CERAMIC WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
PROBLEM TO BE SOLVED: To provide a ceramic wiring board including a through hole penetrating the surface and a mounting surface opposing the surface, or a recess opening to the mounting surface, having no micro irregularities on the mounting surface, and capable of keeping a stable posture even if t...
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| creator | KITO NAOKI IGAWA TATSUHARU HAYANO HISAO NOZU KAZUYA KAJITA JUNJI |
| description | PROBLEM TO BE SOLVED: To provide a ceramic wiring board including a through hole penetrating the surface and a mounting surface opposing the surface, or a recess opening to the mounting surface, having no micro irregularities on the mounting surface, and capable of keeping a stable posture even if the mounting surface is brought into surface contact with the surface of a surface plate, or the like, and to provide a method of manufacturing the same.SOLUTION: In a ceramic wiring board 1a including a board body 2a laminating a plurality of ceramic layers s1-s3, and having a surface 3 and a mounting surface 4 opposing the surface 3, and a through hole 5 penetrating between the surface 3 and mounting surface 4 in the board body 2a, an inclined plane 10 is formed along the mounting surface 4 surrounding the opening of the through hole 5, and the inclined plane 10 is inclining downward toward the surface 3 side.SELECTED DRAWING: Figure 1
【課題】表面と該表面に対向する載置面とを有する基板本体を貫通する貫通孔または前記載置面に開口する凹部を備え、前記載置面に微細な凹凸がなく、後工程で載置面を定盤などの表面上に面接触しても、安定した姿勢を保ち得るセラミック配線基板およびその製造方法を提供する。【解決手段】複数のセラミック層ｓ１〜ｓ３を積層してなり、且つ表面３および該表面３に対向する載置面４を有する基板本体２ａと、該基板本体２ａにおける表面３と載置面４との間を貫通する貫通孔５と、を有するセラミック配線基板１ａであって、上記貫通孔５の開口部を囲む載置面４に沿って、傾斜面１０が形成されており、かかる傾斜面１０は、上記表面３側に向かって下がっている、セラミック配線基板１ａ。【選択図】 図１ |
| format | Patent |
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【課題】表面と該表面に対向する載置面とを有する基板本体を貫通する貫通孔または前記載置面に開口する凹部を備え、前記載置面に微細な凹凸がなく、後工程で載置面を定盤などの表面上に面接触しても、安定した姿勢を保ち得るセラミック配線基板およびその製造方法を提供する。【解決手段】複数のセラミック層ｓ１〜ｓ３を積層してなり、且つ表面３および該表面３に対向する載置面４を有する基板本体２ａと、該基板本体２ａにおける表面３と載置面４との間を貫通する貫通孔５と、を有するセラミック配線基板１ａであって、上記貫通孔５の開口部を囲む載置面４に沿って、傾斜面１０が形成されており、かかる傾斜面１０は、上記表面３側に向かって下がっている、セラミック配線基板１ａ。【選択図】 図１</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160822&DB=EPODOC&CC=JP&NR=2016152279A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160822&DB=EPODOC&CC=JP&NR=2016152279A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KITO NAOKI</creatorcontrib><creatorcontrib>IGAWA TATSUHARU</creatorcontrib><creatorcontrib>HAYANO HISAO</creatorcontrib><creatorcontrib>NOZU KAZUYA</creatorcontrib><creatorcontrib>KAJITA JUNJI</creatorcontrib><title>CERAMIC WIRING BOARD AND METHOD OF MANUFACTURING THE SAME</title><description>PROBLEM TO BE SOLVED: To provide a ceramic wiring board including a through hole penetrating the surface and a mounting surface opposing the surface, or a recess opening to the mounting surface, having no micro irregularities on the mounting surface, and capable of keeping a stable posture even if the mounting surface is brought into surface contact with the surface of a surface plate, or the like, and to provide a method of manufacturing the same.SOLUTION: In a ceramic wiring board 1a including a board body 2a laminating a plurality of ceramic layers s1-s3, and having a surface 3 and a mounting surface 4 opposing the surface 3, and a through hole 5 penetrating between the surface 3 and mounting surface 4 in the board body 2a, an inclined plane 10 is formed along the mounting surface 4 surrounding the opening of the through hole 5, and the inclined plane 10 is inclining downward toward the surface 3 side.SELECTED DRAWING: Figure 1
【課題】表面と該表面に対向する載置面とを有する基板本体を貫通する貫通孔または前記載置面に開口する凹部を備え、前記載置面に微細な凹凸がなく、後工程で載置面を定盤などの表面上に面接触しても、安定した姿勢を保ち得るセラミック配線基板およびその製造方法を提供する。【解決手段】複数のセラミック層ｓ１〜ｓ３を積層してなり、且つ表面３および該表面３に対向する載置面４を有する基板本体２ａと、該基板本体２ａにおける表面３と載置面４との間を貫通する貫通孔５と、を有するセラミック配線基板１ａであって、上記貫通孔５の開口部を囲む載置面４に沿って、傾斜面１０が形成されており、かかる傾斜面１０は、上記表面３側に向かって下がっている、セラミック配線基板１ａ。【選択図】 図１</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB0dg1y9PV0Vgj3DPL0c1dw8ncMclFw9HNR8HUN8fB3UfB3U_B19At1c3QOCQWrCPFwVQh29HXlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoZmhqZGRuaWjsZEKQIAqhAoyg</recordid><startdate>20160822</startdate><enddate>20160822</enddate><creator>KITO NAOKI</creator><creator>IGAWA TATSUHARU</creator><creator>HAYANO HISAO</creator><creator>NOZU KAZUYA</creator><creator>KAJITA JUNJI</creator><scope>EVB</scope></search><sort><creationdate>20160822</creationdate><title>CERAMIC WIRING BOARD AND METHOD OF MANUFACTURING THE SAME</title><author>KITO NAOKI ; IGAWA TATSUHARU ; HAYANO HISAO ; NOZU KAZUYA ; KAJITA JUNJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2016152279A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2016</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>KITO NAOKI</creatorcontrib><creatorcontrib>IGAWA TATSUHARU</creatorcontrib><creatorcontrib>HAYANO HISAO</creatorcontrib><creatorcontrib>NOZU KAZUYA</creatorcontrib><creatorcontrib>KAJITA JUNJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KITO NAOKI</au><au>IGAWA TATSUHARU</au><au>HAYANO HISAO</au><au>NOZU KAZUYA</au><au>KAJITA JUNJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CERAMIC WIRING BOARD AND METHOD OF MANUFACTURING THE SAME</title><date>2016-08-22</date><risdate>2016</risdate><abstract>PROBLEM TO BE SOLVED: To provide a ceramic wiring board including a through hole penetrating the surface and a mounting surface opposing the surface, or a recess opening to the mounting surface, having no micro irregularities on the mounting surface, and capable of keeping a stable posture even if the mounting surface is brought into surface contact with the surface of a surface plate, or the like, and to provide a method of manufacturing the same.SOLUTION: In a ceramic wiring board 1a including a board body 2a laminating a plurality of ceramic layers s1-s3, and having a surface 3 and a mounting surface 4 opposing the surface 3, and a through hole 5 penetrating between the surface 3 and mounting surface 4 in the board body 2a, an inclined plane 10 is formed along the mounting surface 4 surrounding the opening of the through hole 5, and the inclined plane 10 is inclining downward toward the surface 3 side.SELECTED DRAWING: Figure 1
【課題】表面と該表面に対向する載置面とを有する基板本体を貫通する貫通孔または前記載置面に開口する凹部を備え、前記載置面に微細な凹凸がなく、後工程で載置面を定盤などの表面上に面接触しても、安定した姿勢を保ち得るセラミック配線基板およびその製造方法を提供する。【解決手段】複数のセラミック層ｓ１〜ｓ３を積層してなり、且つ表面３および該表面３に対向する載置面４を有する基板本体２ａと、該基板本体２ａにおける表面３と載置面４との間を貫通する貫通孔５と、を有するセラミック配線基板１ａであって、上記貫通孔５の開口部を囲む載置面４に沿って、傾斜面１０が形成されており、かかる傾斜面１０は、上記表面３側に向かって下がっている、セラミック配線基板１ａ。【選択図】 図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | CERAMIC WIRING BOARD AND METHOD OF MANUFACTURING THE SAME |
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