルミニウム・ガーネット(YAG)の層104の多層膜でコーティングする。【選択図】図1 |
format | Patent |
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【課題】寿命が長く尚且つ腐食性プロセス化学剤に対する保護にいっそう優れたプラズマ処理チャンバのコーティングを提供する。【解決手段】プラズマ処理チャンバの内表面であるアルミニウム101を、酸化アルミニウム(Al2O3)の層102、安定化されたジルコニア(YSZ)の層103、イットリウム・アルミニウム・ガーネット(YAG)の層104の多層膜でコーティングする。【選択図】図1</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; PLASMA TECHNIQUE ; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS ; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161208&DB=EPODOC&CC=JP&NR=2016208034A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161208&DB=EPODOC&CC=JP&NR=2016208034A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIU CHIN-YI</creatorcontrib><creatorcontrib>RUSSELL ORMOND</creatorcontrib><creatorcontrib>NASH W ANDERSON</creatorcontrib><creatorcontrib>DAVID M SCAEFER</creatorcontrib><title>LONG LIFETIME THERMAL SPRAY COATING FOR ETCHING CHAMBER AND DEPOSITION CHAMBER APPLICATION</title><description>PROBLEM TO BE SOLVED: To provide plasma processing chamber coatings that have longer lifetimes and better protection against corrosive process chemicals.SOLUTION: Aluminum 101 forming an interior surface of a plasma processing chamber is coated with a multi-layer film comprising a layer 102 of aluminum oxide (AlO), a layer 103 of stabilized zirconia (YSZ) and a layer 104 of yttrium aluminum garnet (YAG).SELECTED DRAWING: Figure 1
【課題】寿命が長く尚且つ腐食性プロセス化学剤に対する保護にいっそう優れたプラズマ処理チャンバのコーティングを提供する。【解決手段】プラズマ処理チャンバの内表面であるアルミニウム101を、酸化アルミニウム(Al2O3)の層102、安定化されたジルコニア(YSZ)の層103、イットリウム・アルミニウム・ガーネット(YAG)の層104の多層膜でコーティングする。【選択図】図1</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>PLASMA TECHNIQUE</subject><subject>PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS</subject><subject>PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIjy8fdzV_DxdHMN8fR1VQjxcA3ydfRRCA4IcoxUcPZ3DPEESrv5Bym4hjh7gNjOHo6-Tq5BCo5-LgourgH-wZ4hnv5-COGAAB9PZ0eQGA8Da1piTnEqL5TmZlByA5mim1qQH59aXJCYnJqXWhLvFWBkYGhmZGBhYGziaEyUIgCXPDH7</recordid><startdate>20161208</startdate><enddate>20161208</enddate><creator>LIU CHIN-YI</creator><creator>RUSSELL ORMOND</creator><creator>NASH W ANDERSON</creator><creator>DAVID M SCAEFER</creator><scope>EVB</scope></search><sort><creationdate>20161208</creationdate><title>LONG LIFETIME THERMAL SPRAY COATING FOR ETCHING CHAMBER AND DEPOSITION CHAMBER APPLICATION</title><author>LIU CHIN-YI ; RUSSELL ORMOND ; NASH W ANDERSON ; DAVID M SCAEFER</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2016208034A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>PLASMA TECHNIQUE</topic><topic>PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS</topic><topic>PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>LIU CHIN-YI</creatorcontrib><creatorcontrib>RUSSELL ORMOND</creatorcontrib><creatorcontrib>NASH W ANDERSON</creatorcontrib><creatorcontrib>DAVID M SCAEFER</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIU CHIN-YI</au><au>RUSSELL ORMOND</au><au>NASH W ANDERSON</au><au>DAVID M SCAEFER</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LONG LIFETIME THERMAL SPRAY COATING FOR ETCHING CHAMBER AND DEPOSITION CHAMBER APPLICATION</title><date>2016-12-08</date><risdate>2016</risdate><abstract>PROBLEM TO BE SOLVED: To provide plasma processing chamber coatings that have longer lifetimes and better protection against corrosive process chemicals.SOLUTION: Aluminum 101 forming an interior surface of a plasma processing chamber is coated with a multi-layer film comprising a layer 102 of aluminum oxide (AlO), a layer 103 of stabilized zirconia (YSZ) and a layer 104 of yttrium aluminum garnet (YAG).SELECTED DRAWING: Figure 1
【課題】寿命が長く尚且つ腐食性プロセス化学剤に対する保護にいっそう優れたプラズマ処理チャンバのコーティングを提供する。【解決手段】プラズマ処理チャンバの内表面であるアルミニウム101を、酸化アルミニウム(Al2O3)の層102、安定化されたジルコニア(YSZ)の層103、イットリウム・アルミニウム・ガーネット(YAG)の層104の多層膜でコーティングする。【選択図】図1</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PLASMA TECHNIQUE PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
title | LONG LIFETIME THERMAL SPRAY COATING FOR ETCHING CHAMBER AND DEPOSITION CHAMBER APPLICATION |
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