METHOD FOR ATTACHING OPTICAL FUNCTIONAL FILM TO DISPLAY CELL WITH FLEXIBLE THIN FILM STRUCTURE

PROBLEM TO BE SOLVED: To provide a method for handling a display cell with a flexible thin film structure, which is capable of transferring to a next step a display cell with a flexible thin film structure formed on a resin base material together with a heat-resistant substrate such as a glass subst...

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Hauptverfasser: KOSHIO SATOSHI, MURAKAMI NAO, NAKANISHI TADATOSHI, JO SOYA
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for handling a display cell with a flexible thin film structure, which is capable of transferring to a next step a display cell with a flexible thin film structure formed on a resin base material together with a heat-resistant substrate such as a glass substrate, without using a suction pad having a vacuum suction function.SOLUTION: A motherboard structure, in which a cell motherboard B consisting of a resin base material 4 and at least one display cell 1 which is formed on the resin base material and has a display surface with a flexible thin film structure is supported on a heat-resistant mother substrate 3, has an adhesive layer 21f formed on the display surface of the display cell. Then, a long-sized tape-like optical functional film 83 is contacted with the adhesive layer formed on the display surface of the display cell to join the optical functional film with the display cell, and the motherboard structure is transferred in a feed direction by movement of the optical functional film. Then, the heat-resistant mother substrate is peeled from the motherboard structure supported by the long-sized tape-like optical functional film and transferred in the feed direction.SELECTED DRAWING: Figure 10 【課題】真空吸着機能を備えた吸着盤を用いることなく、樹脂基材上に形成された可撓性薄膜構造の表示セルをガラス基板のような耐熱性基板とともに次工程に移送することができる、可撓性薄膜構造の表示セルの取り扱い方法を提供すること。【解決手段】樹脂基材4と、樹脂基材上に形成された可撓性薄膜構造で表示面を有する少なくとも1つの表示セル1と、からなるセルマザーボードBが耐熱性マザー基板3上に支持された、マザーボード構造体の表示セルの表示面に粘着剤層21fを形成する。次いで、長尺テープ状の光学機能フィルム83を表示セルの表示面に形成された粘着剤層に接触させ、光学機能フィルムを表示セルに接合して、光学機能フィルムの移動により、マザーボード構造体を送り方向に送る。そして、長尺テープ状の光学機能フィルムにより支持され送り方向に送られるマザーボード構造体から耐熱性マザー基板を剥離する。【選択図】図10