CURING AGENT FOR EPOXY RESIN

PROBLEM TO BE SOLVED: To provide an amine compound which, when used as an epoxy resin curing agent, achieves low viscosity of an epoxy resin composition and gives good epoxy resin cured product performance.SOLUTION: A curing agent for an epoxy resin comprises a diamine compound having a substituent...

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description PROBLEM TO BE SOLVED: To provide an amine compound which, when used as an epoxy resin curing agent, achieves low viscosity of an epoxy resin composition and gives good epoxy resin cured product performance.SOLUTION: A curing agent for an epoxy resin comprises a diamine compound having a substituent represented by formula (3) [n is an integer of 0-3; when n is 0, Ris H; when n is 1-3, Ris H, a methyl group, or an ethyl group; Rand Rare each independently H, a 1-3C alkyl group, a methoxy group, an ethoxy group, or a hydroxyl group; and Rand Rmay be bonded together to form a saturated or unsaturated condensed ring].SELECTED DRAWING: None 【課題】エポキシ樹脂硬化剤として使用した際に、エポキシ樹脂組成物が低粘度であり、且つ良好なエポキシ樹脂硬化物性能を与えるアミン化合物の提供。【解決手段】式(3)で示される置換基を有するジアミン化合物からなるエポキシ樹脂用硬化剤。[nは0〜3の整数;nが0の場合、R9はH;nが1〜3の場合、R9はH、メチル基又はエチル基;R10〜R11は各々独立にH、C1〜3のアルキル基、メトキシ基、エトキシ基、又はヒドロキシル基;R10〜R11は互いに結合して、飽和若しくは不飽和の縮合環を形成してもよい。]【選択図】なし
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2016164234A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2016164234A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2016164234A3</originalsourceid><addsrcrecordid>eNrjZJBxDg3y9HNXcHR39QtRcPMPUnAN8I-IVAhyDfb042FgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgaGZoZmJkbGJo7GRCkCAKlpISU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CURING AGENT FOR EPOXY RESIN</title><source>esp@cenet</source><creator>TOKUMOTO KATSUMI</creator><creatorcontrib>TOKUMOTO KATSUMI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide an amine compound which, when used as an epoxy resin curing agent, achieves low viscosity of an epoxy resin composition and gives good epoxy resin cured product performance.SOLUTION: A curing agent for an epoxy resin comprises a diamine compound having a substituent represented by formula (3) [n is an integer of 0-3; when n is 0, Ris H; when n is 1-3, Ris H, a methyl group, or an ethyl group; Rand Rare each independently H, a 1-3C alkyl group, a methoxy group, an ethoxy group, or a hydroxyl group; and Rand Rmay be bonded together to form a saturated or unsaturated condensed ring].SELECTED DRAWING: None 【課題】エポキシ樹脂硬化剤として使用した際に、エポキシ樹脂組成物が低粘度であり、且つ良好なエポキシ樹脂硬化物性能を与えるアミン化合物の提供。【解決手段】式(3)で示される置換基を有するジアミン化合物からなるエポキシ樹脂用硬化剤。[nは0〜3の整数;nが0の場合、R9はH;nが1〜3の場合、R9はH、メチル基又はエチル基;R10〜R11は各々独立にH、C1〜3のアルキル基、メトキシ基、エトキシ基、又はヒドロキシル基;R10〜R11は互いに結合して、飽和若しくは不飽和の縮合環を形成してもよい。]【選択図】なし</description><language>eng ; jpn</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160908&amp;DB=EPODOC&amp;CC=JP&amp;NR=2016164234A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160908&amp;DB=EPODOC&amp;CC=JP&amp;NR=2016164234A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TOKUMOTO KATSUMI</creatorcontrib><title>CURING AGENT FOR EPOXY RESIN</title><description>PROBLEM TO BE SOLVED: To provide an amine compound which, when used as an epoxy resin curing agent, achieves low viscosity of an epoxy resin composition and gives good epoxy resin cured product performance.SOLUTION: A curing agent for an epoxy resin comprises a diamine compound having a substituent represented by formula (3) [n is an integer of 0-3; when n is 0, Ris H; when n is 1-3, Ris H, a methyl group, or an ethyl group; Rand Rare each independently H, a 1-3C alkyl group, a methoxy group, an ethoxy group, or a hydroxyl group; and Rand Rmay be bonded together to form a saturated or unsaturated condensed ring].SELECTED DRAWING: None 【課題】エポキシ樹脂硬化剤として使用した際に、エポキシ樹脂組成物が低粘度であり、且つ良好なエポキシ樹脂硬化物性能を与えるアミン化合物の提供。【解決手段】式(3)で示される置換基を有するジアミン化合物からなるエポキシ樹脂用硬化剤。[nは0〜3の整数;nが0の場合、R9はH;nが1〜3の場合、R9はH、メチル基又はエチル基;R10〜R11は各々独立にH、C1〜3のアルキル基、メトキシ基、エトキシ基、又はヒドロキシル基;R10〜R11は互いに結合して、飽和若しくは不飽和の縮合環を形成してもよい。]【選択図】なし</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBxDg3y9HNXcHR39QtRcPMPUnAN8I-IVAhyDfb042FgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgaGZoZmJkbGJo7GRCkCAKlpISU</recordid><startdate>20160908</startdate><enddate>20160908</enddate><creator>TOKUMOTO KATSUMI</creator><scope>EVB</scope></search><sort><creationdate>20160908</creationdate><title>CURING AGENT FOR EPOXY RESIN</title><author>TOKUMOTO KATSUMI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2016164234A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2016</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>TOKUMOTO KATSUMI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TOKUMOTO KATSUMI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CURING AGENT FOR EPOXY RESIN</title><date>2016-09-08</date><risdate>2016</risdate><abstract>PROBLEM TO BE SOLVED: To provide an amine compound which, when used as an epoxy resin curing agent, achieves low viscosity of an epoxy resin composition and gives good epoxy resin cured product performance.SOLUTION: A curing agent for an epoxy resin comprises a diamine compound having a substituent represented by formula (3) [n is an integer of 0-3; when n is 0, Ris H; when n is 1-3, Ris H, a methyl group, or an ethyl group; Rand Rare each independently H, a 1-3C alkyl group, a methoxy group, an ethoxy group, or a hydroxyl group; and Rand Rmay be bonded together to form a saturated or unsaturated condensed ring].SELECTED DRAWING: None 【課題】エポキシ樹脂硬化剤として使用した際に、エポキシ樹脂組成物が低粘度であり、且つ良好なエポキシ樹脂硬化物性能を与えるアミン化合物の提供。【解決手段】式(3)で示される置換基を有するジアミン化合物からなるエポキシ樹脂用硬化剤。[nは0〜3の整数;nが0の場合、R9はH;nが1〜3の場合、R9はH、メチル基又はエチル基;R10〜R11は各々独立にH、C1〜3のアルキル基、メトキシ基、エトキシ基、又はヒドロキシル基;R10〜R11は互いに結合して、飽和若しくは不飽和の縮合環を形成してもよい。]【選択図】なし</abstract><oa>free_for_read</oa></addata></record>
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subjects CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
title CURING AGENT FOR EPOXY RESIN
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