THERMOSETTING RESIN COMPOSITION, RESIN SHEET, PREPREG AND LAMINATE SHEET

PROBLEM TO BE SOLVED: To provide a resin composition high in heat-conductivity and excellent in insulation properties at high temperature, a resin sheet, a prepreg and a laminate sheet.SOLUTION: There is provided a thermosetting resin composition containing: a polyfunctional epoxy resin monomer; a p...

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Hauptverfasser:	ITO GEN, WAKIGUCHI KEITA, NISHIYAMA TOMOO, TAKASE YUJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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creator	ITO GEN WAKIGUCHI KEITA NISHIYAMA TOMOO TAKASE YUJI
description	PROBLEM TO BE SOLVED: To provide a resin composition high in heat-conductivity and excellent in insulation properties at high temperature, a resin sheet, a prepreg and a laminate sheet.SOLUTION: There is provided a thermosetting resin composition containing: a polyfunctional epoxy resin monomer; a polyfunctional amine compound; an inorganic filler (A) which is an aggregate of primary particles and has an average particle diameter d1 of 10 μm to 70 μm; and an inorganic filler (B) containing an inorganic filler(b) having an average particle diameter d3 of particle unit of 1 μm or more and less than 10 μm and an inorganic filler (c) having an average particle diameter d4 of 0.1 μm or more and less than 1 μm. A volume ratio of the (b) : the (c) is 90:10 to 70:30. A percentage content of the (A) to a total solid content is 10 to 55 vol.%, and a percentage content of (B) to the total solid content is 10 to 55 vol.%. The total percentage content of the (A) and the (B) is 30 to 80 vol.%. 【課題】熱伝導率が高く、且つ高温時の絶縁性に優れる樹脂組成物、樹脂シート、プリプレグ及び積層板を提供する。【解決手段】多官能エポキシ樹脂モノマーと、多官能アミン化合物と、一次粒子の凝集体であって平均粒径ｄ１が１０μｍ以上７０μｍ以下の無機充填材（Ａ）と、粒子単体の平均粒径ｄ３が１μｍ以上１０μｍ未満の無機充填材（ｂ）及び平均粒径ｄ４が０．１μｍ以上１μｍ未満の無機充填材（ｃ）を含む無機充填材（Ｂ）と、を含み、上記（ｂ）と（ｃ）との体積比が９０：１０〜７０：３０であり、総固形分に対して、上記（Ａ）の含有率が１０〜５５体積％であり、上記（Ｂ）の含有率が１０〜５５体積％であり、上記（Ａ）及び（Ｂ）の総含有率が３０〜８０体積％である熱硬化性樹脂組成物を提供する。【選択図】なし
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The total percentage content of the (A) and the (B) is 30 to 80 vol.%. 【課題】熱伝導率が高く、且つ高温時の絶縁性に優れる樹脂組成物、樹脂シート、プリプレグ及び積層板を提供する。【解決手段】多官能エポキシ樹脂モノマーと、多官能アミン化合物と、一次粒子の凝集体であって平均粒径ｄ１が１０μｍ以上７０μｍ以下の無機充填材（Ａ）と、粒子単体の平均粒径ｄ３が１μｍ以上１０μｍ未満の無機充填材（ｂ）及び平均粒径ｄ４が０．１μｍ以上１μｍ未満の無機充填材（ｃ）を含む無機充填材（Ｂ）と、を含み、上記（ｂ）と（ｃ）との体積比が９０：１０〜７０：３０であり、総固形分に対して、上記（Ａ）の含有率が１０〜５５体積％であり、上記（Ｂ）の含有率が１０〜５５体積％であり、上記（Ａ）及び（Ｂ）の総含有率が３０〜８０体積％である熱硬化性樹脂組成物を提供する。【選択図】なし</description><language>eng ; jpn</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; GENERAL PROCESSES OF COMPOUNDING ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; WORKING-UP</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151102&DB=EPODOC&CC=JP&NR=2015189884A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151102&DB=EPODOC&CC=JP&NR=2015189884A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ITO GEN</creatorcontrib><creatorcontrib>WAKIGUCHI KEITA</creatorcontrib><creatorcontrib>NISHIYAMA TOMOO</creatorcontrib><creatorcontrib>TAKASE YUJI</creatorcontrib><title>THERMOSETTING RESIN COMPOSITION, RESIN SHEET, PREPREG AND LAMINATE SHEET</title><description>PROBLEM TO BE SOLVED: To provide a resin composition high in heat-conductivity and excellent in insulation properties at high temperature, a resin sheet, a prepreg and a laminate sheet.SOLUTION: There is provided a thermosetting resin composition containing: a polyfunctional epoxy resin monomer; a polyfunctional amine compound; an inorganic filler (A) which is an aggregate of primary particles and has an average particle diameter d1 of 10 μm to 70 μm; and an inorganic filler (B) containing an inorganic filler(b) having an average particle diameter d3 of particle unit of 1 μm or more and less than 10 μm and an inorganic filler (c) having an average particle diameter d4 of 0.1 μm or more and less than 1 μm. 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The total percentage content of the (A) and the (B) is 30 to 80 vol.%. 【課題】熱伝導率が高く、且つ高温時の絶縁性に優れる樹脂組成物、樹脂シート、プリプレグ及び積層板を提供する。【解決手段】多官能エポキシ樹脂モノマーと、多官能アミン化合物と、一次粒子の凝集体であって平均粒径ｄ１が１０μｍ以上７０μｍ以下の無機充填材（Ａ）と、粒子単体の平均粒径ｄ３が１μｍ以上１０μｍ未満の無機充填材（ｂ）及び平均粒径ｄ４が０．１μｍ以上１μｍ未満の無機充填材（ｃ）を含む無機充填材（Ｂ）と、を含み、上記（ｂ）と（ｃ）との体積比が９０：１０〜７０：３０であり、総固形分に対して、上記（Ａ）の含有率が１０〜５５体積％であり、上記（Ｂ）の含有率が１０〜５５体積％であり、上記（Ａ）及び（Ｂ）の総含有率が３０〜８０体積％である熱硬化性樹脂組成物を提供する。【選択図】なし</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAI8XAN8vUPdg0J8fRzVwhyDfb0U3D29w3wD_YM8fT304EKBXu4uoboKAQEuQKRu4Kjn4uCj6Ovp59jiCtEjoeBNS0xpziVF0pzMyi5uYY4e-imFuTHpxYXJCan5qWWxHsFGBkYmhpaWFpYmDgaE6UIAHwFLX8</recordid><startdate>20151102</startdate><enddate>20151102</enddate><creator>ITO GEN</creator><creator>WAKIGUCHI KEITA</creator><creator>NISHIYAMA TOMOO</creator><creator>TAKASE YUJI</creator><scope>EVB</scope></search><sort><creationdate>20151102</creationdate><title>THERMOSETTING RESIN COMPOSITION, RESIN SHEET, PREPREG AND LAMINATE SHEET</title><author>ITO GEN ; WAKIGUCHI KEITA ; NISHIYAMA TOMOO ; TAKASE YUJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2015189884A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2015</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>ITO GEN</creatorcontrib><creatorcontrib>WAKIGUCHI KEITA</creatorcontrib><creatorcontrib>NISHIYAMA TOMOO</creatorcontrib><creatorcontrib>TAKASE YUJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ITO GEN</au><au>WAKIGUCHI KEITA</au><au>NISHIYAMA TOMOO</au><au>TAKASE YUJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>THERMOSETTING RESIN COMPOSITION, RESIN SHEET, PREPREG AND LAMINATE SHEET</title><date>2015-11-02</date><risdate>2015</risdate><abstract>PROBLEM TO BE SOLVED: To provide a resin composition high in heat-conductivity and excellent in insulation properties at high temperature, a resin sheet, a prepreg and a laminate sheet.SOLUTION: There is provided a thermosetting resin composition containing: a polyfunctional epoxy resin monomer; a polyfunctional amine compound; an inorganic filler (A) which is an aggregate of primary particles and has an average particle diameter d1 of 10 μm to 70 μm; and an inorganic filler (B) containing an inorganic filler(b) having an average particle diameter d3 of particle unit of 1 μm or more and less than 10 μm and an inorganic filler (c) having an average particle diameter d4 of 0.1 μm or more and less than 1 μm. A volume ratio of the (b) : the (c) is 90:10 to 70:30. A percentage content of the (A) to a total solid content is 10 to 55 vol.%, and a percentage content of (B) to the total solid content is 10 to 55 vol.%. The total percentage content of the (A) and the (B) is 30 to 80 vol.%. 【課題】熱伝導率が高く、且つ高温時の絶縁性に優れる樹脂組成物、樹脂シート、プリプレグ及び積層板を提供する。【解決手段】多官能エポキシ樹脂モノマーと、多官能アミン化合物と、一次粒子の凝集体であって平均粒径ｄ１が１０μｍ以上７０μｍ以下の無機充填材（Ａ）と、粒子単体の平均粒径ｄ３が１μｍ以上１０μｍ未満の無機充填材（ｂ）及び平均粒径ｄ４が０．１μｍ以上１μｍ未満の無機充填材（ｃ）を含む無機充填材（Ｂ）と、を含み、上記（ｂ）と（ｃ）との体積比が９０：１０〜７０：３０であり、総固形分に対して、上記（Ａ）の含有率が１０〜５５体積％であり、上記（Ｂ）の含有率が１０〜５５体積％であり、上記（Ａ）及び（Ｂ）の総含有率が３０〜８０体積％である熱硬化性樹脂組成物を提供する。【選択図】なし</abstract><oa>free_for_read</oa></addata></record>
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recordid	cdi_epo_espacenet_JP2015189884A
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subjects	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
title	THERMOSETTING RESIN COMPOSITION, RESIN SHEET, PREPREG AND LAMINATE SHEET
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