MOUNTING SYSTEM AND MOUNTING METHOD OF ELECTRONIC COMPONENT
PROBLEM TO BE SOLVED: To provide a mounting system and a mounting method of an electronic component capable of mounting a plurality of electronic components at respective mounting plan positions, in more uniform mounting state.SOLUTION: A mounting system 2 of electronic component for mounting at lea...
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| creator | MIZUNO TORU MIYAKOSHI TOSHINOBU TAKESHIMA SATORU SAITO YUJI OTOMO TATSUNORI |
| description | PROBLEM TO BE SOLVED: To provide a mounting system and a mounting method of an electronic component capable of mounting a plurality of electronic components at respective mounting plan positions, in more uniform mounting state.SOLUTION: A mounting system 2 of electronic component for mounting at least a first electronic component 40a and a second electronic component 40b on a substrate 30 has a measurement device 6 for measuring the actual mounting position and/or the mounting inclination of the first electronic component 40a to a first recess 32a in which the first electronic component 40a will be mounted. Furthermore, this system 2 has a second mounting device 8 for mounting the second electronic component 40b in the second recess 32b of the substrate 30, on the basis of the actual mounting position data and/or the actual mounting inclination data of the first electronic component 40a, measured on the basis of the measurement device 6.SELECTED DRAWING: Figure 9
【課題】複数の電子部品を、各実装予定位置に対して、より均一な実装状態で実装することが可能な電子部品の実装システムおよび実装方法を提供すること。【解決手段】少なくとも第１電子部品４０ａと第２電子部品４０ｂとを基板３０に実装するための電子部品の実装システム２である。このシステム２は、第１電子部品４０ａが実装される予定の第１凹部３２ａに対する第１電子部品４０ａの実際の実装位置および／または実装傾きを測定する測定装置６を有する。また、このシステム２は、測定装置６に基づき測定された第１電子部品４０ａの実際の実装位置データおよび／または実際の実装傾きデータに基づき、基板３０の第２凹部３２ｂに第２電子部品４０ｂを実装するための第２実装装置８を有する。【選択図】図９ |
| format | Patent |
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【課題】複数の電子部品を、各実装予定位置に対して、より均一な実装状態で実装することが可能な電子部品の実装システムおよび実装方法を提供すること。【解決手段】少なくとも第１電子部品４０ａと第２電子部品４０ｂとを基板３０に実装するための電子部品の実装システム２である。このシステム２は、第１電子部品４０ａが実装される予定の第１凹部３２ａに対する第１電子部品４０ａの実際の実装位置および／または実装傾きを測定する測定装置６を有する。また、このシステム２は、測定装置６に基づき測定された第１電子部品４０ａの実際の実装位置データおよび／または実際の実装傾きデータに基づき、基板３０の第２凹部３２ｂに第２電子部品４０ｂを実装するための第２実装装置８を有する。【選択図】図９</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160808&DB=EPODOC&CC=JP&NR=2016143729A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160808&DB=EPODOC&CC=JP&NR=2016143729A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIZUNO TORU</creatorcontrib><creatorcontrib>MIYAKOSHI TOSHINOBU</creatorcontrib><creatorcontrib>TAKESHIMA SATORU</creatorcontrib><creatorcontrib>SAITO YUJI</creatorcontrib><creatorcontrib>OTOMO TATSUNORI</creatorcontrib><title>MOUNTING SYSTEM AND MOUNTING METHOD OF ELECTRONIC COMPONENT</title><description>PROBLEM TO BE SOLVED: To provide a mounting system and a mounting method of an electronic component capable of mounting a plurality of electronic components at respective mounting plan positions, in more uniform mounting state.SOLUTION: A mounting system 2 of electronic component for mounting at least a first electronic component 40a and a second electronic component 40b on a substrate 30 has a measurement device 6 for measuring the actual mounting position and/or the mounting inclination of the first electronic component 40a to a first recess 32a in which the first electronic component 40a will be mounted. Furthermore, this system 2 has a second mounting device 8 for mounting the second electronic component 40b in the second recess 32b of the substrate 30, on the basis of the actual mounting position data and/or the actual mounting inclination data of the first electronic component 40a, measured on the basis of the measurement device 6.SELECTED DRAWING: Figure 9
【課題】複数の電子部品を、各実装予定位置に対して、より均一な実装状態で実装することが可能な電子部品の実装システムおよび実装方法を提供すること。【解決手段】少なくとも第１電子部品４０ａと第２電子部品４０ｂとを基板３０に実装するための電子部品の実装システム２である。このシステム２は、第１電子部品４０ａが実装される予定の第１凹部３２ａに対する第１電子部品４０ａの実際の実装位置および／または実装傾きを測定する測定装置６を有する。また、このシステム２は、測定装置６に基づき測定された第１電子部品４０ａの実際の実装位置データおよび／または実際の実装傾きデータに基づき、基板３０の第２凹部３２ｂに第２電子部品４０ｂを実装するための第２実装装置８を有する。【選択図】図９</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD29Q_1C_H0c1cIjgwOcfVVcPRzUYCL-bqGePi7KPi7Kbj6uDqHBPn7eTorOPv7Bvj7ufqF8DCwpiXmFKfyQmluBiU31xBnD93Ugvz41OKCxOTUvNSSeK8AIwNDM0MTY3MjS0djohQBAFGsKgc</recordid><startdate>20160808</startdate><enddate>20160808</enddate><creator>MIZUNO TORU</creator><creator>MIYAKOSHI TOSHINOBU</creator><creator>TAKESHIMA SATORU</creator><creator>SAITO YUJI</creator><creator>OTOMO TATSUNORI</creator><scope>EVB</scope></search><sort><creationdate>20160808</creationdate><title>MOUNTING SYSTEM AND MOUNTING METHOD OF ELECTRONIC COMPONENT</title><author>MIZUNO TORU ; MIYAKOSHI TOSHINOBU ; TAKESHIMA SATORU ; SAITO YUJI ; OTOMO TATSUNORI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2016143729A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2016</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>MIZUNO TORU</creatorcontrib><creatorcontrib>MIYAKOSHI TOSHINOBU</creatorcontrib><creatorcontrib>TAKESHIMA SATORU</creatorcontrib><creatorcontrib>SAITO YUJI</creatorcontrib><creatorcontrib>OTOMO TATSUNORI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIZUNO TORU</au><au>MIYAKOSHI TOSHINOBU</au><au>TAKESHIMA SATORU</au><au>SAITO YUJI</au><au>OTOMO TATSUNORI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MOUNTING SYSTEM AND MOUNTING METHOD OF ELECTRONIC COMPONENT</title><date>2016-08-08</date><risdate>2016</risdate><abstract>PROBLEM TO BE SOLVED: To provide a mounting system and a mounting method of an electronic component capable of mounting a plurality of electronic components at respective mounting plan positions, in more uniform mounting state.SOLUTION: A mounting system 2 of electronic component for mounting at least a first electronic component 40a and a second electronic component 40b on a substrate 30 has a measurement device 6 for measuring the actual mounting position and/or the mounting inclination of the first electronic component 40a to a first recess 32a in which the first electronic component 40a will be mounted. Furthermore, this system 2 has a second mounting device 8 for mounting the second electronic component 40b in the second recess 32b of the substrate 30, on the basis of the actual mounting position data and/or the actual mounting inclination data of the first electronic component 40a, measured on the basis of the measurement device 6.SELECTED DRAWING: Figure 9
【課題】複数の電子部品を、各実装予定位置に対して、より均一な実装状態で実装することが可能な電子部品の実装システムおよび実装方法を提供すること。【解決手段】少なくとも第１電子部品４０ａと第２電子部品４０ｂとを基板３０に実装するための電子部品の実装システム２である。このシステム２は、第１電子部品４０ａが実装される予定の第１凹部３２ａに対する第１電子部品４０ａの実際の実装位置および／または実装傾きを測定する測定装置６を有する。また、このシステム２は、測定装置６に基づき測定された第１電子部品４０ａの実際の実装位置データおよび／または実際の実装傾きデータに基づき、基板３０の第２凹部３２ｂに第２電子部品４０ｂを実装するための第２実装装置８を有する。【選択図】図９</abstract><oa>free_for_read</oa></addata></record> |
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| title | MOUNTING SYSTEM AND MOUNTING METHOD OF ELECTRONIC COMPONENT |
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