OPTICAL MODULE, OPTICAL TRANSMITTER/RECEIVER MODULE, PRINTED CIRCUIT BOARD, FLEXIBLE BOARD
PROBLEM TO BE SOLVED: To provide an optical module which reduces reflection or radiation at a connection point and reduces signal deterioration of an electric signal to be transmitted, an optical transmitter/receiver module, a printed circuit board and a flexible board.SOLUTION: The optical module i...
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creator | GOTO FUMITOSHI |
description | PROBLEM TO BE SOLVED: To provide an optical module which reduces reflection or radiation at a connection point and reduces signal deterioration of an electric signal to be transmitted, an optical transmitter/receiver module, a printed circuit board and a flexible board.SOLUTION: The optical module includes: a first board including a first signaling terminal part and a first grounding terminal part which are formed on a front surface; and a second board including a second signaling terminal part and a second grounding terminal part which are formed on a rear surface. The first board further includes: a first dielectric layer; first signaling wiring that is formed on a front surface of the first dielectric layer; a first grounding conductor layer which is formed on a rear surface of the first dielectric layer; and a first penetration grounding conductor which penetrates the first dielectric layer from the rear surface to the front surface. The first grounding terminal part is formed in a first region and a second region which are positioned oppositely to each other while interposing the first signaling terminal part therebetween in a first direction in a planar view, and in a third region that is specified at a position over the first signaling terminal part in a second direction that is orthogonal to the first direction.SELECTED DRAWING: Figure 3A
【課題】接続箇所における反射や放射が軽減され、伝送する電気信号の信号劣化が低減される、光モジュール、光送受信モジュール、プリント基板及びフレキシブル基板の提供。【解決手段】表面に形成される第1信号端子部及び第1接地端子部、を備える第1基板と、裏面に形成される第2信号端子部及び第2接地端子部、を備える第2基板と、を備える、光モジュールであって、前記第1基板は、第1誘電体層と、前記第1誘電体層の表面に形成される第1信号配線と、前記第1誘電体層の裏面に形成される第1接地導体層と、前記第1誘電体層を裏面から表面へ貫通する第1貫通接地導体と、をさらに備え、前記第1接地端子部は、平面視して、第1の方向において前記第1信号端子部を挟んで互いに反対側に位置する第1領域及び第2領域、並びに、前記第1の方向に直交する第2の方向において前記第1信号端子部を越えた位置に規定される第3領域、に形成される。【選択図】図3A |
format | Patent |
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【課題】接続箇所における反射や放射が軽減され、伝送する電気信号の信号劣化が低減される、光モジュール、光送受信モジュール、プリント基板及びフレキシブル基板の提供。【解決手段】表面に形成される第1信号端子部及び第1接地端子部、を備える第1基板と、裏面に形成される第2信号端子部及び第2接地端子部、を備える第2基板と、を備える、光モジュールであって、前記第1基板は、第1誘電体層と、前記第1誘電体層の表面に形成される第1信号配線と、前記第1誘電体層の裏面に形成される第1接地導体層と、前記第1誘電体層を裏面から表面へ貫通する第1貫通接地導体と、をさらに備え、前記第1接地端子部は、平面視して、第1の方向において前記第1信号端子部を挟んで互いに反対側に位置する第1領域及び第2領域、並びに、前記第1の方向に直交する第2の方向において前記第1信号端子部を越えた位置に規定される第3領域、に形成される。【選択図】図3A</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160509&DB=EPODOC&CC=JP&NR=2016072514A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160509&DB=EPODOC&CC=JP&NR=2016072514A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GOTO FUMITOSHI</creatorcontrib><title>OPTICAL MODULE, OPTICAL TRANSMITTER/RECEIVER MODULE, PRINTED CIRCUIT BOARD, FLEXIBLE BOARD</title><description>PROBLEM TO BE SOLVED: To provide an optical module which reduces reflection or radiation at a connection point and reduces signal deterioration of an electric signal to be transmitted, an optical transmitter/receiver module, a printed circuit board and a flexible board.SOLUTION: The optical module includes: a first board including a first signaling terminal part and a first grounding terminal part which are formed on a front surface; and a second board including a second signaling terminal part and a second grounding terminal part which are formed on a rear surface. The first board further includes: a first dielectric layer; first signaling wiring that is formed on a front surface of the first dielectric layer; a first grounding conductor layer which is formed on a rear surface of the first dielectric layer; and a first penetration grounding conductor which penetrates the first dielectric layer from the rear surface to the front surface. The first grounding terminal part is formed in a first region and a second region which are positioned oppositely to each other while interposing the first signaling terminal part therebetween in a first direction in a planar view, and in a third region that is specified at a position over the first signaling terminal part in a second direction that is orthogonal to the first direction.SELECTED DRAWING: Figure 3A
【課題】接続箇所における反射や放射が軽減され、伝送する電気信号の信号劣化が低減される、光モジュール、光送受信モジュール、プリント基板及びフレキシブル基板の提供。【解決手段】表面に形成される第1信号端子部及び第1接地端子部、を備える第1基板と、裏面に形成される第2信号端子部及び第2接地端子部、を備える第2基板と、を備える、光モジュールであって、前記第1基板は、第1誘電体層と、前記第1誘電体層の表面に形成される第1信号配線と、前記第1誘電体層の裏面に形成される第1接地導体層と、前記第1誘電体層を裏面から表面へ貫通する第1貫通接地導体と、をさらに備え、前記第1接地端子部は、平面視して、第1の方向において前記第1信号端子部を挟んで互いに反対側に位置する第1領域及び第2領域、並びに、前記第1の方向に直交する第2の方向において前記第1信号端子部を越えた位置に規定される第3領域、に形成される。【選択図】図3A</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIjyDwjxdHb0UfD1dwn1cdVRgPFDghz9gn09Q0Jcg_SDXJ1dPcNcg-CKAoI8_UJcXRScPYOcQz1DFJz8HYNcdBTcfFwjPJ18XCF8HgbWtMSc4lReKM3NoOTmGuLsoZtakB-fWlyQmJyal1oS7xVgZGBoZmBuZGpo4mhMlCIAtJYyGg</recordid><startdate>20160509</startdate><enddate>20160509</enddate><creator>GOTO FUMITOSHI</creator><scope>EVB</scope></search><sort><creationdate>20160509</creationdate><title>OPTICAL MODULE, OPTICAL TRANSMITTER/RECEIVER MODULE, PRINTED CIRCUIT BOARD, FLEXIBLE BOARD</title><author>GOTO FUMITOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2016072514A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2016</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>GOTO FUMITOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GOTO FUMITOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>OPTICAL MODULE, OPTICAL TRANSMITTER/RECEIVER MODULE, PRINTED CIRCUIT BOARD, FLEXIBLE BOARD</title><date>2016-05-09</date><risdate>2016</risdate><abstract>PROBLEM TO BE SOLVED: To provide an optical module which reduces reflection or radiation at a connection point and reduces signal deterioration of an electric signal to be transmitted, an optical transmitter/receiver module, a printed circuit board and a flexible board.SOLUTION: The optical module includes: a first board including a first signaling terminal part and a first grounding terminal part which are formed on a front surface; and a second board including a second signaling terminal part and a second grounding terminal part which are formed on a rear surface. The first board further includes: a first dielectric layer; first signaling wiring that is formed on a front surface of the first dielectric layer; a first grounding conductor layer which is formed on a rear surface of the first dielectric layer; and a first penetration grounding conductor which penetrates the first dielectric layer from the rear surface to the front surface. The first grounding terminal part is formed in a first region and a second region which are positioned oppositely to each other while interposing the first signaling terminal part therebetween in a first direction in a planar view, and in a third region that is specified at a position over the first signaling terminal part in a second direction that is orthogonal to the first direction.SELECTED DRAWING: Figure 3A
【課題】接続箇所における反射や放射が軽減され、伝送する電気信号の信号劣化が低減される、光モジュール、光送受信モジュール、プリント基板及びフレキシブル基板の提供。【解決手段】表面に形成される第1信号端子部及び第1接地端子部、を備える第1基板と、裏面に形成される第2信号端子部及び第2接地端子部、を備える第2基板と、を備える、光モジュールであって、前記第1基板は、第1誘電体層と、前記第1誘電体層の表面に形成される第1信号配線と、前記第1誘電体層の裏面に形成される第1接地導体層と、前記第1誘電体層を裏面から表面へ貫通する第1貫通接地導体と、をさらに備え、前記第1接地端子部は、平面視して、第1の方向において前記第1信号端子部を挟んで互いに反対側に位置する第1領域及び第2領域、並びに、前記第1の方向に直交する第2の方向において前記第1信号端子部を越えた位置に規定される第3領域、に形成される。【選択図】図3A</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PRINTED CIRCUITS |
title | OPTICAL MODULE, OPTICAL TRANSMITTER/RECEIVER MODULE, PRINTED CIRCUIT BOARD, FLEXIBLE BOARD |
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