COMPOSITION FOR FORMING COPPER FILM FOR LASER PROCESSING, MANUFACTURING METHOD OF WIRING BOARD, AND ELECTRONIC APPARATUS
PROBLEM TO BE SOLVED: To provide: a composition for forming a copper film for laser processing, capable of highly precisely forming a low-resistance copper wiring board at low energy by patterning using laser processing; a manufacturing method of a wiring board, using the composition for forming a c...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; jpn |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | ARITOME ISAO OKITA KENZO TANAKA TAKERO SATO KEISUKE SHIMODA SUGIO WATABE KAZUTO |
| description | PROBLEM TO BE SOLVED: To provide: a composition for forming a copper film for laser processing, capable of highly precisely forming a low-resistance copper wiring board at low energy by patterning using laser processing; a manufacturing method of a wiring board, using the composition for forming a copper film for laser processing; and an electronic apparatus including a wiring board obtained by the manufacturing method of a wiring board.SOLUTION: A composition for forming a copper film for laser processing is prepared, the composition containing a copper salt (A) and a solvent (B). A manufacturing method of a wiring board includes: a step (1) of coating the composition for forming a copper film for laser processing on a substrate to form a coat; a step (2) of heating the coat to form a copper film; and a step (3) of laser-processing the copper film to form a copper wiring. An electronic apparatus includes a wiring board manufactured by the manufacturing method of a wiring board.SELECTED DRAWING: None
【課題】レーザー加工によるパターニングによって、低抵抗な銅配線基板を、低エネルギーで高い精度で形成できるレーザー加工用銅膜形成用組成物、レーザー加工用銅膜形成用組成物を用いた配線基板の製造方法、および配線基板の製造方法によって得られた配線基板を有する電子機器を提供する【解決手段】、銅塩（Ａ）、および溶剤（Ｂ）を含むレーザー加工用銅膜形成用組成物を調製する。配線基板の製造方法は、基板上に、そのレーザー加工用銅膜形成用組成物を塗布し、塗膜を形成する工程（１）、および前記塗膜を加熱し、銅膜を形成する工程（２）、および前記銅膜をレーザー加工し、銅配線を形成する工程（３）を有する。電子機器は、その配線基板の製造方法によって製造された配線基板を有する。【選択図】なし |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2016139679A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2016139679A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2016139679A3</originalsourceid><addsrcrecordid>eNqNir0KwjAURrs4iPoOF-cK1kKl4zVNbKTJDfnBsRSJk2ihDj6-bfEBHD4-zuEskw8jZchJL0mDIDtNSX0GRsbwEWWjZt-gG9FYYty5MUhBoQ4CmQ926hX3NVVAAq5yFidCW6WAugLecOYtackAjUGLPrh1srh3jyFufr9KtoJ7Vu9i_2rj0He3-Izv9mIO-6zI8rI4lpj_FX0BGjc6ig</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>COMPOSITION FOR FORMING COPPER FILM FOR LASER PROCESSING, MANUFACTURING METHOD OF WIRING BOARD, AND ELECTRONIC APPARATUS</title><source>esp@cenet</source><creator>ARITOME ISAO ; OKITA KENZO ; TANAKA TAKERO ; SATO KEISUKE ; SHIMODA SUGIO ; WATABE KAZUTO</creator><creatorcontrib>ARITOME ISAO ; OKITA KENZO ; TANAKA TAKERO ; SATO KEISUKE ; SHIMODA SUGIO ; WATABE KAZUTO</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide: a composition for forming a copper film for laser processing, capable of highly precisely forming a low-resistance copper wiring board at low energy by patterning using laser processing; a manufacturing method of a wiring board, using the composition for forming a copper film for laser processing; and an electronic apparatus including a wiring board obtained by the manufacturing method of a wiring board.SOLUTION: A composition for forming a copper film for laser processing is prepared, the composition containing a copper salt (A) and a solvent (B). A manufacturing method of a wiring board includes: a step (1) of coating the composition for forming a copper film for laser processing on a substrate to form a coat; a step (2) of heating the coat to form a copper film; and a step (3) of laser-processing the copper film to form a copper wiring. An electronic apparatus includes a wiring board manufactured by the manufacturing method of a wiring board.SELECTED DRAWING: None
【課題】レーザー加工によるパターニングによって、低抵抗な銅配線基板を、低エネルギーで高い精度で形成できるレーザー加工用銅膜形成用組成物、レーザー加工用銅膜形成用組成物を用いた配線基板の製造方法、および配線基板の製造方法によって得られた配線基板を有する電子機器を提供する【解決手段】、銅塩（Ａ）、および溶剤（Ｂ）を含むレーザー加工用銅膜形成用組成物を調製する。配線基板の製造方法は、基板上に、そのレーザー加工用銅膜形成用組成物を塗布し、塗膜を形成する工程（１）、および前記塗膜を加熱し、銅膜を形成する工程（２）、および前記銅膜をレーザー加工し、銅配線を形成する工程（３）を有する。電子機器は、その配線基板の製造方法によって製造された配線基板を有する。【選択図】なし</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; CONDUCTORS ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; INSULATORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PRINTED CIRCUITS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160804&DB=EPODOC&CC=JP&NR=2016139679A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160804&DB=EPODOC&CC=JP&NR=2016139679A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ARITOME ISAO</creatorcontrib><creatorcontrib>OKITA KENZO</creatorcontrib><creatorcontrib>TANAKA TAKERO</creatorcontrib><creatorcontrib>SATO KEISUKE</creatorcontrib><creatorcontrib>SHIMODA SUGIO</creatorcontrib><creatorcontrib>WATABE KAZUTO</creatorcontrib><title>COMPOSITION FOR FORMING COPPER FILM FOR LASER PROCESSING, MANUFACTURING METHOD OF WIRING BOARD, AND ELECTRONIC APPARATUS</title><description>PROBLEM TO BE SOLVED: To provide: a composition for forming a copper film for laser processing, capable of highly precisely forming a low-resistance copper wiring board at low energy by patterning using laser processing; a manufacturing method of a wiring board, using the composition for forming a copper film for laser processing; and an electronic apparatus including a wiring board obtained by the manufacturing method of a wiring board.SOLUTION: A composition for forming a copper film for laser processing is prepared, the composition containing a copper salt (A) and a solvent (B). A manufacturing method of a wiring board includes: a step (1) of coating the composition for forming a copper film for laser processing on a substrate to form a coat; a step (2) of heating the coat to form a copper film; and a step (3) of laser-processing the copper film to form a copper wiring. An electronic apparatus includes a wiring board manufactured by the manufacturing method of a wiring board.SELECTED DRAWING: None
【課題】レーザー加工によるパターニングによって、低抵抗な銅配線基板を、低エネルギーで高い精度で形成できるレーザー加工用銅膜形成用組成物、レーザー加工用銅膜形成用組成物を用いた配線基板の製造方法、および配線基板の製造方法によって得られた配線基板を有する電子機器を提供する【解決手段】、銅塩（Ａ）、および溶剤（Ｂ）を含むレーザー加工用銅膜形成用組成物を調製する。配線基板の製造方法は、基板上に、そのレーザー加工用銅膜形成用組成物を塗布し、塗膜を形成する工程（１）、および前記塗膜を加熱し、銅膜を形成する工程（２）、および前記銅膜をレーザー加工し、銅配線を形成する工程（３）を有する。電子機器は、その配線基板の製造方法によって製造された配線基板を有する。【選択図】なし</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>CONDUCTORS</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>INSULATORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNir0KwjAURrs4iPoOF-cK1kKl4zVNbKTJDfnBsRSJk2ihDj6-bfEBHD4-zuEskw8jZchJL0mDIDtNSX0GRsbwEWWjZt-gG9FYYty5MUhBoQ4CmQ926hX3NVVAAq5yFidCW6WAugLecOYtackAjUGLPrh1srh3jyFufr9KtoJ7Vu9i_2rj0He3-Izv9mIO-6zI8rI4lpj_FX0BGjc6ig</recordid><startdate>20160804</startdate><enddate>20160804</enddate><creator>ARITOME ISAO</creator><creator>OKITA KENZO</creator><creator>TANAKA TAKERO</creator><creator>SATO KEISUKE</creator><creator>SHIMODA SUGIO</creator><creator>WATABE KAZUTO</creator><scope>EVB</scope></search><sort><creationdate>20160804</creationdate><title>COMPOSITION FOR FORMING COPPER FILM FOR LASER PROCESSING, MANUFACTURING METHOD OF WIRING BOARD, AND ELECTRONIC APPARATUS</title><author>ARITOME ISAO ; OKITA KENZO ; TANAKA TAKERO ; SATO KEISUKE ; SHIMODA SUGIO ; WATABE KAZUTO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2016139679A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>CONDUCTORS</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>INSULATORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>ARITOME ISAO</creatorcontrib><creatorcontrib>OKITA KENZO</creatorcontrib><creatorcontrib>TANAKA TAKERO</creatorcontrib><creatorcontrib>SATO KEISUKE</creatorcontrib><creatorcontrib>SHIMODA SUGIO</creatorcontrib><creatorcontrib>WATABE KAZUTO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ARITOME ISAO</au><au>OKITA KENZO</au><au>TANAKA TAKERO</au><au>SATO KEISUKE</au><au>SHIMODA SUGIO</au><au>WATABE KAZUTO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COMPOSITION FOR FORMING COPPER FILM FOR LASER PROCESSING, MANUFACTURING METHOD OF WIRING BOARD, AND ELECTRONIC APPARATUS</title><date>2016-08-04</date><risdate>2016</risdate><abstract>PROBLEM TO BE SOLVED: To provide: a composition for forming a copper film for laser processing, capable of highly precisely forming a low-resistance copper wiring board at low energy by patterning using laser processing; a manufacturing method of a wiring board, using the composition for forming a copper film for laser processing; and an electronic apparatus including a wiring board obtained by the manufacturing method of a wiring board.SOLUTION: A composition for forming a copper film for laser processing is prepared, the composition containing a copper salt (A) and a solvent (B). A manufacturing method of a wiring board includes: a step (1) of coating the composition for forming a copper film for laser processing on a substrate to form a coat; a step (2) of heating the coat to form a copper film; and a step (3) of laser-processing the copper film to form a copper wiring. An electronic apparatus includes a wiring board manufactured by the manufacturing method of a wiring board.SELECTED DRAWING: None
【課題】レーザー加工によるパターニングによって、低抵抗な銅配線基板を、低エネルギーで高い精度で形成できるレーザー加工用銅膜形成用組成物、レーザー加工用銅膜形成用組成物を用いた配線基板の製造方法、および配線基板の製造方法によって得られた配線基板を有する電子機器を提供する【解決手段】、銅塩（Ａ）、および溶剤（Ｂ）を含むレーザー加工用銅膜形成用組成物を調製する。配線基板の製造方法は、基板上に、そのレーザー加工用銅膜形成用組成物を塗布し、塗膜を形成する工程（１）、および前記塗膜を加熱し、銅膜を形成する工程（２）、および前記銅膜をレーザー加工し、銅配線を形成する工程（３）を有する。電子機器は、その配線基板の製造方法によって製造された配線基板を有する。【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; jpn |
| recordid | cdi_epo_espacenet_JP2016139679A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONDUCTORS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | COMPOSITION FOR FORMING COPPER FILM FOR LASER PROCESSING, MANUFACTURING METHOD OF WIRING BOARD, AND ELECTRONIC APPARATUS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-12T22%3A45%3A55IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ARITOME%20ISAO&rft.date=2016-08-04&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2016139679A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |