ELECTRONIC APPARATUS
PROBLEM TO BE SOLVED: To enable even components of different materials to be bonded while preventing the cost from being high by using a special component.SOLUTION: When a cabinet 3 and a cover panel 4, of different materials, are bonded with an adhesive 11, a thickness of the adhesive 11 is made to...
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| creator | TAKEMOTO MASAMI AOKI SHUNJI |
| description | PROBLEM TO BE SOLVED: To enable even components of different materials to be bonded while preventing the cost from being high by using a special component.SOLUTION: When a cabinet 3 and a cover panel 4, of different materials, are bonded with an adhesive 11, a thickness of the adhesive 11 is made to be thicker at an end side compared with a center part of a bonding area.SELECTED DRAWING: Figure 1
【課題】材質が異なる部材を接着する場合であっても、特別な部材を使用することで高コストになることもなく、接着できるようにする。【解決手段】材質が異なるキャビネット３とカバーパネル４とを接着剤１１で接着するときに、接着剤１１の厚さを接着領域の中央部に比べ、端部側で厚くする。【選択図】図１ |
| format | Patent |
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【課題】材質が異なる部材を接着する場合であっても、特別な部材を使用することで高コストになることもなく、接着できるようにする。【解決手段】材質が異なるキャビネット３とカバーパネル４とを接着剤１１で接着するときに、接着剤１１の厚さを接着領域の中央部に比べ、端部側で厚くする。【選択図】図１</description><language>eng ; jpn</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPUTING ; COUNTING ; DYES ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; PHYSICS ; POLISHES ; PRINTED CIRCUITS ; TELEPHONIC COMMUNICATION ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161104&DB=EPODOC&CC=JP&NR=2016189436A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161104&DB=EPODOC&CC=JP&NR=2016189436A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKEMOTO MASAMI</creatorcontrib><creatorcontrib>AOKI SHUNJI</creatorcontrib><title>ELECTRONIC APPARATUS</title><description>PROBLEM TO BE SOLVED: To enable even components of different materials to be bonded while preventing the cost from being high by using a special component.SOLUTION: When a cabinet 3 and a cover panel 4, of different materials, are bonded with an adhesive 11, a thickness of the adhesive 11 is made to be thicker at an end side compared with a center part of a bonding area.SELECTED DRAWING: Figure 1
【課題】材質が異なる部材を接着する場合であっても、特別な部材を使用することで高コストになることもなく、接着できるようにする。【解決手段】材質が異なるキャビネット３とカバーパネル４とを接着剤１１で接着するときに、接着剤１１の厚さを接着領域の中央部に比べ、端部側で厚くする。【選択図】図１</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>DYES</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>PHYSICS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>TELEPHONIC COMMUNICATION</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBBx9XF1Dgny9_N0VnAMCHAMcgwJDeZhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhmaGFpYmxmaOxkQpAgDBJh84</recordid><startdate>20161104</startdate><enddate>20161104</enddate><creator>TAKEMOTO MASAMI</creator><creator>AOKI SHUNJI</creator><scope>EVB</scope></search><sort><creationdate>20161104</creationdate><title>ELECTRONIC APPARATUS</title><author>TAKEMOTO MASAMI ; AOKI SHUNJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2016189436A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2016</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>DYES</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>PHYSICS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>TELEPHONIC COMMUNICATION</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKEMOTO MASAMI</creatorcontrib><creatorcontrib>AOKI SHUNJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKEMOTO MASAMI</au><au>AOKI SHUNJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC APPARATUS</title><date>2016-11-04</date><risdate>2016</risdate><abstract>PROBLEM TO BE SOLVED: To enable even components of different materials to be bonded while preventing the cost from being high by using a special component.SOLUTION: When a cabinet 3 and a cover panel 4, of different materials, are bonded with an adhesive 11, a thickness of the adhesive 11 is made to be thicker at an end side compared with a center part of a bonding area.SELECTED DRAWING: Figure 1
【課題】材質が異なる部材を接着する場合であっても、特別な部材を使用することで高コストになることもなく、接着できるようにする。【解決手段】材質が異なるキャビネット３とカバーパネル４とを接着剤１１で接着するときに、接着剤１１の厚さを接着領域の中央部に比べ、端部側で厚くする。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPUTING COUNTING DYES ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PHYSICS POLISHES PRINTED CIRCUITS TELEPHONIC COMMUNICATION USE OF MATERIALS AS ADHESIVES |
| title | ELECTRONIC APPARATUS |
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