SUBSTRATE CONNECTION STRUCTURE

PROBLEM TO BE SOLVED: To prevent a heavy load from being applied to a soldered portion between a connector and a substrate when connecting two substrates which are opposite to each other.SOLUTION: A connector 17 is mounted on a main substrate 11 while soldering a lower end 18a of a connection terminal 18 to a first conductor pattern 11d of the main substrate 11. In the state where an ICM substrate 13 is disposed oppositely to the main substrate 11 in such a form that a second conductor pattern 13d can be brought into contact with an upper end 18b of the connection terminal 18 of the connector 17, a screw 21 is made penetrate a second screw insertion hole part 13c of the ICM substrate 13, a screw insertion hole part 20a of a regulation member 20 and a first screw insertion hole part 11c of the main substrate 11. By threading an end of the screw 21 protruding from the main substrate 11 with a fixture 23, the main substrate 11, the regulation member 20 and the ICM substrate 13 are coupled and the second conductor pattern 13d and the upper end 18b of the connection terminal 18 are conducted.SELECTED DRAWING: Figure 2 【課題】対面する二つの基板を接続する場合に、コネクタと基板との半田付け部分に大きな負荷がかからないようにする。【解決手段】 コネクタ１７を、接続端子１８の下端部１８ａをメイン基板１１の第１導体パターン１１ｄに半田付した状態でメイン基板１１に実装し、ＩＣＭ基板１３を第２導体パターン１３ｄがコネクタ１７の接続端子１８の上端部１８ｂと接触可能な形態でメイン基板１１と対面するように配置させた状態で、ねじ２１を、ＩＣＭ基板１３の第２ねじ挿通孔部１３ｃと、規制部材２０のねじ貫通孔部２０ａと、メイン基板１１の第１ねじ挿通孔部１１ｃとを貫通させ、メイン基板１１から突出するねじ２１の端部を止め具２３に螺合することにより、メイン基板１１、規制部材２０及びＩＣＭ基板１３を締結すると共に、第２導体パターン１３ｄと接続端子１８の上端部１８ｂとを導通する。【選択図】図２