AUTOMATIC HEIGHT COMPENSATING AND CO-PLANAR LEVELING OF HEAT REMOVAL ASSEMBLY FOR MULTI-CHIP PACKAGES

PROBLEM TO BE SOLVED: To provide an individual heat removal assembly or individual heatsink for each target device or die from which the heat is to be removed, to cool multi-chip packages.SOLUTION: Embodiments of the present disclosure include a heat removal assembly 100 that is to thermally couple...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HARVEY R KOFSTAD, THOMAS A BOYD, HENRY C BOSAK
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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