SPACER TAPE
PROBLEM TO BE SOLVED: To provide a spacer tape on which a coating material having excellent abrasion resistance is coated.SOLUTION: When chip conveyance tapes formed by holding semiconductor chips in a flexible base material in a predetermined arrangement are laminated on each other, a spacer tape 1...
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| creator | TSUJI ISATO HIGUCHI YOSHINORI |
| description | PROBLEM TO BE SOLVED: To provide a spacer tape on which a coating material having excellent abrasion resistance is coated.SOLUTION: When chip conveyance tapes formed by holding semiconductor chips in a flexible base material in a predetermined arrangement are laminated on each other, a spacer tape 1 is used by being interposed between overlap portions of the chip conveyance tapes 3. In the spacer tape having a surface thereof coated by a coating material, the coating material contains a polyester resin-based binder and a crosslinking material, binder has a glass-transition temperature of 50°C to 60°C, and the crosslinking material includes a molecular structure in which a melamine resin has six branches.SELECTED DRAWING: Figure 1
【課題】耐摩耗性に優れたコーティング材が塗布されたスペーサテープを提供する。【解決手段】本発明のスペーサテープ１は、半導体チップをフレキシブル基材に所定配置で保持させて成るチップ搬送テープを相互に重ね合わせるときに、チップ搬送テープ３の重合間に介在させて使用するものであって、表面にコーティング材が塗布されていて、コーティング材は、ポリエステル樹脂系のバインダと架橋材とを含むものであって、バインダは、ガラス転移温度が５０℃〜６０℃のものとされ、架橋材は、分子構造が６分枝のメラミン樹脂を含む。【選択図】図１ |
| format | Patent |
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【課題】耐摩耗性に優れたコーティング材が塗布されたスペーサテープを提供する。【解決手段】本発明のスペーサテープ１は、半導体チップをフレキシブル基材に所定配置で保持させて成るチップ搬送テープを相互に重ね合わせるときに、チップ搬送テープ３の重合間に介在させて使用するものであって、表面にコーティング材が塗布されていて、コーティング材は、ポリエステル樹脂系のバインダと架橋材とを含むものであって、バインダは、ガラス転移温度が５０℃〜６０℃のものとされ、架橋材は、分子構造が６分枝のメラミン樹脂を含む。【選択図】図１</description><language>eng ; jpn</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; WORKING-UP</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160901&DB=EPODOC&CC=JP&NR=2016157842A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160901&DB=EPODOC&CC=JP&NR=2016157842A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TSUJI ISATO</creatorcontrib><creatorcontrib>HIGUCHI YOSHINORI</creatorcontrib><title>SPACER TAPE</title><description>PROBLEM TO BE SOLVED: To provide a spacer tape on which a coating material having excellent abrasion resistance is coated.SOLUTION: When chip conveyance tapes formed by holding semiconductor chips in a flexible base material in a predetermined arrangement are laminated on each other, a spacer tape 1 is used by being interposed between overlap portions of the chip conveyance tapes 3. In the spacer tape having a surface thereof coated by a coating material, the coating material contains a polyester resin-based binder and a crosslinking material, binder has a glass-transition temperature of 50°C to 60°C, and the crosslinking material includes a molecular structure in which a melamine resin has six branches.SELECTED DRAWING: Figure 1
【課題】耐摩耗性に優れたコーティング材が塗布されたスペーサテープを提供する。【解決手段】本発明のスペーサテープ１は、半導体チップをフレキシブル基材に所定配置で保持させて成るチップ搬送テープを相互に重ね合わせるときに、チップ搬送テープ３の重合間に介在させて使用するものであって、表面にコーティング材が塗布されていて、コーティング材は、ポリエステル樹脂系のバインダと架橋材とを含むものであって、バインダは、ガラス転移温度が５０℃〜６０℃のものとされ、架橋材は、分子構造が６分枝のメラミン樹脂を含む。【選択図】図１</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAODnB0dg1SCHEMcOVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhmaGpuYWJkaOxkQpAgCgphx2</recordid><startdate>20160901</startdate><enddate>20160901</enddate><creator>TSUJI ISATO</creator><creator>HIGUCHI YOSHINORI</creator><scope>EVB</scope></search><sort><creationdate>20160901</creationdate><title>SPACER TAPE</title><author>TSUJI ISATO ; HIGUCHI YOSHINORI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2016157842A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2016</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>TSUJI ISATO</creatorcontrib><creatorcontrib>HIGUCHI YOSHINORI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TSUJI ISATO</au><au>HIGUCHI YOSHINORI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SPACER TAPE</title><date>2016-09-01</date><risdate>2016</risdate><abstract>PROBLEM TO BE SOLVED: To provide a spacer tape on which a coating material having excellent abrasion resistance is coated.SOLUTION: When chip conveyance tapes formed by holding semiconductor chips in a flexible base material in a predetermined arrangement are laminated on each other, a spacer tape 1 is used by being interposed between overlap portions of the chip conveyance tapes 3. In the spacer tape having a surface thereof coated by a coating material, the coating material contains a polyester resin-based binder and a crosslinking material, binder has a glass-transition temperature of 50°C to 60°C, and the crosslinking material includes a molecular structure in which a melamine resin has six branches.SELECTED DRAWING: Figure 1
【課題】耐摩耗性に優れたコーティング材が塗布されたスペーサテープを提供する。【解決手段】本発明のスペーサテープ１は、半導体チップをフレキシブル基材に所定配置で保持させて成るチップ搬送テープを相互に重ね合わせるときに、チップ搬送テープ３の重合間に介在させて使用するものであって、表面にコーティング材が塗布されていて、コーティング材は、ポリエステル樹脂系のバインダと架橋材とを含むものであって、バインダは、ガラス転移温度が５０℃〜６０℃のものとされ、架橋材は、分子構造が６分枝のメラミン樹脂を含む。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP |
| title | SPACER TAPE |
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