OPTICAL MODULE, OPTICAL TRANSMITTER/RECEIVER MODULE, PRINTED CIRCUIT BOARD, FLEXIBLE BOARD

PROBLEM TO BE SOLVED: To provide an optical module which reduces reflection or radiation at a connection point and reduces signal deterioration of an electric signal to be transmitted, an optical transmitter/receiver module, a printed circuit board and a flexible board.SOLUTION: The optical module i...

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description PROBLEM TO BE SOLVED: To provide an optical module which reduces reflection or radiation at a connection point and reduces signal deterioration of an electric signal to be transmitted, an optical transmitter/receiver module, a printed circuit board and a flexible board.SOLUTION: The optical module includes: a first board including a first signaling terminal part and a first grounding terminal part which are formed on a front surface; and a second board including a second signaling terminal part and a second grounding terminal part which are formed on a rear surface. The first board further includes: a first dielectric layer; first signaling wiring that is formed on a front surface of the first dielectric layer; a first grounding conductor layer which is formed on a rear surface of the first dielectric layer; and a first penetration grounding conductor which penetrates the first dielectric layer from the rear surface to the front surface. The first grounding terminal part is formed in a first region and a second region which are positioned oppositely to each other while interposing the first signaling terminal part therebetween in a first direction in a planar view, and in a third region that is specified at a position over the first signaling terminal part in a second direction that is orthogonal to the first direction.SELECTED DRAWING: Figure 3A 【課題】接続箇所における反射や放射が軽減され、伝送する電気信号の信号劣化が低減される、光モジュール、光送受信モジュール、プリント基板及びフレキシブル基板の提供。【解決手段】表面に形成される第1信号端子部及び第1接地端子部、を備える第1基板と、裏面に形成される第2信号端子部及び第2接地端子部、を備える第2基板と、を備える、光モジュールであって、前記第1基板は、第1誘電体層と、前記第1誘電体層の表面に形成される第1信号配線と、前記第1誘電体層の裏面に形成される第1接地導体層と、前記第1誘電体層を裏面から表面へ貫通する第1貫通接地導体と、をさらに備え、前記第1接地端子部は、平面視して、第1の方向において前記第1信号端子部を挟んで互いに反対側に位置する第1領域及び第2領域、並びに、前記第1の方向に直交する第2の方向において前記第1信号端子部を越えた位置に規定される第3領域、に形成される。【選択図】図3A
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The first board further includes: a first dielectric layer; first signaling wiring that is formed on a front surface of the first dielectric layer; a first grounding conductor layer which is formed on a rear surface of the first dielectric layer; and a first penetration grounding conductor which penetrates the first dielectric layer from the rear surface to the front surface. The first grounding terminal part is formed in a first region and a second region which are positioned oppositely to each other while interposing the first signaling terminal part therebetween in a first direction in a planar view, and in a third region that is specified at a position over the first signaling terminal part in a second direction that is orthogonal to the first direction.SELECTED DRAWING: Figure 3A 【課題】接続箇所における反射や放射が軽減され、伝送する電気信号の信号劣化が低減される、光モジュール、光送受信モジュール、プリント基板及びフレキシブル基板の提供。【解決手段】表面に形成される第1信号端子部及び第1接地端子部、を備える第1基板と、裏面に形成される第2信号端子部及び第2接地端子部、を備える第2基板と、を備える、光モジュールであって、前記第1基板は、第1誘電体層と、前記第1誘電体層の表面に形成される第1信号配線と、前記第1誘電体層の裏面に形成される第1接地導体層と、前記第1誘電体層を裏面から表面へ貫通する第1貫通接地導体と、をさらに備え、前記第1接地端子部は、平面視して、第1の方向において前記第1信号端子部を挟んで互いに反対側に位置する第1領域及び第2領域、並びに、前記第1の方向に直交する第2の方向において前記第1信号端子部を越えた位置に規定される第3領域、に形成される。【選択図】図3A</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160509&amp;DB=EPODOC&amp;CC=JP&amp;NR=2016072514A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160509&amp;DB=EPODOC&amp;CC=JP&amp;NR=2016072514A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GOTO FUMITOSHI</creatorcontrib><title>OPTICAL MODULE, OPTICAL TRANSMITTER/RECEIVER MODULE, PRINTED CIRCUIT BOARD, FLEXIBLE BOARD</title><description>PROBLEM TO BE SOLVED: To provide an optical module which reduces reflection or radiation at a connection point and reduces signal deterioration of an electric signal to be transmitted, an optical transmitter/receiver module, a printed circuit board and a flexible board.SOLUTION: The optical module includes: a first board including a first signaling terminal part and a first grounding terminal part which are formed on a front surface; and a second board including a second signaling terminal part and a second grounding terminal part which are formed on a rear surface. The first board further includes: a first dielectric layer; first signaling wiring that is formed on a front surface of the first dielectric layer; a first grounding conductor layer which is formed on a rear surface of the first dielectric layer; and a first penetration grounding conductor which penetrates the first dielectric layer from the rear surface to the front surface. 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The first board further includes: a first dielectric layer; first signaling wiring that is formed on a front surface of the first dielectric layer; a first grounding conductor layer which is formed on a rear surface of the first dielectric layer; and a first penetration grounding conductor which penetrates the first dielectric layer from the rear surface to the front surface. The first grounding terminal part is formed in a first region and a second region which are positioned oppositely to each other while interposing the first signaling terminal part therebetween in a first direction in a planar view, and in a third region that is specified at a position over the first signaling terminal part in a second direction that is orthogonal to the first direction.SELECTED DRAWING: Figure 3A 【課題】接続箇所における反射や放射が軽減され、伝送する電気信号の信号劣化が低減される、光モジュール、光送受信モジュール、プリント基板及びフレキシブル基板の提供。【解決手段】表面に形成される第1信号端子部及び第1接地端子部、を備える第1基板と、裏面に形成される第2信号端子部及び第2接地端子部、を備える第2基板と、を備える、光モジュールであって、前記第1基板は、第1誘電体層と、前記第1誘電体層の表面に形成される第1信号配線と、前記第1誘電体層の裏面に形成される第1接地導体層と、前記第1誘電体層を裏面から表面へ貫通する第1貫通接地導体と、をさらに備え、前記第1接地端子部は、平面視して、第1の方向において前記第1信号端子部を挟んで互いに反対側に位置する第1領域及び第2領域、並びに、前記第1の方向に直交する第2の方向において前記第1信号端子部を越えた位置に規定される第3領域、に形成される。【選択図】図3A</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
PRINTED CIRCUITS
title OPTICAL MODULE, OPTICAL TRANSMITTER/RECEIVER MODULE, PRINTED CIRCUIT BOARD, FLEXIBLE BOARD
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