PHOTOSENSITIVE RESIN COMPOSITION
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having a good appearance during application, from which a high-definition spacer having excellent adhesiveness and elastic recovery property can be formed.SOLUTION: The photosensitive resin composition comprises, as essential compon...
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creator | ISOBE SHINGO TERANISHI MANABU SAKAI MASARU |
description | PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having a good appearance during application, from which a high-definition spacer having excellent adhesiveness and elastic recovery property can be formed.SOLUTION: The photosensitive resin composition comprises, as essential components, a hydrophilic resin (A) having a radically polymerizable organic group, a polyfunctional (meth)acrylate (B), a photopolymerization initiator (C), a compound (D) having two or more hydrolyzable alkoxy groups, a fluorine-based surfactant (E), and a silicone-based surfactant (F).SELECTED DRAWING: None
【課題】 塗布時の外観が良好であり、かつ優れた密着性と弾性回復特性を有する高精細なスペーサーの形成が可能な感光性樹脂組成物を提供すること。【解決手段】 ラジカル重合性有機基を有する親水性樹脂(A)、多官能(メタ)アクリレート(B)、光重合開始剤(C)、および2個以上の加水分解性アルコキシ基を有する化合物(D)、フッ素系界面活性剤(E)、シリコーン系界面活性剤(F)を必須成分として含有することを特徴とする感光性樹脂組成物を用いる。【選択図】 なし |
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【課題】 塗布時の外観が良好であり、かつ優れた密着性と弾性回復特性を有する高精細なスペーサーの形成が可能な感光性樹脂組成物を提供すること。【解決手段】 ラジカル重合性有機基を有する親水性樹脂(A)、多官能(メタ)アクリレート(B)、光重合開始剤(C)、および2個以上の加水分解性アルコキシ基を有する化合物(D)、フッ素系界面活性剤(E)、シリコーン系界面活性剤(F)を必須成分として含有することを特徴とする感光性樹脂組成物を用いる。【選択図】 なし</description><language>eng ; jpn</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; ELECTROGRAPHY ; HOLOGRAPHY ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MATERIALS THEREFOR ; METALLURGY ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161027&DB=EPODOC&CC=JP&NR=2016186609A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20161027&DB=EPODOC&CC=JP&NR=2016186609A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ISOBE SHINGO</creatorcontrib><creatorcontrib>TERANISHI MANABU</creatorcontrib><creatorcontrib>SAKAI MASARU</creatorcontrib><title>PHOTOSENSITIVE RESIN COMPOSITION</title><description>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having a good appearance during application, from which a high-definition spacer having excellent adhesiveness and elastic recovery property can be formed.SOLUTION: The photosensitive resin composition comprises, as essential components, a hydrophilic resin (A) having a radically polymerizable organic group, a polyfunctional (meth)acrylate (B), a photopolymerization initiator (C), a compound (D) having two or more hydrolyzable alkoxy groups, a fluorine-based surfactant (E), and a silicone-based surfactant (F).SELECTED DRAWING: None
【課題】 塗布時の外観が良好であり、かつ優れた密着性と弾性回復特性を有する高精細なスペーサーの形成が可能な感光性樹脂組成物を提供すること。【解決手段】 ラジカル重合性有機基を有する親水性樹脂(A)、多官能(メタ)アクリレート(B)、光重合開始剤(C)、および2個以上の加水分解性アルコキシ基を有する化合物(D)、フッ素系界面活性剤(E)、シリコーン系界面活性剤(F)を必須成分として含有することを特徴とする感光性樹脂組成物を用いる。【選択図】 なし</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAI8PAP8Q929Qv2DPEMc1UIcg329FNw9vcN8AeJ-PvxMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjA0MzQwszMwNLR2OiFAEAbisi4g</recordid><startdate>20161027</startdate><enddate>20161027</enddate><creator>ISOBE SHINGO</creator><creator>TERANISHI MANABU</creator><creator>SAKAI MASARU</creator><scope>EVB</scope></search><sort><creationdate>20161027</creationdate><title>PHOTOSENSITIVE RESIN COMPOSITION</title><author>ISOBE SHINGO ; TERANISHI MANABU ; SAKAI MASARU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2016186609A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2016</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>ISOBE SHINGO</creatorcontrib><creatorcontrib>TERANISHI MANABU</creatorcontrib><creatorcontrib>SAKAI MASARU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ISOBE SHINGO</au><au>TERANISHI MANABU</au><au>SAKAI MASARU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PHOTOSENSITIVE RESIN COMPOSITION</title><date>2016-10-27</date><risdate>2016</risdate><abstract>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having a good appearance during application, from which a high-definition spacer having excellent adhesiveness and elastic recovery property can be formed.SOLUTION: The photosensitive resin composition comprises, as essential components, a hydrophilic resin (A) having a radically polymerizable organic group, a polyfunctional (meth)acrylate (B), a photopolymerization initiator (C), a compound (D) having two or more hydrolyzable alkoxy groups, a fluorine-based surfactant (E), and a silicone-based surfactant (F).SELECTED DRAWING: None
【課題】 塗布時の外観が良好であり、かつ優れた密着性と弾性回復特性を有する高精細なスペーサーの形成が可能な感光性樹脂組成物を提供すること。【解決手段】 ラジカル重合性有機基を有する親水性樹脂(A)、多官能(メタ)アクリレート(B)、光重合開始剤(C)、および2個以上の加水分解性アルコキシ基を有する化合物(D)、フッ素系界面活性剤(E)、シリコーン系界面活性剤(F)を必須成分として含有することを特徴とする感光性樹脂組成物を用いる。【選択図】 なし</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MATERIALS THEREFOR METALLURGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP |
title | PHOTOSENSITIVE RESIN COMPOSITION |
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