HOUSING STRUCTURE OF ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide a housing structure of an electronic apparatus which structure can easily handle communication with the outside regardless of wired and wireless connection, and can reduce manufacturing cost.SOLUTION: A housing structure of an electronic apparatus 1 according to the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MIFUNE FUMITOMO, YAMAUCHI YUJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TELEPHONIC COMMUNICATION
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