DIFFERENTIAL TEMPERATURE SENSOR

PROBLEM TO BE SOLVED: To provide a differential temperature sensor.SOLUTION: A sensor (1) includes: an assembly of thermoelectric layers; a support member (2) including at least one first metallic connector pin (30) and at least one second metallic connector pin (31); a first metal connector and a s...

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Hauptverfasser: GUILLAUME SAVELLI, JOEL DUFOURCQ
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a differential temperature sensor.SOLUTION: A sensor (1) includes: an assembly of thermoelectric layers; a support member (2) including at least one first metallic connector pin (30) and at least one second metallic connector pin (31); a first metal connector and a second metal connector arranged to electrically connect the support member (2) respectively to a first connection pad and a second connection pad; and an external package (8) including a first surface and an opposite second surface (8b) intended to be respectively connected to a hot source and to a cold source, a first via (80) connecting the first surface (8a) to each first metallic connector pin (30), and a second via (81) connecting the second surface (8b) to each second metallic connector pin (31); and the support member (2) includes thermal conductors between the connector pins (30, 31) and the metal connectors.SELECTED DRAWING: Figure 7 【課題】差温センサを提供すること。【解決手段】熱電層の組立体と、少なくとも1つの第1の金属コネクタ・ピン(30)および少なくとも1つの第2の金属コネクタ・ピン(31)を含む支持部材(2)と、支持部材(2)を第1の接続パッドおよび第2の接続パッドにそれぞれ電気的に接続するように配置された第1の金属接続手段および第2の金属接続手段と、高熱源および冷熱源にそれぞれ接続されることを意図されている第1の面および反対の第2の面(8b)と第1の面(8a)を各第1の金属コネクタ・ピン(30)に接続する第1のビア(80)と第2の面(8b)を各第2の金属コネクタ・ピン(31)に接続する第2のビア(81)とを備える外部パッケージ(8)とを含み、支持部材(2)が、コネクタ・ピン(30、31)と金属接続手段との間の熱伝達手段を備えるセンサ(1)。【選択図】図7