DECORATIVE COMPONENT
PROBLEM TO BE SOLVED: To provide a decorative component having excellent appearance properties and functionality and further capable of improving productivity.SOLUTION: Provided is a decorative component comprising: a base material; a Cu plated layer laminated on the base material; and a silver whit...
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| creator | YOSHIDA JUNJI YOSHIZAWA YOSHINORI SUZUKI TAKESHI ANDO HIROAKI IDO NAOYASU |
| description | PROBLEM TO BE SOLVED: To provide a decorative component having excellent appearance properties and functionality and further capable of improving productivity.SOLUTION: Provided is a decorative component comprising: a base material; a Cu plated layer laminated on the base material; and a silver white metallic plated layer directly laminated on the Cu plated layer, in which surface roughness (Ra) is 0.015 μm or lower and waviness (W) is 0.060 μm or lower. Further, it is preferable that a transparent or translucent protective layer be formed on the silver white metallic plated layer. It is preferable that alkali chemical treatment be performed before the transparent or translucent protective layer is formed. It is preferable that the thickness of the Cu plated layer be 5 to 30 μm in the case the silver white metallic plated layer is a Sn or Sn alloy plated layer. It is preferable that the film thickness of the Cu plated layer be 15 to 30 μm in the case the silver white metallic plated layer is a Cu plated layer.SELECTED DRAWING: None
【課題】優れた外観特性と機能性を有するとともに、生産性を向上させることができる装飾部品を提供する。【解決手段】本発明は、基材と、該基材上に積層されたＣｕめっき層と、該Ｃｕめっき層に直接積層された銀白色金属めっき層と、を有し、表面粗さ（Ｒａ）が０．０１５μｍ以下であって、うねり（Ｗ）が０．０６０μｍ以下である装飾部品である。さらに、前記銀白色金属めっき層の上に透明又は半透明の保護層を形成することが好ましい。前記透明又は半透明の保護層を形成する前に、アルカリ化成処理が行われることが好ましい。前記銀白色金属めっき層が、Ｓｎ又はＳｎ合金めっき層である場合、前記Ｃｕめっき層の膜厚は、５〜３０μｍであることが好ましい。前記銀白色金属めっき層が、Ｃｒめっき層である場合、前記Ｃｕめっき層の膜厚は、１５〜３０μｍであることが好ましい。【選択図】なし |
| format | Patent |
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【課題】優れた外観特性と機能性を有するとともに、生産性を向上させることができる装飾部品を提供する。【解決手段】本発明は、基材と、該基材上に積層されたＣｕめっき層と、該Ｃｕめっき層に直接積層された銀白色金属めっき層と、を有し、表面粗さ（Ｒａ）が０．０１５μｍ以下であって、うねり（Ｗ）が０．０６０μｍ以下である装飾部品である。さらに、前記銀白色金属めっき層の上に透明又は半透明の保護層を形成することが好ましい。前記透明又は半透明の保護層を形成する前に、アルカリ化成処理が行われることが好ましい。前記銀白色金属めっき層が、Ｓｎ又はＳｎ合金めっき層である場合、前記Ｃｕめっき層の膜厚は、５〜３０μｍであることが好ましい。前記銀白色金属めっき層が、Ｃｒめっき層である場合、前記Ｃｕめっき層の膜厚は、１５〜３０μｍであることが好ましい。【選択図】なし</description><language>eng ; jpn</language><subject>APPARATUS THEREFOR ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; METALLURGY ; PERFORMING OPERATIONS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; TRANSPORTING</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160512&DB=EPODOC&CC=JP&NR=2016074198A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160512&DB=EPODOC&CC=JP&NR=2016074198A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOSHIDA JUNJI</creatorcontrib><creatorcontrib>YOSHIZAWA YOSHINORI</creatorcontrib><creatorcontrib>SUZUKI TAKESHI</creatorcontrib><creatorcontrib>ANDO HIROAKI</creatorcontrib><creatorcontrib>IDO NAOYASU</creatorcontrib><title>DECORATIVE COMPONENT</title><description>PROBLEM TO BE SOLVED: To provide a decorative component having excellent appearance properties and functionality and further capable of improving productivity.SOLUTION: Provided is a decorative component comprising: a base material; a Cu plated layer laminated on the base material; and a silver white metallic plated layer directly laminated on the Cu plated layer, in which surface roughness (Ra) is 0.015 μm or lower and waviness (W) is 0.060 μm or lower. Further, it is preferable that a transparent or translucent protective layer be formed on the silver white metallic plated layer. It is preferable that alkali chemical treatment be performed before the transparent or translucent protective layer is formed. It is preferable that the thickness of the Cu plated layer be 5 to 30 μm in the case the silver white metallic plated layer is a Sn or Sn alloy plated layer. It is preferable that the film thickness of the Cu plated layer be 15 to 30 μm in the case the silver white metallic plated layer is a Cu plated layer.SELECTED DRAWING: None
【課題】優れた外観特性と機能性を有するとともに、生産性を向上させることができる装飾部品を提供する。【解決手段】本発明は、基材と、該基材上に積層されたＣｕめっき層と、該Ｃｕめっき層に直接積層された銀白色金属めっき層と、を有し、表面粗さ（Ｒａ）が０．０１５μｍ以下であって、うねり（Ｗ）が０．０６０μｍ以下である装飾部品である。さらに、前記銀白色金属めっき層の上に透明又は半透明の保護層を形成することが好ましい。前記透明又は半透明の保護層を形成する前に、アルカリ化成処理が行われることが好ましい。前記銀白色金属めっき層が、Ｓｎ又はＳｎ合金めっき層である場合、前記Ｃｕめっき層の膜厚は、５〜３０μｍであることが好ましい。前記銀白色金属めっき層が、Ｃｒめっき層である場合、前記Ｃｕめっき層の膜厚は、１５〜３０μｍであることが好ましい。【選択図】なし</description><subject>APPARATUS THEREFOR</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBBxcXX2D3IM8QxzVXD29w3w93P1C-FhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhmYG5iaGlhaOxkQpAgDAgR80</recordid><startdate>20160512</startdate><enddate>20160512</enddate><creator>YOSHIDA JUNJI</creator><creator>YOSHIZAWA YOSHINORI</creator><creator>SUZUKI TAKESHI</creator><creator>ANDO HIROAKI</creator><creator>IDO NAOYASU</creator><scope>EVB</scope></search><sort><creationdate>20160512</creationdate><title>DECORATIVE COMPONENT</title><author>YOSHIDA JUNJI ; YOSHIZAWA YOSHINORI ; SUZUKI TAKESHI ; ANDO HIROAKI ; IDO NAOYASU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2016074198A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2016</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>YOSHIDA JUNJI</creatorcontrib><creatorcontrib>YOSHIZAWA YOSHINORI</creatorcontrib><creatorcontrib>SUZUKI TAKESHI</creatorcontrib><creatorcontrib>ANDO HIROAKI</creatorcontrib><creatorcontrib>IDO NAOYASU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YOSHIDA JUNJI</au><au>YOSHIZAWA YOSHINORI</au><au>SUZUKI TAKESHI</au><au>ANDO HIROAKI</au><au>IDO NAOYASU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DECORATIVE COMPONENT</title><date>2016-05-12</date><risdate>2016</risdate><abstract>PROBLEM TO BE SOLVED: To provide a decorative component having excellent appearance properties and functionality and further capable of improving productivity.SOLUTION: Provided is a decorative component comprising: a base material; a Cu plated layer laminated on the base material; and a silver white metallic plated layer directly laminated on the Cu plated layer, in which surface roughness (Ra) is 0.015 μm or lower and waviness (W) is 0.060 μm or lower. Further, it is preferable that a transparent or translucent protective layer be formed on the silver white metallic plated layer. It is preferable that alkali chemical treatment be performed before the transparent or translucent protective layer is formed. It is preferable that the thickness of the Cu plated layer be 5 to 30 μm in the case the silver white metallic plated layer is a Sn or Sn alloy plated layer. It is preferable that the film thickness of the Cu plated layer be 15 to 30 μm in the case the silver white metallic plated layer is a Cu plated layer.SELECTED DRAWING: None
【課題】優れた外観特性と機能性を有するとともに、生産性を向上させることができる装飾部品を提供する。【解決手段】本発明は、基材と、該基材上に積層されたＣｕめっき層と、該Ｃｕめっき層に直接積層された銀白色金属めっき層と、を有し、表面粗さ（Ｒａ）が０．０１５μｍ以下であって、うねり（Ｗ）が０．０６０μｍ以下である装飾部品である。さらに、前記銀白色金属めっき層の上に透明又は半透明の保護層を形成することが好ましい。前記透明又は半透明の保護層を形成する前に、アルカリ化成処理が行われることが好ましい。前記銀白色金属めっき層が、Ｓｎ又はＳｎ合金めっき層である場合、前記Ｃｕめっき層の膜厚は、５〜３０μｍであることが好ましい。前記銀白色金属めっき層が、Ｃｒめっき層である場合、前記Ｃｕめっき層の膜厚は、１５〜３０μｍであることが好ましい。【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING |
| title | DECORATIVE COMPONENT |
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