AUTOMATIC HEIGHT COMPENSATING AND CO-PLANAR LEVELING OF HEAT REMOVAL ASSEMBLY FOR MULTI-CHIP PACKAGES

AUTOMATIC HEIGHT COMPENSATING AND CO-PLANAR LEVELING OF HEAT REMOVAL ASSEMBLY FOR MULTI-CHIP PACKAGES

PROBLEM TO BE SOLVED: To provide an individual heat removal assembly or individual heatsink for each target device or die from which the heat is to be removed, to cool multi-chip packages.SOLUTION: Embodiments of the present disclosure include a heat removal assembly 100 that is to thermally couple...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HARVEY R KOFSTAD, THOMAS A BOYD, HENRY C BOSAK
Format: Patent
Sprache:eng ; jpn
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an individual heat removal assembly or individual heatsink for each target device or die from which the heat is to be removed, to cool multi-chip packages.SOLUTION: Embodiments of the present disclosure include a heat removal assembly 100 that is to thermally couple with two or more dice 180 of an electronic device. The heat removal assembly 100 includes a bellows 120 to automatically adjust a position of at least one surface 165 relative to another surface 170.SELECTED DRAWING: Figure 2 【課題】マルチチップパッケージを冷却するための熱が取り除かれるそれぞれのターゲットデバイスまたはダイに対して個々の熱除去アセンブリまたは個々のヒートシンクを提供する。【解決手段】電子デバイスの２またはそれより多いダイ１８０に熱的に連結される熱除去アセンブリ１００を含む。熱除去アセンブリ１００は、少なくとも１つの表面１６５の、他の表面１７０に対する位置を自動的に調整するベローズ１２０を含む。【選択図】図２