LIQUID RESIN COMPOSITION FOR ELECTRONIC COMPONENTS, AND ELECTRONIC PART DEVICE

PROBLEM TO BE SOLVED: To provide a liquid resin composition for electronic components that has excellent flowability in a narrow gap, and is suppressed in voids, bleeding and creeping, and an electronic part device sealed thereby.SOLUTION: A liquid resin composition for electronic components accordi...

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Bibliographische Detailangaben
Hauptverfasser:	TAKAHASHI TOSHITAKA, DEGUCHI OUSHI, AKAGI SEIICHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a liquid resin composition for electronic components that has excellent flowability in a narrow gap, and is suppressed in voids, bleeding and creeping, and an electronic part device sealed thereby.SOLUTION: A liquid resin composition for electronic components according to the present invention comprises (A) resin, (B) inorganic filler, (C) and inorganic filler having a peak of 100 nm or less, preferably 50 nm or less, in a laser diffraction method, with the total content of the (B) inorganic filler and (C) inorganic filler is 67-77 mass% of the whole liquid resin composition for electronic components. 【課題】狭ギャップでの流動性が良好であり、ボイド、ブリード及びクリーピングを抑制した電子部品用液状樹脂組成物、及びこれにより封止された電子部品装置を提供する。【解決する手段】本発明の電子部品用液状樹脂組成物は、（Ａ）樹脂と（Ｂ）無機充填材と（Ｃ）レーザー回折法で１００ｎｍ以下、好ましくは５０ｎｍ以下のピークを有する無機充填材を含み、（Ｂ）無機充填材と（Ｃ）無機充填材を合わせた無機充填材の含有量が前記電子部品用液状樹脂組成物全体の６７〜７７質量％である。【選択図】なし