RESIN SEALED TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a resin sealed type semiconductor device that is adaptive to multiple pins and has a high reliability, and to provide a method of manufacturing such a resin sealed type semiconductor device more easily with stability.SOLUTION: A resin sealed type semiconductor device is configured to have: a circuit part that comprises a plurality of terminal parts each comprising an internal terminal surface and an external terminal surface front and rear integrally, so that the external terminal surfaces form one flat plane; a semiconductor element electrically connected with internal terminal surfaces of the terminal parts by a wire; and a resin member that encapsulates the terminal parts, the semiconductor element, and the wire in a state where at least the external terminal surfaces of the terminal parts are exposed. Each terminal part is configured to have a base, and a surface noble metal layer that configures the internal terminal surface, and have at least one of a recessed part and a rough surface on a side wall surface of the base.SELECTED DRAWING: Figure 15 【課題】多ピン化への対応が可能で信頼性が高い樹脂封止型半導体装置と、このような樹脂封止型半導体装置を安定してより簡易に製造する製造方法を提供する。【解決手段】樹脂封止型半導体装置を、内部端子面と外部端子面を表裏一体に備える複数の端子部を外部端子面が一平面をなすように備える回路部と、端子部の内部端子面とワイヤにて電気的に接続している半導体素子と、少なくとも端子部の外部端子面が露出している状態で端子部、半導体素子、ワイヤを封止する樹脂部材とを有するものとし、端子部を、基部と、内部端子面を構成する表面貴金属層とを有し、かつ、基部の側壁面に凹部および粗面の少なくとも一方を有するものとする。【選択図】 図１５